| A review of lead-free solders for electronics applications S Cheng, CM Huang, M Pecht Microelectronics Reliability 75, 77-95, 2017 | 513 | 2017 |
| Life cycle trends of electronic materials, processes and components CM Huang, JA Romero, M Osterman, D Das, M Pecht Microelectronics Reliability 99, 262-276, 2019 | 31 | 2019 |
| Assembly options and challenges for electronic products with lead-free exemption CM Huang, A Raj, M Osterman, M Pecht IEEE Access 8, 134194-134208, 2020 | 14 | 2020 |
| Risk of tin whiskers in the nuclear industry CM Huang, D Nunez, J Coburn, M Pecht Microelectronics Reliability 81, 22-30, 2018 | 10 | 2018 |
| MEMS reliability CM Huang, AS SarathiVasan, Y Huang, R Doraiswami, M Osterman, ... Mems Packag 12 (2), 279-343, 2018 | 6 | 2018 |
| Durability of Lead-Free Solder Interconnections for Printed Circuit Board Applications: Comparing Energy-Based Thermo-Mechanical Fatigue Models CM Huang, JW Herrmann 2023 24th European Microelectronics and Packaging Conference & Exhibition …, 2023 | 2 | 2023 |
| Durability distribution analysis of lead-free solder joints for printed circuit board applications CM Huang University of Maryland, College Park, 2023 | 2 | 2023 |
| Durability distribution prediction of thermo-mechanical solder fatigue failure with uncertainty propagation by eigenvector dimension reduction method CM Huang, JW Herrmann Microelectronics Reliability 161, 115453, 2024 | | 2024 |
| Conductive external connector structure and method of forming MF Shih, CY Lo, CL Huang, WM Chen, CM Huang, YF Liu, YC Cheng, WC Huang, CH ... US Patent 11,527,504, 2022 | | 2022 |
| The Back‐End Connection CM Huang, S Kyeong, M Pecht Electrical Connectors: Design, Manufacture, Test, and Selection, 89-101, 2020 | | 2020 |