| Near-UV-emitting graphene quantum dots from graphene hydrogels H Qin, T Gong, Y Jin, Y Cho, C Shin, C Lee, T Kim Carbon 94, 181-188, 2015 | 36 | 2015 |
| Shape classification of fumed silica abrasive and its effects on chemical mechanical polishing E Kim, J Lee, Y Park, C Shin, J Yang, T Kim Powder Technology 381, 451-458, 2021 | 23 | 2021 |
| Effect of conditioner load on the polishing pad surface during chemical mechanical planarization process C Shin, H Qin, S Hong, S Jeon, A Kulkarni, T Kim Journal of Mechanical Science and Technology 30, 5659-5665, 2016 | 20 | 2016 |
| Investigation of the pad-conditioning performance deterioration in the chemical mechanical polishing process H Kim, S Hong, C Shin, Y Jin, DH Lim, J Kim, H Hwang, T Kim Wear 392, 93-98, 2017 | 17 | 2017 |
| Evaluation of size distribution measurement methods for sub-100 nm colloidal silica nanoparticles and its application to CMP slurry C Shin, J Choi, D Kwak, J Kim, J Yang, S Chae, T Kim ECS Journal of Solid State Science and Technology 8 (5), P3195, 2019 | 14 | 2019 |
| A conductive copolymer based on graphene oxide and poly (amidoxime-pyrrole) for adsorption of uranium (VI) H Qin, Y Jin, T Gong, Y Cho, C Ahn, C Shin, C Lee, T Kim Nano 11 (04), 1650045, 2016 | 13 | 2016 |
| Effect of ceria abrasive synthesized by supercritical hydrothermal method for chemical mechanical planarization J Choi, C Shin, J Yang, SK Chae, T Kim ECS Journal of Solid State Science and Technology 8 (5), P3128, 2019 | 10 | 2019 |
| Chemical amination via cycloaddition of graphene for use in a glucose sensor H Qin, T Hwang, C Ahn, JA Kim, Y Jin, Y Cho, C Shin, T Kim Journal of nanoscience and nanotechnology 16 (5), 5034-5037, 2016 | 10 | 2016 |
| Light-sensitive silicon nanowire array field effect transistor for glucose detection C Ahn, A Kulkarni, HU Kim, C Shin, Y Xu, S Jung, H Kim, M Lee, T Kim Nano 9 (08), 1450099, 2014 | 9 | 2014 |
| A simple and economical method using graphene oxide for the fabrication of water/oil separation papers H Qin, T Gong, Y Cho, C Shin, C Lee, T Kim RSC Advances 5 (71), 57860-57864, 2015 | 8 | 2015 |
| Diamond structure-dependent pad and wafer polishing performance during chemical mechanical polishing C Shin, A Kulkarni, K Kim, H Kim, S Jeon, E Kim, Y Jin, T Kim The International Journal of Advanced Manufacturing Technology 97, 563-571, 2018 | 7 | 2018 |
| Effect of Copper Foil Crystal Orientation on Graphene Quality Synthesized by Chemical Vapor Deposition Y Jin, HU Kim, S Hong, C Shin, A Kulkarni, T Kim Journal of Nanoscience and Nanotechnology 19 (9), 5942-5948, 2019 | 5 | 2019 |
| Optimal shape of retainer ring considering edge exclusion and slurry film thickness J Park, C Shin, T Kim, H Qin 2015 International Conference on Planarization/CMP Technology (ICPT), 1-2, 2015 | 5 | 2015 |
| Deposition of controllable nanoparticles by hybrid aerodynamic and electrostatic spray B Seong, S Ha, HU Kim, C Shin, T Kim, D Byun Nano 12 (02), 1750023, 2017 | 4 | 2017 |
| Effect of ionic strength on amorphous carbon during chemical mechanical planarization S Oh, C Shin, D Kwak, E Kim, J Kim, C Bae, T Kim Diamond and Related Materials 127, 109124, 2022 | 3 | 2022 |
| Monitoring the physicochemical degradation of polishing pad soaked in hydrogen peroxide during chemical mechanical polishing C Shin, H Chung, E Kim, S Hong, D Kwak, Y Jin, A Kulkarni, T Kim ECS Journal of Solid State Science and Technology 7 (2), P77, 2018 | 3 | 2018 |
| Trace metals optimization in ceria abrasive for material removal rate enhancement during ILD CMP C Shin, J Choi, H Kim, A Kulkarni, D Kwak, E Kim, T Kim ECS Journal of Solid State Science and Technology 6 (10), P687, 2017 | 3 | 2017 |
| Light-and Elevated Temperature-Induced Degradation and Recovery from Silicon Wafers by the Impact of Hydrogen Treatment C Shin, J Choi, D Kwak | | 2024 |
| Control of silica particle deposition for fabrication of post CMP cleaning ability evaluation wafer Y Cho, SK Chae, C Shin, Y Jin, T Kim ICPT 2017; International Conference on Planarization/CMP Technology, 1-3, 2017 | | 2017 |
| Modified kinematic model for predicting contact points of conditioner in CMP J Choi, E Kim, C Shin, Y Jin, T Kim ICPT 2017; International Conference on Planarization/CMP Technology, 1-3, 2017 | | 2017 |
