| Mechanical characterization of microconstituents in a cast duplex stainless steel by micropillar compression EY Guo, HX Xie, SS Singh, A Kirubanandham, T Jing, N Chawla Materials Science and Engineering: A 598, 98-105, 2014 | 67 | 2014 |
| Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression CS Kaira, SS Singh, A Kirubanandham, N Chawla Acta Materialia 120, 56-67, 2016 | 51 | 2016 |
| Stochastic multi-scale reconstruction of 3D microstructure consisting of polycrystalline grains and second-phase particles from 2D micrographs S Chen, A Kirubanandham, N Chawla, Y Jiao Metallurgical and Materials Transactions A 47, 1440-1450, 2016 | 47 | 2016 |
| Probing novel microstructural evolution mechanisms in aluminum alloys using 4D nanoscale characterization CS Kaira, V De Andrade, SS Singh, C Kantzos, A Kirubanandham, ... Advanced Materials 29 (41), 1703482, 2017 | 34 | 2017 |
| Electromigration mechanisms in Sn-0.7 Cu/Cu couples by four dimensional (4D) X-ray microtomography and electron backscatter diffraction (EBSD) JCE Mertens, A Kirubanandham, N Chawla Acta Materialia 102, 220-230, 2016 | 34 | 2016 |
| Mechanisms of thermal cycling damage in polycrystalline Sn-rich solder joints MB Kelly, A Kirubanandham, N Chawla Materials Science and Engineering: A 771, 138614, 2020 | 18 | 2020 |
| Nucleation and Growth of Tin Hillocks by In Situ Nanoindentation I Lujan-Regalado, A Kirubanandham, JJ Williams, N Chawla Journal of Electronic Materials 48, 58-71, 2019 | 11 | 2019 |
| Three Dimensional Characterization of Tin Crystallography and Cu6Sn5 Intermetallics in Solder Joints by Multiscale Tomography A Kirubanandham, I Lujan-Regalado, R Vallabhaneni, N Chawla Jom 68, 2879-2887, 2016 | 11 | 2016 |
| In situ fixture for multi-modal characterization during electromigration and thermal testing of wire-like microscale specimens JCE Mertens, A Kirubanandham, N Chawla Microelectronics Reliability 55 (11), 2345-2353, 2015 | 7 | 2015 |
| On Characterization of Mechanical Deformation in Flexible Electronic Structures A Kirubanandham, S Basu Keysight Technologies - Application Note - http://literature.cdn.keysight …, 2012 | 5 | 2012 |
| In situ Electromigration and Reliability of Pb-Free Solders At Extremely Small Length Scales A Kirubanandham Arizona State University, 2016 | | 2016 |
Sudhanshu Shekhar SinghIIT KanpurEmail được xác minh tại iitk.ac.in
