| Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration YA Shen, C Chen Scripta Materialia 128, 6-9, 2017 | 93 | 2017 |
| Sn-3.0 Ag-0.5 Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology YA Shen, S Zhou, J Li, C Yang, S Huang, S Lin, H Nishikawa Materials & design 183, 108144, 2019 | 84 | 2019 |
| Thermomigration induced microstructure and property changes in Sn-58Bi solders YA Shen, S Zhou, J Li, KN Tu, H Nishikawa Materials & Design 166, 107619, 2019 | 48 | 2019 |
| The newly developed Sn-Bi-Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength Shiqi Zhou, Chih-hanYang, Yu-An Shen, Shih-kang Lin, Hiroshi Nishikawa Materialia, 2019 | 43 | 2019 |
| Investigation of FeCoNiCu properties: Thermal stability, corrosion behavior, wettability with Sn-3.0 Ag-0.5 Cu and interlayer formation of multi-element intermetallic compound YA Shen, HM Hsieh, SH Chen, J Li, SW Chen, H Nishikawa Applied Surface Science 546, 148931, 2021 | 32 | 2021 |
| Interfacial transformation of preoxidized Cu microparticles in a formic-acid atmosphere for pressureless Cu–Cu bonding R Gao, S He, J Li, YA Shen, H Nishikawa Journal of Materials Science: Materials in Electronics 31, 14635-14644, 2020 | 30 | 2020 |
| Effect of Sn grain orientation on growth of Cu-Sn intermetallic compounds during thermomigration in Cu-Sn2. 3Ag-Ni microbumps YA Shen, FY Ouyang, C Chen Materials Letters 236, 190-193, 2019 | 30 | 2019 |
| Effect of Substrates on Fracture Mechanism and Process Optimization of Oxidation–Reduction Bonding with Copper Microparticles R Gao, S He, YA Shen, H Nishikawa Journal of Electronic Materials 48 (2263–227), 1-9, 2019 | 29 | 2019 |
| Extremely thin interlayer of multi-element intermetallic compound between Sn-based solders and FeCoNiMn high-entropy alloy YA Shen, SW Chen, HZ Chen, CM Chang, YH Ouyang Applied Surface Science 558, 149945, 2021 | 28 | 2021 |
| In-situ observation of fluxless soldering of Sn-3.0 Ag-0.5 Cu/Cu under a formic acid atmosphere S He, R Gao, J Li, YA Shen, H Nishikawa Materials Chemistry and Physics 239, 122309, 2020 | 28 | 2020 |
| Effect of Cu addition on the microstructure and mechanical properties of In–Sn-based low-temperature alloy D Le Han, YA Shen, S He, H Nishikawa Materials Science and Engineering: A 804, 140785, 2021 | 26 | 2021 |
| Graphene as a diffusion barrier at the interface of Liquid–State low-melting Sn–58Bi alloy and copper foil YA Shen, HZ Chen, SW Chen, SK Chiu, XY Guo, YP Hsieh Applied Surface Science 578, 152108, 2022 | 25 | 2022 |
| Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy S. Zhou, YA Shen, T Uresti, VC Shunmugasamy, B. Mansoor, H. Nishikawa Journal of Materials Science: Materials in Electronics, 2019 | 24 | 2019 |
| Wettability, interfacial reactions, and impact strength of Sn–3.0 Ag–0.5 Cu solder/ENIG substrate used for fluxless soldering under formic acid atmosphere S He, R Gao, YA Shen, J Li, H Nishikawa Journal of Materials Science 55, 3107-3117, 2020 | 23 | 2020 |
| Electrodeposition of twinned Cu with strong texture effect on voiding propensity in electroplated Cu solder joints PC Chiang, YA Shen, SP Feng, CM Chen Journal of the Electrochemical Society 167 (16), 162516, 2021 | 21 | 2021 |
| Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints Z Jin, YA Shen, S He, S Zhou, YC Chan, H Nishikawa Journal of Applied Physics 126 (18), 2019 | 21 | 2019 |
| Microstructure and mechanical properties of the In–48Sn–xAg low-temperature alloy D Le Han, YA Shen, S Jin, H Nishikawa Journal of Materials Science 55, 10824-10832, 2020 | 20 | 2020 |
| Anisotropic grain growth in (111) nanotwinned Cu films by DC electrodeposition TL Lu, YA Shen, JA Wu, C Chen Materials 13 (1), 134, 2019 | 20 | 2019 |
| Behavior of Sn-3.0 Ag-0.5 Cu solder/Cu fluxless soldering via Sn steaming under formic acid atmosphere S He, YA Shen, B Xiong, F Huo, J Li, J Ge, Z Pan, W Li, C Hu, ... Journal of Materials Research and Technology 21, 2352-2361, 2022 | 19 | 2022 |
| Significant Hall–Petch effect in micro-nanocrystalline electroplated copper controlled by SPS concentration YJ Kao, YJ Li, YA Shen, CM Chen Scientific Reports 13 (1), 428, 2023 | 17 | 2023 |
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