| Scalable design methodology and online algorithm for TSV-cluster defects recovery in highly reliable 3D-NoC systems KN Dang, AB Ahmed, Y Okuyama, AB Abdallah IEEE Transactions on Emerging Topics in Computing 8 (3), 577 - 590, 2020 | 39 | 2020 |
| On the design of a fault-tolerant scalable three dimensional NoC-based digital neuromorphic system with on-chip learning OM Ikechukwu, KN Dang, AB Abdallah IEEE Access 9, 64331-64345, 2021 | 32 | 2021 |
| A low-overhead soft–hard fault-tolerant architecture, design and management scheme for reliable high-performance many-core 3D-NoC systems KN Dang, M Meyer, Y Okuyama, AB Abdallah The Journal of Supercomputing 73, 2705-2729, 2017 | 28 | 2017 |
| Toward Robust Cognitive 3D Brain-Inspired Cross-Paradigm System A Ben Abdallah, KN Dang Frontiers in Neuroscience, 795, 2021 | 25 | 2021 |
| TSV-OCT: A Scalable Online Multiple-TSV Defects Localization for Real-Time 3-D-IC systems KN Dang, AB Ahmed, AB Abdallah, XT Tran IEEE Transactions on Very Large Scale Integration (VLSI) Systems, 2019 | 22 | 2019 |
| A Soft-Error Resilient 3D Network-on-Chip Router KN Dang, M Meyer, Y Okuyama, XT Tran, AB Abdallah IEEE 7th International Conference on Awareness Science and Technology, 2015 | 21 | 2015 |
| A Comprehensive Reliability Assessment of Fault-Resilient Network-on-Chip Using Analytical Model KN Dang, AB Ahmed, XT Tran, Y Okuyama, AB Abdallah IEEE Transactions on Very Large Scale Integration (VLSI) Systems 25 (11 …, 2017 | 17 | 2017 |
| MigSpike: A migration based algorithms and architecture for scalable robust neuromorphic systems KN Dang, NAV Doan, AB Abdallah IEEE Transactions on Emerging Topics in Computing 10 (2), 602-617, 2021 | 15 | 2021 |
| Reliability assessment and quantitative evaluation of soft-error resilient 3D network-on-chip systems KN Dang, M Meyer, Y Okuyama, AB Abdallah 2016 IEEE 25th Asian Test Symposium (ATS), 161-166, 2016 | 15 | 2016 |
| Neuromorphic computing principles and organization AB Abdallah, KN Dang Springer, 2022 | 14 | 2022 |
| Parity-based ECC and Mechanism for Detecting and Correcting Soft Errors in On-Chip Communication KN Dang, XT Tran 2018 IEEE 12th International Symposium on Embedded Multicore/Many-core …, 2018 | 14 | 2018 |
| FPGA implementation of a low latency and high throughput network-on-chip router architecture NK Dang, VTV Le, XT Tran | 14 | 2011 |
| Light-weight spiking neuron processing core for large-scale 3D-NoC based spiking neural network processing systems M Ogbodo, T Vu, K Dang, A Abdallah 2020 IEEE international conference on big data and smart computing (BigComp …, 2020 | 13 | 2020 |
| Fault-tolerant spiking neural network mapping algorithm and architecture to 3D-NoC-based neuromorphic systems WY Yerima, OM Ikechukwu, KN Dang, AB Abdallah IEEE Access 11, 52429-52443, 2023 | 12 | 2023 |
| TSV-IaS: Analytic Analysis and Low-Cost Non-Preemptive on-Line Detection and Correction Method for TSV Defects KN Dang, AB Ahmed, BA Abderrazak, XT Tran Proc. IEEE Computer Society Annual Symp. VLSI (ISVLSI), 501--506, 2019 | 12 | 2019 |
| Hotcluster: a thermal-aware defect recovery method for through-silicon-vias toward reliable 3-d ics systems KN Dang, AB Ahmed, AB Abdallah, XT Tran IEEE Transactions on Computer-Aided Design of Integrated Circuits and …, 2021 | 11 | 2021 |
| An Efficient Software-Hardware Design Framework for Spiking Neural Network Systems KN Dang, AB Abdallah The International Conference on Internet of Things, Embedded Systems and …, 2019 | 10 | 2019 |
| Real-time uav attitude heading reference system using extended kalman filter for programmable soc S Mie, Y Okuyama, Y Sato, Y Chan, NK Dang, BA Abderazek 2017 IEEE 11th International Symposium on Embedded Multicore/Many-core …, 2017 | 9 | 2017 |
| A low-power, high-accuracy with fully on-chip ternary weight hardware architecture for Deep Spiking Neural Networks DA Nguyen, XT Tran, KN Dang, F Iacopi Microprocessors and Microsystems, 2022 | 8 | 2022 |
| A thermal-aware on-line fault tolerance method for TSV lifetime reliability in 3D-NoC systems KN Dang, AB Ahmed, AB Abdallah, XT Tran IEEE Access 8, 166642-166657, 2020 | 8 | 2020 |
Abderazek Ben AbdallahSchool of Computer Science and Engineering, University of AizuEmail được xác minh tại u-aizu.ac.jp