Frank Niklaus

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Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, Sweden在 ee.kth.se 的电子邮件经过验证
Andreas C FischerPh.D. from KTH Royal Institute of Technology in Stockholm, Sweden在 ee.kth.se 的电子邮件经过验证
Niclas RoxhedAssistant Professor, KTH Royal Institute of Technology在 ee.kth.se 的电子邮件经过验证
Kristinn B. GylfasonProfessor, Micro and Nanosystems, KTH Royal Institute of Technology在 kth.se 的电子邮件经过验证
Fredrik ForsbergKTH Royal Institute of Technology在 ee.kth.se 的电子邮件经过验证
Max C. LemmeProfessor, RWTH Aachen University, Germany, Director, AMO GmbH在 eld.rwth-aachen.de 的电子邮件经过验证
Simon J. BleikerPhD Student in Micro and Nanosystmes, KTH Royal Institute of Technology在 kth.se 的电子邮件经过验证
Stephan SchröderSenseair在 senseair.com 的电子邮件经过验证
Anderson David SmithAssociate Professor, Chalmers University of Technology在 kth.se 的电子邮件经过验证
Mikael ÖstlingKTH Royal Institute of Technology在 kth.se 的电子邮件经过验证
Xuge FanKTH Royal Institute of Technology在 kth.se 的电子邮件经过验证
Pierre EdingerPostdoctoral researcher, KTH Royal Institute of Technology在 kth.se 的电子邮件经过验证
Wim BogaertsGhent University在 ugent.be 的电子邮件经过验证
Peter Verheyen在 imec.be 的电子邮件经过验证
Niels QuackThe University of Sydney在 sydney.edu.au 的电子邮件经过验证
Alain Yuji TakabayashiEnlightra在 enlightra.com 的电子邮件经过验证
tommy haraldssonCTO Mercene Labs在 kth.se 的电子邮件经过验证
Carlos Errando-HerranzTU Delft在 tudelft.nl 的电子邮件经过验证
Georg S. DuesbergChair of Sensortechnology , Universität der Bundeswehr, Munich在 unibw.de 的电子邮件经过验证
Anna DelinProfessor of Computational Nanomagnetism, KTH, Stockholm在 kth.se 的电子邮件经过验证

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Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden

在 kth.se 的电子邮件经过验证 - 首页

MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing


标题按引用次数排序按年份排序按标题排序	引用次数引用次数	年份
Handbook of Silicon Based MEMS Materials and Technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015	749*	2015
Adhesive wafer bonding F Niklaus, G Stemme, JQ Lu, RJ Gutmann Journal of applied physics 99 (3), 2006	694	2006
MEMS-based uncooled infrared bolometer arrays: a review F Niklaus, C Vieider, H Jakobsen MEMS/MOEMS technologies and applications III 6836, 125-139, 2008	468*	2008
Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013	439	2013
Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015	352	2015
Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 15005, 2015	341	2015
Low-temperature full wafer adhesive bonding F Niklaus, P Enoksson, E Kälvesten, G Stemme Journal of Micromechanics and Microengineering 11 (2), 100, 2001	324	2001
Method of joining components E Kälvesten, G Stemme, F Niklaus US Patent 7,067,345, 2006	262	2006
Sealing of adhesive bonded devices on wafer level J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004	185	2004
Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012	175	2012
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001	166	2001
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS M Lapisa, G Stemme, F Niklaus IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011	165	2011
Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ... Analytical chemistry 91 (2), 1578-1586, 2018	163	2018
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding A Quellmalz, X Wang, S Sawallich, B Uzlu, M Otto, S Wagner, Z Wang, ... Nature communications 12 (1), 917, 2021	159	2021
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016	149	2016
Nanoelectromechanical sensors based on suspended 2D materials MC Lemme, S Wagner, K Lee, X Fan, GJ Verbiest, S Wittmann, S Lukas, ... Research, 2020	143	2020
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 105 (3), 297-304, 2003	142	2003
Low temperature full wafer adhesive bonding of structured wafers F Niklaus, H Andersson, P Enoksson, G Stemme Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001	139	2001
Encyclopedia of sensors CA Grimes, EC Dickey, MV Pishko, RA Marcus (No Title), 2006	132	2006
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure F Niklaus, A Decharat, C Jansson, G Stemme Infrared Physics & Technology 51 (3), 168-177, 2008	115	2008

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