| Reducing non-stick on pad for wire bond: A review RS Sethu Australian Journal of Mechanical Engineering 9 (2), 147-160, 2012 | 24 | 2012 |
| Characterization of copper precipitates on aluminum copper bond pads formed after plasma clean and de-ionized water exposure RS Sethu, HS Ng, A Chan, CN Ong, SF Chan Microelectronics Reliability 55 (7), 1101-1108, 2015 | 13 | 2015 |
| Reliability evaluation of tungsten donut-via as an element of the highly robust metallization V Hein, M Erstling, RS Sethu, K Weide-Zaage, T Bai Microelectronics Reliability 64, 259–265, 2016 | 12 | 2016 |
| Influence of Under Bump Metalization dimensions on passivation nitride stress RS Sethu, SH Kulkarni, HU Ha, KH Soon 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 10 | 2017 |
| Influence of intermetallic thickness and elastic modulus on passivation thermal stress RS Sethu, HU Ha, KH Soon 2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2017 | 10 | 2017 |
| Simulation investigations for the comparison of standard and highly robust AlCu thick metal tracks RS Sethu, V Hein, M Erstling, K Weide-Zaage 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 9 | 2017 |
| Impact of wire material and fluorine in dielectric on wire Pull Test stress RS Sethu, C Schirrmann, HU Ha, KH Soon 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 8 | 2017 |
| Numerical simulation of top metal thickness on IMD stress due to probing RS Sethu, L Bergmann, M Erstling, P Lammert, A Fahr, H Jayawardana 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 4 | 2019 |
| Wire pull FEA simulation comparison RS Sethu, SH Kulkami, HU Ha, KH Soon 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 4 | 2018 |
| Reduction of Thermal Stress-Part III: UBM and Passivation Thickness Optimization RS Sethu, SH Kulkarni, HU Ha, KH Soon International Symposium on Microelectronics 2017 (1), 000694-000698, 2017 | 4 | 2017 |
| Reduction of Thermal Stress-Part I: Passivation Thickness Optimization of Standard Surface Bump Design RS Sethu, SH Kulkarni, HU Ha, KH Soon International Symposium on Microelectronics 2017 (1), 000502-000507, 2017 | 4 | 2017 |
| Numerical simulation of thick metal passivation stress, Part II: Minimizing stress using Response Surface Methodology RS Sethu, D Kho, SH Kulkarni, HU Ha, KH Soon 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 147-150, 2017 | 4 | 2017 |
| Temperature cycle test study on thick metal passivation cracks HB Ahmataku, RS Sethu 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 252-255, 2017 | 4 | 2017 |
| A computational study of the effect of bond pad thickness on the polysilicon piezoresistivity due to wafer level probing SS Mane, RS Sethu, L Bergmann, M Erstling, KH Soon Microelectronics Reliability 100, 113333, 2019 | 3 | 2019 |
| Stress Effect of Wafer Fabrication BEOL Structures On Polysilicon: A Piezoeletric Phenomenon SS Mane, RS Sethu, L Bergmann, M Erstling, P Dimitrovici, A Fahr, ... 2019 IEEE 9th International Nanoelectronics Conferences (INEC), 1-4, 2019 | 3 | 2019 |
| Reduction of Thermal Stress-Part II: Passivation Thickness Optimization of FLATPV Surface Bump Design RS Sethu, SH Kulkarni, HU Ha, KH Soon International Symposium on Microelectronics 2017 (1), 000508-000512, 2017 | 3 | 2017 |
| Numerical simulation of thick metal passivation stress, Part I: Identification of stress source RS Sethu, D Kho, SH Kulkarni, HU Ha, KH Soon 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 143-146, 2017 | 3 | 2017 |
| Determination of BEOL Aluminum-Copper Constitutive Equation using FEA Simulation and Response Surface Methodology RS Sethu, H Jayawardana, KH Soon, AWY Chai 2019 20th International Conference on Thermal, Mechanical and Multi-Physics …, 2019 | 1 | 2019 |
| Thick metal flat passivation elastic modulus FEA simulation RS Sethu, K Sambhawam, Y Peng 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 1 | 2018 |
| Relating to passivation layers RS Sethu, P Yang, K Sambhawam US Patent 11,929,296, 2024 | | 2024 |
Kok Heng SoonSwinburne University of Technology SarawakEmail được xác minh tại swinburne.edu.my