| Method of making 3D integrated circuits MG Farooq, SS Iyer, SJ Koester, H Zhu US Patent 8,158,515, 2012 | 328 | 2012 |
| 3D integrated circuit device fabrication with precisely controllable substrate removal MG Farooq, R Hannon, SS Iyer, SJ Koester, S Purushothaman, RY Roy US Patent 8,129,256, 2012 | 263 | 2012 |
| Three dimensional integrated circuit integration using dielectric bonding first and through via formation last MG Farooq, R Hannon, SS Iyer, ER Kinser US Patent 9,406,561, 2016 | 227 | 2016 |
| Bonded structure employing metal semiconductor alloy bonding MG Farooq, Z Li, Z Luo, H Zhu US Patent 8,841,777, 2014 | 215 | 2014 |
| 3D integration structure and method using bonded metal planes MG Farooq, SS Iyer US Patent 7,939,369, 2011 | 176 | 2011 |
| 3D copper TSV integration, testing and reliability MG Farooq, TL Graves-Abe, WF Landers, C Kothandaraman, BA Himmel, ... 2011 international electron devices meeting, 7.1. 1-7.1. 4, 2011 | 138 | 2011 |
| Three dimensional integrated circuit integration using alignment via/dielectric bonding first and through via formation last MG Farooq, S Skordas, RP Volant, KR Winstel US Patent 8,563,403, 2013 | 118 | 2013 |
| Using crack arrestor for inhibiting damage from dicing and chip packaging interaction failures in back end of line structures MW Lane, XH Liu, TM Shaw, MG Farooq, R Hannon, IDW Melville US Patent 7,955,955, 2011 | 110 | 2011 |
| Coaxial through-silicon via RP Volant, MG Farooq, PF Findeis, KS Petrarca US Patent 8,242,604, 2012 | 91 | 2012 |
| Metal to metal bonding for stacked (3D) integrated circuits TJ Cheng, MG Farooq, JA Fitzsimmons US Patent 8,916,448, 2014 | 78 | 2014 |
| Silicon nutrition mitigates salinity stress in maize by modulating ion accumulation, photosynthesis, and antioxidants WUD Khan, T Aziz, MA Maqsood, M Farooq, Y Abdullah, PMA Ramzani, ... Photosynthetica 56, 1047-1057, 2018 | 74 | 2018 |
| Effect of planting patterns and different irrigation levels on yield and yield component of maize (Zea mays L.) U Saif, M Maqsood, M Farooq, S Hussain, A Habib International Journal of Agriculture and Biology 1, 64-66, 2003 | 68 | 2003 |
| Structure and method for making crack stop for 3D integrated circuits MG Farooq, JA Griesemer, WF Landers, ID Melville, TM Shaw, H Zhu US Patent 8,859,390, 2014 | 64 | 2014 |
| Structure and method for producing multiple size interconnections L Clevenger, MG Farooq, LL Hsu, WF Landers, DS Zupanski-Nielsen, ... US Patent 7,312,529, 2007 | 51 | 2007 |
| Method for simultaneously forming a through silicon via and a deep trench structure K Cheng, MG Farooq, LL Hsu US Patent 8,492,241, 2013 | 50 | 2013 |
| 3D integration review MG Farooq, SS Iyer Science China Information Sciences 54, 1012-1025, 2011 | 48 | 2011 |
| Factors affecting cost of production and net profit per broiler in the subtropics M Farooq, MA Mian, A Asghar Livestock research for rural development 13 (1), 1-5, 2001 | 46 | 2001 |
| Wire bonding personalization and discrete component attachment on wirebond pads F Beaulieu, MG Farooq, KS Petrarca US Patent 7,696,631, 2010 | 45 | 2010 |
| Three dimensional integration with through silicon vias having multiple diameters MG Farooq, R Kei, ER Kinser, AD Lisi, R Wise, H Yusuff US Patent 8,399,180, 2013 | 44 | 2013 |
| Low stress conductive polymer bump WE Bernier, MS Cole, MG Farooq, JU Knickerbocker, TE Lopez, RA Quon, ... US Patent 7,170,187, 2007 | 42 | 2007 |
