Nanowire-based gas sensors X Chen, CKY Wong, CA Yuan, G Zhang Sensors and Actuators B: Chemical 177, 178-195, 2013 | 452 | 2013 |
An overview of solder bump shape prediction algorithms with validations KN Chiang, CA Yuan IEEE transactions on advanced packaging 24 (2), 158-162, 2001 | 160 | 2001 |
Molecular modeling of temperature dependence of solubility parameters for amorphous polymers X Chen, C Yuan, CKY Wong, G Zhang Journal of molecular modeling 18, 2333-2341, 2012 | 92 | 2012 |
An accelerated test method of luminous flux depreciation for LED luminaires and lamps C Qian, XJ Fan, JJ Fan, CA Yuan, GQ Zhang Reliability Engineering & System Safety 147, 84-92, 2016 | 73 | 2016 |
Impact of the functional group on the working range of polyaniline as carbon dioxide sensors X Chen, CKY Wong, CA Yuan, G Zhang Sensors and Actuators B: Chemical 175, 15-21, 2012 | 67 | 2012 |
Product level accelerated lifetime test for indoor LED luminaires S Koh, C Yuan, B Sun, B Li, X Fan, GQ Zhang 2013 14th International Conference on Thermal, Mechanical and Multi-Physics …, 2013 | 55 | 2013 |
Thermal and mechanical effects of voids within flip chip soldering in LED packages Y Liu, SYY Leung, J Zhao, CKY Wong, CA Yuan, G Zhang, F Sun, L Luo Microelectronics Reliability 54 (9-10), 2028-2033, 2014 | 50 | 2014 |
3D electronic packaging structure having a conductive support substrate MC Yew, CA Yuan, CY Chou, KN Chiang US Patent 7,884,464, 2011 | 50 | 2011 |
Molecular modeling of protonic acid doping of emeraldine base polyaniline for chemical sensors X Chen, CA Yuan, CKY Wong, H Ye, SYY Leung, G Zhang Sensors and Actuators B: Chemical 174, 210-216, 2012 | 45 | 2012 |
Electrical–thermal–luminous–chromatic model of phosphor-converted white light-emitting diodes H Ye, SW Koh, C Yuan, H van Zeijl, AWJ Gielen, SWR Lee, G Zhang Applied Thermal Engineering 63 (2), 588-597, 2014 | 44 | 2014 |
Validation of forcefields in predicting the physical and thermophysical properties of emeraldine base polyaniline XP Chen, CA Yuan, CKY Wong, SW Koh, GQ Zhang Molecular Simulation 37 (12), 990-996, 2011 | 42 | 2011 |
Miniaturized particulate matter sensor for portable air quality monitoring devices X Li, E Iervolino, F Santagata, J Wei, CA Yuan, PM Sarro, GQ Zhang SENSORS, 2014 IEEE, 2151-2154, 2014 | 41 | 2014 |
Accelerated testing method of LED luminaries M Cai, DG Yang, S Koh, CA Yuan, WB Chen, BY Wu, GQ Zhang 2012 13th International Thermal, Mechanical and Multi-Physics Simulation and …, 2012 | 31 | 2012 |
Design, analysis, and development of novel three-dimensional stacking WLCSP CA Yuan, CN Han, MC Yew, CY Chou, KN Chiang IEEE transactions on advanced packaging 28 (3), 387-396, 2005 | 30 | 2005 |
Chip-on-flexible packaging for high-power flip-chip light-emitting diode by AuSn and SAC soldering Y Liu, J Zhao, CCA Yuan, GQ Zhang, F Sun IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 27 | 2014 |
Molecular model for the charge carrier density dependence of conductivity of polyaniline as chemical sensing materials X Chen, L Shen, CA Yuan, CKY Wong, G Zhang Sensors and Actuators B: Chemical 177, 856-861, 2013 | 26 | 2013 |
A degradation model of aluminum electrolytic capacitors for LED drivers B Sun, X Fan, CA Yuan, C Qian, G Zhang 2015 16th International Conference on Thermal, Mechanical and Multi-Physics …, 2015 | 23 | 2015 |
Chemical–mechanical relationship of amorphous/porous low-dielectric film materials CA Yuan, O van der Sluis, GQ Zhang, LJ Ernst, WD van Driel, ... Computational Materials Science 42 (4), 606-613, 2008 | 23 | 2008 |
Prediction of the bulk elastic constant of metals using atomic-level single-lattice analytical method KN Chiang, CY Chou, CJ Wu, CA Yuan Applied Physics Letters 88 (17), 2006 | 23 | 2006 |
Mechanical reliability challenges for MEMS packages: Capping WD van Driel, DG Yang, CA Yuan, M Van Kleef, GQ Zhang Microelectronics Reliability 47 (9-11), 1823-1826, 2007 | 22 | 2007 |