| Ferroelectric materials for microwave tunable applications AK Tagantsev, VO Sherman, KF Astafiev, J Venkatesh, N Setter Journal of electroceramics 11, 5-66, 2003 | 1725 | 2003 |
| Design issues and considerations for low-cost 3-D TSV IC technology G Van der Plas, P Limaye, I Loi, A Mercha, H Oprins, C Torregiani, S Thijs, ... IEEE Journal of Solid-State Circuits 46 (1), 293-307, 2010 | 400 | 2010 |
| Ferroelectric-dielectric tunable composites VO Sherman, AK Tagantsev, N Setter, D Iddles, T Price Journal of applied physics 99 (7), 2006 | 197 | 2006 |
| Relaxor ferroelectricity in strained epitaxial SrTiO3 thin films on DyScO3 substrates MD Biegalski, Y Jia, DG Schlom, S Trolier-McKinstry, SK Streiffer, ... Applied physics letters 88 (19), 2006 | 127 | 2006 |
| Tuning of direct current bias-induced resonances in micromachined Ba0. 3Sr0. 7TiO3 thin-film capacitors A Noeth, T Yamada, VO Sherman, P Muralt, AK Tagantsev, N Setter Journal of Applied Physics 102 (11), 2007 | 76 | 2007 |
| High-efficiency polymer-based direct multi-jet impingement cooling solution for high-power devices T Wei, H Oprins, V Cherman, J Qian, I De Wolf, E Beyne, M Baelmans IEEE Transactions on Power Electronics 34 (7), 6601-6612, 2018 | 75 | 2018 |
| Effects of glass additions on the microstructure and dielectric properties of barium strontium titanate (BST) ceramics D Zhang, TW Button, VO Sherman, AK Tagantsev, T Price, D Iddles Journal of the European Ceramic Society 30 (2), 407-412, 2010 | 67 | 2010 |
| Synthesis and dielectric characterization of potassium niobate tantalate ceramics J Venkatesh, V Sherman, N Setter Journal of the American Ceramic Society 88 (12), 3397-3404, 2005 | 56 | 2005 |
| Digital reflection-type phase shifter based on a ferroelectric planar capacitor V Sherman, K Astafiev, N Setter, A Tagantsev, O Vendik, I Vendik, ... IEEE microwave and wireless components letters 11 (10), 407-409, 2001 | 56 | 2001 |
| Can the addition of a dielectric improve the figure of merit of a tunable material? KF Astafiev, VO Sherman, AK Tagantsev, N Setter Journal of the European Ceramic Society 23 (14), 2381-2386, 2003 | 53 | 2003 |
| Epitaxial∕ amorphous Ba0. 3Sr0. 7TiO3 film composite structure for tunable applications T Yamada, VO Sherman, A Nöth, P Muralt, AK Tagantsev, N Setter Applied physics letters 89 (3), 2006 | 49 | 2006 |
| In-depth Raman spectroscopy analysis of various parameters affecting the mechanical stress near the surface and bulk of Cu-TSVs I De Wolf, V Simons, V Cherman, R Labie, B Vandevelde, E Beyne 2012 IEEE 62nd Electronic Components and Technology Conference, 331-337, 2012 | 48 | 2012 |
| Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip TW Wei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ... Applied thermal engineering 152, 308-318, 2019 | 47 | 2019 |
| Strain relaxation of epitaxial SrTiO3 thin films on LaAlO3 by two-step growth technique T Yamada, KF Astafiev, VO Sherman, AK Tagantsev, P Muralt, N Setter Applied Physics Letters 86 (14), 2005 | 47 | 2005 |
| High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler T Tiwei, H Oprins, V Cherman, G Van der Plas, I De Wolf, E Beyne, ... 2017 IEEE International Electron Devices Meeting (IEDM), 32.5. 1-32.5. 4, 2017 | 46 | 2017 |
| Experimental and numerical investigation of direct liquid jet impinging cooling using 3D printed manifolds on lidded and lidless packages for 2.5 D integrated systems TW Wei, H Oprins, V Cherman, E Beyne, M Baelmans Applied Thermal Engineering 164, 114535, 2020 | 44 | 2020 |
| Model of a low-permittivity and high-tunability ferroelectric based composite VO Sherman, AK Tagantsev, N Setter Applied physics letters 90 (16), 2007 | 44 | 2007 |
| Reliability challenges related to TSV integration and 3D stacking K Croes, J De Messemaeker, Y Li, W Guo, O Pedreira, V Cherman, ... IEEE Design & Test of Computers, 1-1, 2016 | 42 | 2016 |
| MEMS packaging and reliability: An undividable couple HAC Tilmans, J De Coster, P Helin, V Cherman, A Jourdain, P De Moor, ... Microelectronics Reliability 52 (9-10), 2228-2234, 2012 | 42 | 2012 |
| Numerical and experimental characterization of the thermal behavior of a packaged DRAM-on-logic stack H Oprins, VO Cherman, B Vandevelde, G Van der Plas, P Marchal, ... 2012 IEEE 62nd Electronic Components and Technology Conference, 1081-1088, 2012 | 42 | 2012 |