Các bài viết có thể truy cập công khai - Gerhard DehmTìm hiểu thêm
Không có ở bất kỳ nơi nào: 41
Micro-compression testing: A critical discussion of experimental constraints
D Kiener, C Motz, G Dehm
Materials Science and Engineering: A 505 (1-2), 79-87, 2009
Các cơ quan ủy nhiệm: Austrian Science Fund
Adhesion energies of Cr thin films on polyimide determined from buckling: Experiment and model
MJ Cordill, FD Fischer, FG Rammerstorfer, G Dehm
Acta materialia 58 (16), 5520-5531, 2010
Các cơ quan ủy nhiệm: Austrian Science Fund
Nanometer-scaled lamellar microstructures in Ti–45Al–7.5 Nb–(0; 0.5) C alloys and their influence on hardness
L Cha, C Scheu, H Clemens, HF Chladil, G Dehm, R Gerling, A Bartels
Intermetallics 16 (7), 868-875, 2008
Các cơ quan ủy nhiệm: German Research Foundation
Microscale fracture behavior of single crystal silicon beams at elevated temperatures
BN Jaya, JM Wheeler, J Wehrs, JP Best, R Soler, J Michler, ...
Nano letters 16 (12), 7597-7603, 2016
Các cơ quan ủy nhiệm: Swiss National Science Foundation
Dislocation interaction and twinning-induced plasticity in face-centered cubic Fe-Mn-C micro-pillars
WS Choi, S Sandlöbes, NV Malyar, C Kirchlechner, S Korte-Kerzel, ...
Acta Materialia 132, 162-173, 2017
Các cơ quan ủy nhiệm: German Research Foundation
Dislocation storage in single slip-oriented Cu micro-tensile samples: new insights via X-ray microdiffraction
C Kirchlechner, D Kiener, C Motz, S Labat, N Vaxelaire, O Perroud, ...
Philosophical Magazine 91 (7-9), 1256-1264, 2011
Các cơ quan ủy nhiệm: Austrian Science Fund
Deformation mechanisms in micron-sized PST TiAl compression samples: Experiment and model
M Rester, FD Fischer, C Kirchlechner, T Schmölzer, H Clemens, G Dehm
Acta materialia 59 (9), 3410-3421, 2011
Các cơ quan ủy nhiệm: Austrian Science Fund
Dislocation dynamics in sub-micron confinement: recent progress in Cu thin film plasticity
G Dehm, T John Balk, B Blanckenhagen, P Gumbsch, E Arzt
International Journal of Materials Research 93 (5), 383-391, 2022
Các cơ quan ủy nhiệm: German Research Foundation
Reducing cohesion of metal powders for additive manufacturing by nanoparticle dry-coating
E Gärtner, HY Jung, NJ Peter, G Dehm, EA Jägle, V Uhlenwinkel, ...
Powder Technology 379, 585-595, 2021
Các cơ quan ủy nhiệm: German Research Foundation
Fracture toughness of Mo2BC thin films: Intrinsic toughness versus system toughening
R Soler, S Gleich, C Kirchlechner, C Scheu, JM Schneider, G Dehm
Materials & Design 154, 20-27, 2018
Các cơ quan ủy nhiệm: German Research Foundation
Bonding at copper–alumina interfaces established by different surface treatments: a critical review
C Scheu, M Gao, SH Oh, G Dehm, S Klein, AP Tomsia, M Rühle
Journal of materials science 41, 5161-5168, 2006
Các cơ quan ủy nhiệm: German Research Foundation
Dispersion strengthening of copper alloys
C Sauer, T Weißgärber, G Dehm, J Mayer, W Püsche, B Kieback
International Journal of Materials Research 89 (2), 119-125, 2021
Các cơ quan ủy nhiệm: German Research Foundation
Strain rate dependent deformation behavior of BCC-structured Ti29Zr24Nb23Hf24 high entropy alloy at elevated temperatures
T Cao, W Guo, W Lu, Y Xue, W Lu, J Su, CH Liebscher, C Li, G Dehm
Journal of Alloys and Compounds 891, 161859, 2022
Các cơ quan ủy nhiệm: German Research Foundation
Importance of dislocation pile-ups on the mechanical properties and the Bauschinger effect in microcantilevers
MW Kapp, C Kirchlechner, R Pippan, G Dehm
Journal of Materials Research 30 (6), 791-797, 2015
Các cơ quan ủy nhiệm: Austrian Science Fund
Combinatorial exploration of B2/L21 precipitation strengthened AlCrFeNiTi compositionally complex alloys
S Wolff-Goodrich, A Marshal, KG Pradeep, G Dehm, JM Schneider, ...
Journal of Alloys and Compounds 853, 156111, 2021
Các cơ quan ủy nhiệm: German Research Foundation
Coccospheres confer mechanical protection: New evidence for an old hypothesis
BN Jaya, R Hoffmann, C Kirchlechner, G Dehm, C Scheu, G Langer
Acta Biomaterialia 42, 258-264, 2016
Các cơ quan ủy nhiệm: UK Natural Environment Research Council
Obtaining different orientation relationships for Cu films grown on (0001) α-Al2O3 substrates by magnetron sputtering
G Dehm, H Edongué, T Wagner, SH Oh, E Arzt
International Journal of Materials Research 96 (3), 249-254, 2022
Các cơ quan ủy nhiệm: German Research Foundation
Study of nanometer-scaled lamellar microstructure in a Ti–45Al–7.5 Nb alloy–Experiments and modeling
FD Fischer, T Waitz, C Scheu, L Cha, G Dehm, T Antretter, H Clemens
Intermetallics 18 (4), 509-517, 2010
Các cơ quan ủy nhiệm: Austrian Science Fund
Interfacial fracture toughness of sintered hybrid silver interconnects
S Wang, C Kirchlechner, L Keer, G Dehm, Y Yao
Journal of Materials Science 55, 2891-2904, 2020
Các cơ quan ủy nhiệm: National Natural Science Foundation of China
On the limits of the interfacial yield model for fragmentation testing of brittle films on polymer substrates
AA Taylor, MJ Cordill, G Dehm
Philosophical Magazine 92 (25-27), 3363-3380, 2012
Các cơ quan ủy nhiệm: Austrian Science Fund
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