| Microstructure and cyclic oxidation behavior of W–Cr alloys prepared by sintering of mechanically alloyed nanocrystalline powders S Telu, A Patra, M Sankaranarayana, R Mitra, SK Pabi International Journal of Refractory Metals and Hard Materials 36, 191-203, 2013 | 87 | 2013 |
| Effect of Y2O3 Addition on Oxidation Behavior of W-Cr Alloys S Telu, R Mitra, SK Pabi Metallurgical and Materials Transactions A 46, 5909-5919, 2015 | 42 | 2015 |
| Low temperature soldering using Sn-Bi alloys M Ribas, A Kumar, D Kosuri, RR Rangaraju, P Choudhury, S Telu, ... Proceedings of SMTA International 2017, 201-2016, 2017 | 31 | 2017 |
| High temperature oxidation behavior of W–Cr–Nb Alloys in the Temperature Range of 800–1200° C S Telu, R Mitra, SK Pabi International Journal of Refractory Metals and Hard Materials 38, 47-59, 2013 | 25 | 2013 |
| A novel method of reducing melting temperatures in SnAg and SnCu solder alloys RN Chukka, S Telu, B Nrmr, L Chen Journal of Materials Science: Materials in Electronics 22, 281-285, 2011 | 16 | 2011 |
| Densification and characterisation of W–Cr–Nb alloys prepared by sintering of mechanically alloyed nanocrystalline powders S Telu, R Mitra, SK Pabi Powder metallurgy 56 (1), 83-88, 2013 | 7 | 2013 |
| Non-Eutectic low melting temperature alloys for standard c-Si interconnection NS Pujari, S Telu, J Sundaramurthy, M Ribas, M Murphy 7th Workshop on Metallization and Interconnection for Crystalline Silicon …, 2017 | 4 | 2017 |
| Effect of 10 at.% Nb Addition on Sintering and High Temperature Oxidation of W0.5Cr0.5 Alloy S Telu, V Karthik, R Mitra, SK Pabi Materials Science Forum 710, 308-313, 2012 | 4 | 2012 |
| Low Temperature Soldering: Reflow Optimization for Enhanced Mechanical Reliability M Ribas, B Vangapandu, RR Rangaraju, S Telu, L Pai, R Kumar, V Patil, ... SMTA International, 14-18, 2018 | 2 | 2018 |
| High Temperature Oxidation Behavior of Tungsten Based Materials Processed by Powder Metallurgical Route S Telu Indian Institute of Technology Kharagpur, 2013 | 2 | 2013 |
| High Reliability Lead-free Alloys for Performance-Critical Applications P Choudhury, S Telu, A Kumar, M Ribas, S Sarkar 2018 7th Electronic System-Integration Technology Conference (ESTC), 1-7, 2018 | 1 | 2018 |
| Wafer level CSP with ultra-high thermal reliability lead-free alloys M Ribas, G Lim, RT Bumagat, A Kumar, D Kosuri, P Augustine, ... 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-6, 2015 | 1 | 2015 |
| High Thermo-Mechanical Fatigue and Drop Shock Resistant Alloys for Ball-Grid Array Package Applications M Ribas, S Telu, P Augustine, RR Rangaraju, A Kumar, D Kosuri, ... Proceedings of the SMTA International, 204-209, 0 | 1 | |
| High reliability lead-free solder alloy MDA Ribas, S Telu, P Choudhury, AKN Kumar, S Sarkar US Patent 10,821,557, 2020 | | 2020 |
Shyamal PabiMetallurgical and Materials EngineeringEmail được xác minh tại metal.iitkgp.ernet.in