| Endotaxial silicide nanowires Z He, DJ Smith, PA Bennett Physical review letters 93 (25), 256102, 2004 | 152 | 2004 |
| Method and apparatus for electroplating J Reid, B Buckalew, Z He, S Park, S Varadarajan, B Pennington, ... US Patent 8,308,931, 2012 | 100 | 2012 |
| Method and apparatus for electroplating S Mayer, J Feng, Z He, J Reid, S Varadarajan US Patent 8,475,644, 2013 | 85 | 2013 |
| Dysprosium silicide nanowires on Si (110) Z He, M Stevens, DJ Smith, PA Bennett Applied physics letters 83 (25), 5292-5294, 2003 | 65 | 2003 |
| Endotaxial silicide nanowires: A review PA Bennett, Z He, DJ Smith, FM Ross Thin Solid Films 519 (24), 8434-8440, 2011 | 62 | 2011 |
| Epitaxial titanium silicide islands and nanowires Z He, M Stevens, DJ Smith, PA Bennett Surface science 524 (1), 148-156, 2003 | 58 | 2003 |
| Signatures of quantum transport in self-assembled epitaxial nickel silicide nanowires JF Lin, JP Bird, Z He, PA Bennett, DJ Smith Applied physics letters 85, 281, 2004 | 48 | 2004 |
| Plating method and apparatus with multiple internally irrigated chambers ST Mayer, S Ghongadi, K Ganesan, Z He, J Feng US Patent 8,262,871, 2012 | 44 | 2012 |
| Structure and orientation of epitaxial titanium silicide nanowires determined by electron microdiffraction M Stevens, Z He, DJ Smith, PA Bennett Journal of applied physics 93 (9), 5670-5674, 2003 | 44 | 2003 |
| Growth dynamics of titanium silicide nanowires observed with low-energy electron microscopy PA Bennett, B Ashcroft, Z He, RM Tromp Journal of Vacuum Science & Technology B 20 (6), 2500-2504, 2002 | 38 | 2002 |
| Electroplating apparatus with vented electrolyte manifold J Feng, Z He, R Rash, ST Mayer US Patent 8,475,637, 2013 | 37 | 2013 |
| Dynamic current distribution control apparatus and method for wafer electroplating Z He, DW Porter, JD Reid, FD Wilmot US Patent App. 13/687,937, 2012 | 35* | 2012 |
| Closed contact electroplating cup assembly R Rash, S Ghongadi, K Ganesan, Z He, T Majid, J Hawkins, ... US Patent 7,985,325, 2011 | 32 | 2011 |
| Wafer electroplating apparatus for reducing edge defects V Prabhakar, BL Buckalew, K Ganesan, S Ghongadi, Z He, ST Mayer, ... US Patent 8,172,992, 2012 | 31 | 2012 |
| Epitaxial DySi2 nanowire formation on stepped Si (111) Z He, DJ Smith, PA Bennett Applied Physics Letters 86 (14), 143110-143110, 2005 | 30 | 2005 |
| Faulted surface layers in dysprosium silicide nanowires Z He, DJ Smith, PA Bennett Physical Review B 70 (24), 241402, 2004 | 29 | 2004 |
| Method and apparatus for electroplating S Mayer, J Feng, Z He, J Reid, S Varadarajan US Patent App. 13/907,265, 2013 | 25 | 2013 |
| Electroplating cup assembly R Rash, S Ghongadi, K Ganesan, Z He, T Majid, J Hawkins, ... US Patent 8,377,268, 2013 | 25 | 2013 |
| Method and apparatus for dynamic current distribution control during electroplating Z He US Patent App. 14/067,616, 2013 | 20* | 2013 |
| Plating cup with contoured cup bottom Z He, J Feng, S Ghongadi, FD Wilmot US Patent App. 13/609,037, 2012 | 20* | 2012 |
