| Investigating the thermomechanical properties and intermetallic layer formation of Bi micro-alloyed low-Ag content solders O Krammer, T Garami, B Horváth, T Hurtony, B Medgyes, L Jakab Journal of Alloys and Compounds 634, 156-162, 2015 | 42 | 2015 |
| Investigating the mechanical strength of vapor phase soldered chip components joints O Krammer, T Garami 2010 IEEE 16th International Symposium for Design and Technology in …, 2010 | 24 | 2010 |
| Comparing the intermetallic layer formation of Infrared and Vapour Phase soldering O Krammer, T Garami Proceedings of the 2011 34th International Spring Seminar on Electronics …, 2011 | 19 | 2011 |
| Quantitative analyses of Ag3Sn intermetallic compound formation in SnAgCu solder alloys T Garami, O Krammer Journal of Materials Science: Materials in Electronics 26, 8540-8547, 2015 | 16 | 2015 |
| Reliability investigation of low silver content micro-alloyed SAC solders O Krammer, T Garami 2012 35th International Spring Seminar on Electronics Technology, 149-154, 2012 | 15 | 2012 |
| Soldering tests with biodegradable printed circuit boards A Geczy, T Garami, B Kovacs, D Nagy, L Gal, M Ruszinko, I Hajdu 2013 IEEE 19th International Symposium for Design and Technology in …, 2013 | 11 | 2013 |
| Method for validating CT length measurement of cracks inside solder joints T Garami, O Krammer, G Harsányi, P Martinek Soldering & Surface Mount Technology 28 (1), 13-17, 2016 | 8 | 2016 |
| Investigating the mechanical effect of the solder joint thickness with simulation T Garami, O Krammer 2013 IEEE 19th International Symposium for Design and Technology in …, 2013 | 8 | 2013 |
| Reliability Investigation of SACX Micro-Alloyed, Low Silver Content Solders O Krammer, T Garami 35th International Spring Seminar on Electronics Technology-„Power …, 2012 | 8 | 2012 |
| Investigating micro-alloyed solders with thermal shock tests T Garami, O Krammer 2012 IEEE 18th International Symposium for Design and Technology in …, 2012 | 5 | 2012 |
| Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes B Illés, O Krammer, A Géczy, T Garami Soldering & Surface Mount Technology 28 (1), 2-6, 2016 | 3 | 2016 |
| Controlling the cooling rate of soldering processes with PIC microcontroller T Garami, N Réti, O Krammer Proceedings of the 2014 37th International Spring Seminar on Electronics …, 2014 | 2 | 2014 |
| The effect of cooling rate on the thermo-mechanical properties of micro-alloyed solders O Krammer, T Garami, Á Nagy 2016 39th International Spring Seminar on Electronics Technology (ISSE), 204-209, 2016 | | 2016 |
| Effect of solder joint volume on its shear fracture mode T Garami, O Krammer 2015 IEEE 21st International Symposium for Design and Technology in …, 2015 | | 2015 |
| Investigation of the pre-heating process during thermosonic wire bonding by FEM simulation T Garami, G Takács, O Krammer, A Szabó 2015 38th International Spring Seminar on Electronics Technology (ISSE), 333-338, 2015 | | 2015 |
| Quantitative analysis of Ag3Sn particle size in Sn3.5Ag solder alloy T Garami, O Krammer 2014 IEEE 20th International Symposium for Design and Technology in …, 2014 | | 2014 |
| Investigating micro-alloyed solder joints with electrochemical etching T Garami, O Krammer Proceedings of the 36th International Spring Seminar on Electronics …, 2013 | | 2013 |
