| Influence of Under Bump Metalization dimensions on passivation nitride stress RS Sethu, SH Kulkarni, HU Ha, KH Soon 2017 18th International Conference on Thermal, Mechanical and Multi-Physics …, 2017 | 10 | 2017 |
| Wire pull FEA simulation comparison RS Sethu, SH Kulkami, HU Ha, KH Soon 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018 | 4 | 2018 |
| Reduction of Thermal Stress-Part III: UBM and Passivation Thickness Optimization RS Sethu, SH Kulkarni, HU Ha, KH Soon International Symposium on Microelectronics 2017 (1), 000694-000698, 2017 | 4 | 2017 |
| Reduction of Thermal Stress-Part I: Passivation Thickness Optimization of Standard Surface Bump Design RS Sethu, SH Kulkarni, HU Ha, KH Soon International Symposium on Microelectronics 2017 (1), 000502-000507, 2017 | 4 | 2017 |
| Numerical simulation of thick metal passivation stress, Part II: Minimizing stress using Response Surface Methodology RS Sethu, D Kho, SH Kulkarni, HU Ha, KH Soon 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 147-150, 2017 | 4 | 2017 |
| Reduction of Thermal Stress-Part II: Passivation Thickness Optimization of FLATPV Surface Bump Design RS Sethu, SH Kulkarni, HU Ha, KH Soon International Symposium on Microelectronics 2017 (1), 000508-000512, 2017 | 3 | 2017 |
| Numerical simulation of thick metal passivation stress, Part I: Identification of stress source RS Sethu, D Kho, SH Kulkarni, HU Ha, KH Soon 2017 IEEE Regional Symposium on Micro and Nanoelectronics (RSM), 143-146, 2017 | 3 | 2017 |
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