| Micromachined microphone and multisensor and method for producing same JR Martin, TJ Brosnihan, C Core, TK Nunan, J Weigold, X Zhang US Patent 7,825,484, 2010 | 181 | 2010 |
| A MEMS condenser microphone for consumer applications JW Weigold, TJ Brosnihan, J Bergeron, X Zhang 19th IEEE International Conference on Micro Electro Mechanical Systems, 86-89, 2006 | 137 | 2006 |
| Accurate assessment of packaging stress effects on MEMS sensors by measurement and sensor–package interaction simulations X Zhang, S Park, MW Judy Journal of microelectromechanical systems 16 (3), 639-649, 2007 | 105 | 2007 |
| A novel joint-in-via flip-chip chip-scale package TK Lee, S Zhang, CC Wong, AC Tan IEEE Transactions on Advanced Packaging 29 (1), 186-194, 2006 | 67 | 2006 |
| Microphone with reduced parasitic capacitance X Zhang, T Chen, S Bharatan, AS Khenkin US Patent 8,103,027, 2012 | 62 | 2012 |
| Dual-axis optical mirror positioning using a nonlinear closed-loop controller T Juneau, K Unterkofler, T Seliverstov, S Zhang, M Judy TRANSDUCERS'03. 12th International Conference on Solid-State Sensors …, 2003 | 55 | 2003 |
| Microphone with variable low frequency cutoff S Bharatan, V Chandrasekaran, X Zhang, MW Judy US Patent 8,447,054, 2013 | 49 | 2013 |
| 3-axis angular accelerometer X Zhang, J Zhang US Patent 10,585,111, 2020 | 47 | 2020 |
| MEMS sensor with movable z-axis sensing element X Zhang, MW Judy US Patent 8,146,425, 2012 | 43 | 2012 |
| A very low cost, 3-axis, MEMS accelerometer for consumer applications D Hollocher, X Zhang, A Sparks, S Bart, W Sawyer, P Narayanasamy, ... SENSORS, 2009 IEEE, 953-957, 2009 | 34 | 2009 |
| Stress isolation platform for MEMS devices X Zhang, MW Judy, GM Molnar, C Needham, K Jia US Patent 10,167,189, 2019 | 32 | 2019 |
| Microphone with aligned apertures E Langlois, T Chen, X Zhang, KP Harney US Patent 9,078,068, 2015 | 31 | 2015 |
| Sensor system JR Martin, TJ Brosnihan, MW Judy, X Zhang US Patent 7,327,003, 2008 | 29 | 2008 |
| MEMS sensor with cap electrode JR Martin, X Zhang US Patent 8,100,012, 2012 | 28 | 2012 |
| MEMS sensor with movable Z-axis sensing element X Zhang, MW Judy US Patent 8,939,029, 2015 | 27 | 2015 |
| Optimal material properties of molding compounds for MEMS package Y Kim, H Lee, X Zhang, S Park IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 26 | 2014 |
| Microphone with pressure relief X Zhang, MW Judy, KP Harney, JW Weigold US Patent 8,111,871, 2012 | 26 | 2012 |
| Temperature dependency of coefficient of hygroscopic swelling of molding compound HCL Seungbae Park, Haojun Zhang, Xin Zhang, Siu Lung Ng 2009 59th Electronic Components and Technology Conference, 2009 | 26 | 2009 |
| Stress mitigation in packaged microchips X Zhang, M Judy, KHL Chau, N Kuan, T Spooner, C Paydenkar, P Farrell US Patent 8,344,487, 2013 | 25 | 2013 |
| MEMS microphone with spring suspended backplate X Zhang US Patent 8,363,860, 2013 | 21 | 2013 |
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