| Fused-Silica Stitch-Chips with Compressible Microinterconnects for Embedded RF/mm-Wave Chiplets T Zheng, MS Bakir 2022 IEEE/MTT-S International Microwave Symposium-IMS 2022, 583-586, 2022 | 7 | 2022 |
| Electrical Characterization and Benchmarking of Polylithic Integration using Fused-Silica Stitch-Chips with Compressible Microinterconnects for RF/mm-Wave Applications T Zheng, PK Jo, SK Rajan, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 4 | 2021 |
| Polylithic Integration for RF/MM-Wave Chiplets using Stitch-Chips: Modeling, Fabrication, and Characterization T Zheng, PK Jo, SK Rajan, MS Bakir 2020 IEEE/MTT-S International Microwave Symposium (IMS), 1035-1038, 2020 | 4 | 2020 |
| Multi-Die Polylithic Integration Enabled by Heterogeneous Interconnect Stitching Technology (HIST) PK Jo, T Zheng, MS Bakir 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 4 | 2018 |
| Benchmarking Frequency-Dependent Parasitics of Fine-Pitch Off-Chip I/Os for 2.5 D and 3D Heterogeneous Integration T Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 3 | 2022 |
| A Die-Level, Replaceable Integrated Chiplet (PINCH) Assembly using a Socketed Platform, Compressible Microinterconnects, and Self-Alignment JL Gonzalez, JR Brescia, T Zheng, SK Rajan, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 3 | 2021 |
| Polylithic Integration of 2.5 D and 3D Chiplets using Interconnect Stitching PK Jo, T Zheng, MS Bakir 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1803-1808, 2019 | 2 | 2019 |
| A Novel Antenna using High Impedance Surface Resonance for THz Imaging and Sensing T Zheng, Y Liao, Y Zhu, X Ji 2016 IEEE MTT-S International Conference on Numerical Electromagnetic and …, 2016 | 2 | 2016 |
| Performance Evaluation of UCIe-based Die-to-Die Interface on Low-Cost 2D Packaging Technology S Penta, T Zheng, E Tremble, A Chakravarti, A Sigler, Z Zhang, C Benes, ... 2024 IEEE 74th Electronic Components and Technology Conference (ECTC), 274-278, 2024 | 1 | 2024 |
| Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips with Compressible Microinterconnects for RF/mm-Wave Chiplet Based Modules T Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 13 …, 2023 | 1 | 2023 |
| Electrical Demonstration of an RF Embedded Multi-Chip Module Enabled by Fused-Silica Stitch-Chip Technology T Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology, 2024 | | 2024 |
| Electrical Characterization of Shielded TSVs with Airgap Isolation for RF/mmWave Applications S Oh, T Zheng, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024 | | 2024 |
| Embedded mm-Wave Chiplet Based Module using Fused-Silica Stitch-Chip Technology: RF Characterization and Thermal Evaluation T Zheng, M Manley, M Bakir 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1493-1498, 2023 | | 2023 |
| Replaceable Integrated Chiplet (PINCH) Assembly for Heterogeneous Integration JR Brescia, JL Gonzalez, T Zheng, MS Bakir Government Microcircuit Applications & Critical Technology Conf., 2022 | | 2022 |
| Polylithic Integrated Circuits using 2.5 D and 3D Heterogeneous Integration: Electrical and Thermal Design Considerations and Demonstrations T Zheng, A Kaul, S Kochupurackal Rajan, MS Bakir Embedded and Fan‐Out Wafer and Panel Level Packaging Technologies for …, 2022 | | 2022 |
| Interposer and Advanced Packaging Enabled by Ultra-Dense Microdiamond Composites for RF/mm-wave Applications Y Wang, C Swank, T Zheng, JF Buckwalter, A Kummel, M Rodwell, ... TECHCON 2021, 2021 | | 2021 |
| Package Testing using a Socketed Heterogeneous 2.5D/3D Integration Module (SHIM) for mm-wave Applications JL Gonzalez, T Zheng, S Kochupurackal Rajan, MS Bakir 2020 GOMAC-Tech – Government Microcircuit Applications and Critical …, 2020 | | 2020 |
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