| Adhesion and debonding of multi-layer thin film structures RH Dauskardt, M Lane, Q Ma, N Krishna Engineering Fracture Mechanics 61 (1), 141-162, 1998 | 819 | 1998 |
| Relationship between interfacial adhesion and electromigration in Cu metallization MW Lane, EG Liniger, JR Lloyd Journal of Applied Physics 93 (3), 1417-1421, 2003 | 386 | 2003 |
| Silicon chip carrier with conductive through-vias and method for fabricating same DC Edelstein, PS Andry, LP Buchwalter, JA Casey, SA Goma, RR Horton, ... US Patent 7,276,787, 2007 | 269 | 2007 |
| Adhesion and reliability of copper interconnects with Ta and TaN barrier layers M Lane, RH Dauskardt, N Krishna, I Hashim Journal of Materials Research 15 (1), 203-211, 2000 | 238 | 2000 |
| Liner materials for direct electrodeposition of Cu MW Lane, CE Murray, FR McFeely, PM Vereecken, R Rosenberg Applied Physics Letters 83 (12), 2330-2332, 2003 | 234 | 2003 |
| Plasticity contributions to interface adhesion in thin-film interconnect structures M Lane, RH Dauskardt, A Vainchtein, H Gao Journal of materials research 15 (12), 2758-2769, 2000 | 228 | 2000 |
| Annealing-induced interfacial toughening using a molecular nanolayer DD Gandhi, M Lane, Y Zhou, AP Singh, S Nayak, U Tisch, M Eizenberg, ... Nature 447 (7142), 299-302, 2007 | 160 | 2007 |
| Self-assembled subnanolayers as interfacial adhesion enhancers and diffusion barriers for integrated circuits G Ramanath, G Cui, PG Ganesan, X Guo, AV Ellis, M Stukowski, ... Applied Physics Letters 83 (2), 383-385, 2003 | 141 | 2003 |
| Invited paper environmental effects on interfacial adhesion MW Lane, JM Snodgrass, R Dauskardt Microelectronics Reliability, 2001 | 137 | 2001 |
| Interface fracture M Lane Annual Review of Materials Research 33 (1), 29-54, 2003 | 136 | 2003 |
| Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures MW Lane, XH Liu, TM Shaw, MG Farooq, R Hannon, IDW Melville US Patent 7,955,955, 2011 | 110 | 2011 |
| Silicon chip carrier with conductive through-vias and method for fabricating same D Edelstein, P Andry, L Buchwalter, J Casey, S Goma, R Horton, ... US Patent App. 11/242,221, 2006 | 94 | 2006 |
| Electromigration and adhesion JR Lloyd, MW Lane, EG Liniger, CK Hu, TM Shaw, R Rosenberg IEEE Transactions on device and materials reliability 5 (1), 113-118, 2005 | 87 | 2005 |
| SiCOH dielectric material with improved toughness and improved Si-C bonding DC Edelstein, SM Gates, A Grill, M Lane, RD Miller, DA Neumayer, ... US Patent 7,892,648, 2011 | 78 | 2011 |
| Hardmask for reliability of silicon based dielectrics S Van Nguyen, M Lane, SM Gates, XH Liu, VJ McGahay, SC Mehta, ... US Patent 7,335,980, 2008 | 76 | 2008 |
| Environmental effects on cracking and delamination of dielectric films MW Lane, XH Liu, TM Shaw IEEE Transactions on Device and Materials Reliability 4 (2), 142-147, 2004 | 71 | 2004 |
| Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer LA Clevenger, SR Chiras, T Dalton, JJ Demarest, DN Dunn, ... US Patent 7,102,232, 2006 | 66 | 2006 |
| Chip-package-interaction modeling of ultra low-k/copper back end of line XH Liu, TM Shaw, MW Lane, EG Liniger, BW Herbst, DL Questad 2007 IEEE International Interconnect Technology Conferencee, 13-15, 2007 | 65 | 2007 |
| Interface engineering for high interfacial strength between SiCOH and porous SiCOH interconnect dielectrics and diffusion caps A Grill, D Edelstein, M Lane, V Patel, S Gates, D Restaino, S Molis Journal of Applied Physics 103 (5), 2008 | 58 | 2008 |
| Process of forming copper structures M Lane, FR McFeely, C Murray, R Rosenberg US Patent 6,812,143, 2004 | 57 | 2004 |