Wafer-level chip-scale package lead-free solder fatigue: A critical review ER Arriola, AT Ubando, JA Gonzaga, CC Lee Engineering Failure Analysis 144, 106986, 2023 | 22 | 2023 |
Development of an automated data acquisition system for hydroponic farming S Tagle, R Pena, F Oblea, H Benoza, N Ledesma, J Gonzaga, LAG Lim 2018 IEEE 10th International Conference on Humanoid, Nanotechnology …, 2018 | 22 | 2018 |
Finite element analysis on the factors affecting die crack propagation in BGA under thermo-mechanical loading NREG Lim, AT Ubando, JA Gonzaga, RRN Dimagiba Engineering Failure Analysis 116, 104717, 2020 | 21 | 2020 |
Fuzzy-based automated nutrient solution control for a hydroponic tower system JAD Vega, JA Gonzaga, LAG Lim IOP Conference Series: Materials Science and Engineering 1109 (1), 012064, 2021 | 19 | 2021 |
Life cycle assessment of a biomass based chemical looping combustion JP Mercado, AT Ubando, JA Gonzaga, SR Naqvi Environmental Research 217, 114876, 2023 | 17 | 2023 |
A comparative life cycle analysis of plastic and paper packaging bags in the Philippines JBMM Biona, JA Gonzaga, AT Ubando, HC Tan 2015 International conference on humanoid, nanotechnology, information …, 2015 | 16 | 2015 |
Performance and emission characteristics of the genset fuelled with dual producer gas–diesel M Rith, JBM Biona, HW Gitano-Briggs, P Sok, J Gonzaga, N Arbon, ... DLSU Research Congress 2016, 7-9, 2016 | 14 | 2016 |
Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging NRE Lim, E Arriola, RL Moran, JP Mercado, R Dimagiba, J Gonzaga, ... 2019 IEEE 11th International Conference on Humanoid, Nanotechnology …, 2019 | 11 | 2019 |
Optimization of control factors for a diesel engine fueled with jatropha seed producer gas on dual fuel mode M Rith, HW Gitano-Briggs, JA Gonzaga, JBM Biona International Energy Journal 19 (1), 2019 | 11 | 2019 |
The combustion and emission characteristics of the diesel engine operated on a dual producer gas-diesel fuel mode M Rith, B Buenconsejo, JA Gonzaga, HW Gitano-Briggs, NS Lopez, ... Engineering and Applied Science Research 46 (4), 360-370, 2019 | 10 | 2019 |
Reduction of IC package warpage through finite element analysis and direct optimization RL Moran, E Arriola, NRE Lim, JP Mercado, R Dimagiba, J Gonzaga, ... 2019 IEEE 11th International Conference on Humanoid, Nanotechnology …, 2019 | 8 | 2019 |
Energy audit and analysis of the electricity consumption of an educational building in the Philippines for smart consumption NS Lopez, J Gonzaga, LAG Lim 2017IEEE 9th International Conference on Humanoid, Nanotechnology …, 2017 | 8 | 2017 |
Evaluation of the effects of introducing channels to composite materials to reduce warpage on semiconductor packages due to coefficient of thermal expansion mismatch E Arriola, NRE Lim, RL Moran, JP Mercado, R Dimagiba, J Gonzaga, ... 2019 IEEE 11th International Conference on Humanoid, Nanotechnology …, 2019 | 6 | 2019 |
A systematic approach to the optimal planning of energy mix for electric vehicle policy AT Ubando, IH Gue, M Rith, J Gonzaga, NS Lopez, JB Biona Chem. Eng 76, 2019 | 5 | 2019 |
Fumigation of producer gas in a diesel genset: Performance and emission characteristics M Rith, JBM Biona, AB Maglaya, A Fernando, JA Gonzaga, ... 2018 IEEE 10th International Conference on Humanoid, Nanotechnology …, 2018 | 5 | 2018 |
Interfacial Delamination Validation on Fan-Out Wafer-Level Package Using Finite Element Method A Conversion, AT Ubando, J Gonzaga Solid State Phenomena 343, 73-78, 2023 | 4 | 2023 |
Analysis of the effects of geometry on the press fit application in automotive power modules AT Ubando, J Gonzaga, E Arriola, RL Moran, NRE Lim, JP Mercado, ... IOP Conference Series: Materials Science and Engineering 1109 (1), 012019, 2021 | 4 | 2021 |
The effect of Jatropha seed cake producer gas flow rates on a diesel engine operated on dual fuel mode at high engine speed M Rith, HW Gitano-Briggs, N Arbon, JA Gonzaga, JBM Biona Engineering and Applied Science Research 46 (4), 303-311, 2019 | 4 | 2019 |
FEA of thermal warpage in ball grid array with consideration of molding compound residual strain compared to experimental measurements NRE Lim, R Dimagiba, A Ubando, J Gonzaga, G Augusto 2018 IEEE 10th International Conference on Humanoid, Nanotechnology …, 2018 | 4 | 2018 |
Global-to-local finite element model of shear stress analysis on Fan-out wafer-level package A Ubando, J Gonzaga 2022 IEEE 14th International Conference on Humanoid, Nanotechnology …, 2022 | 3 | 2022 |