ติดตาม
Stephanie Butler
Stephanie Butler
Technology Innovation Architect
ยืนยันอีเมลแล้วที่ wattsbutler.com - หน้าแรก
ชื่อ
อ้างโดย
อ้างโดย
ปี
Supervisory run-to-run control of polysilicon gate etch using in situ ellipsometry
SW Butler, JA Stefani
IEEE Transactions on Semiconductor Manufacturing 7 (2), 193-201, 1994
3581994
A comparison of principal component analysis, multiway principal component analysis, trilinear decomposition and parallel factor analysis for fault detection in a semiconductor …
BM Wise, NB Gallagher, SW Butler, DD White, GG Barna
Journal of Chemometrics 13 (3‐4), 379-396, 1999
3561999
Automatic control in microelectronics manufacturing: Practices, challenges, and possibilities
TF Edgar, SW Butler, WJ Campbell, C Pfeiffer, C Bode, SB Hwang, ...
Automatica 36 (11), 1567-1603, 2000
3312000
Virtual sensor based monitoring and fault detection/classification system and method for semiconductor processing equipment
GG Barna, SW Butler, DA Sofge, DA White
US Patent 5,864,773, 1999
1681999
Development and benchmarking of multivariate statistical process control tools for a semiconductor etch process: improving robustness through model updating
NB Gallagher, BM Wise, SW Butler, DD White Jr, GG Barna
IFAC Proceedings Volumes 30 (9), 79-84, 1997
1311997
Apparatus and method for model based process control
MF Sullivan, JS Hirsch, SW Butler, NJ Tovell, JA Stefani, PK Mozumder, ...
US Patent 5,402,367, 1995
1091995
Run by run advanced process control of metal sputter deposition
T Smith, J Stefani, D Boning, S Butler
Proceedings of the Second International Symposium on Process Control …, 1997
841997
Spatial characterization of wafer state using principal component analysis of optical emission spectra in plasma etch
DA White, D Boning, SW Butler, GG Barna
IEEE Transactions on Semiconductor Manufacturing 10 (1), 52-61, 1997
801997
Modeling and control of microelectronics materials processing
TA Badgwell, T Breedijk, SG Bushman, SW Butler, S Chatterjee, TF Edgar, ...
Computers & chemical engineering 19 (1), 1-41, 1995
801995
Method and apparatus for process endpoint prediction based on actual thickness measurements
S Maung, SW Butler, SA Henck
US Patent 5,503,707, 1996
781996
Apparatus and method for model based process control
MF Sullivan, JS Hirsch, SW Butler, NJ Tovell, JA Stefani, PK Mozumder, ...
US Patent 5,838,595, 1998
721998
IC test software system for mapping logical functional test data of logic integrated circuits to physical representation
S Smith, H Balachandran, J Parker
US Patent 6,185,707, 2001
692001
Reduction of seed layer roughness for use in forming SiGe gate electrode
H Bu, S Butler, R Khamankar, H Niimi
US Patent App. 10/263,521, 2004
592004
Development of Techniques for Real‐Time Monitoring and Control in Plasma Etching: II. Multivariable Control System Analysis of Manipulated, Measured, and Performance Variables
SW Butler, KJ McLaughlin, TF Edgar, I Trachtenberg
Journal of the Electrochemical Society 138 (9), 2727, 1991
591991
Method and system for identifying process conditions
SW Butler, KJ Brankner
US Patent 5,458,732, 1995
561995
System and method for monitoring and evaluating semiconductor wafer fabrication
JA Stefani, SW Butler
US Patent 5,399,229, 1995
551995
In situ spectral ellipsometry for real‐time thickness measurement: Etching multilayer stacks
SA Henck, WM Duncan, LM Lowenstein, SW Butler
Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 11 (4 …, 1993
551993
Application of predictor corrector control to polysilicon gate etching
SW Butler, J Stefani
1993 American Control Conference, 3003-3007, 1993
541993
Development of Techniques for Real‐Time Monitoring and Control in Plasma Etching: I. Response Surface Modeling of and Etching of Silicon and Silicon Dioxide
KJ McLaughlin, SW Butler, TF Edgar, I Trachtenberg
Journal of the Electrochemical Society 138 (3), 789, 1991
421991
Process control in semiconductor manufacturing
SW Butler
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1995
411995
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บทความ 1–20