Rafting‐enabled recovery avoids recrystallization in 3D‐printing‐repaired single‐crystal superalloys K Chen, R Huang, Y Li, S Lin, W Zhu, N Tamura, J Li, ZW Shan, E Ma Advanced Materials 32 (12), 1907164, 2020 | 65 | 2020 |
Twin and dislocation induced grain subdivision and strengthening in laser shock peened Ti X Huang, W Zhu, K Chen, RL Narayan, U Ramamurty, L Zhou, W He International Journal of Plasticity 159, 103476, 2022 | 37 | 2022 |
Real-time microstructure imaging by Laue microdiffraction: A sample application in laser 3D printed Ni-based superalloys G Zhou, W Zhu, H Shen, Y Li, A Zhang, N Tamura, K Chen Scientific reports 6 (1), 28144, 2016 | 31 | 2016 |
Etching-assisted route to Heterophase Au nanowires with multiple types of active surface sites for Silane oxidation C Wang, X Li, L Jin, PH Lu, C Dejoie, W Zhu, Z Wang, W Bi, ... Nano letters 19 (9), 6363-6369, 2019 | 23 | 2019 |
Hardness and microstructural inhomogeneity at the epitaxial interface of laser 3D-printed Ni-based superalloy D Qian, A Zhang, J Zhu, Y Li, W Zhu, B Qi, N Tamura, D Li, Z Song, ... Applied Physics Letters 109 (10), 2016 | 23 | 2016 |
In situ synchrotron study of electromigration induced grain rotations in Sn solder joints H Shen, W Zhu, Y Li, N Tamura, K Chen Scientific reports 6 (1), 24418, 2016 | 22 | 2016 |
Quantitative scanning Laue diffraction microscopy: application to the study of 3D printed nickel-based superalloys G Zhou, J Kou, Y Li, W Zhu, K Chen, N Tamura Quantum beam science 2 (2), 13, 2018 | 17 | 2018 |
Contrastive studies between laser repairing and plasma arc repairing on single-crystal Ni-based superalloy C Wang, Q Li, X Zhou, W Zhu, R Huang, Z Pan, K Chen, C He Materials 12 (7), 1172, 2019 | 7 | 2019 |
Thermal stability of laser shock peening processed Ni-based superalloy DZ17G G Zhou, H Shen, W Zhu, N Tamura, K Chen, Y Zhang IOP Conference Series: Materials Science and Engineering 580 (1), 012059, 2019 | | 2019 |
In situ synchrotron study of electromigration induced grain rotation in anisotropic Sn solder joints H Shen, W Zhu, Y Li, N Tamura, K Chen | | |