Hybrid solar cells: basic principles and the role of ligands RVPS Adam J. Moule, Lilian Chang, Chandru Thambidurai Journal of Materials Chemistry 22 (2012), 2351, 2012 | 157* | 2012 |
Electrodeposition of Ru by atomic layer deposition (ALD) C Thambidurai, YG Kim, JL Stickney Electrochimica Acta 53 (21), 6157-6164, 2008 | 91 | 2008 |
Electrochemical atomic layer deposition of copper nanofilms on ruthenium DK Gebregziabiher, YG Kim, C Thambidurai, V Ivanova, PH Haumesser, ... Journal of crystal growth 312 (8), 1271-1276, 2010 | 46 | 2010 |
E-ALD of Cu nanofilms on Ru/Ta wafers using surface limited redox replacement C Thambidurai, DK Gebregziabiher, X Liang, Q Zhang, V Ivanova, ... Journal of The Electrochemical Society 157 (8), D466, 2010 | 42 | 2010 |
Copper nanofilm formation by electrochemical ALD C Thambidurai, YG Kim, N Jayaraju, V Venkatasamy, JL Stickney Journal of the Electrochemical Society 156 (8), D261, 2009 | 42 | 2009 |
Deposition of HgTe by electrochemical atomic layer epitaxy (EC-ALE) V Venkatasamy, N Jayaraju, SM Cox, C Thambidurai, M Mathe, ... Journal of Electroanalytical Chemistry 589 (2), 195-202, 2006 | 40 | 2006 |
Controlled Electrochemical Formation of GexSbyTez using Atomic Layer Deposition (ALD) X Liang, N Jayaraju, C Thambidurai, Q Zhang, JL Stickney Chemistry of Materials 23 (7), 1742-1752, 2011 | 32 | 2011 |
Optimization of CdTe nanofilm formation by electrochemical atomic layer epitaxy (EC-ALE) V Venkatasamy, N Jayaraju, SM Cox, C Thambidurai, U Happek, ... Journal of applied electrochemistry 36, 1223-1229, 2006 | 30 | 2006 |
Pb deposition on I-coated Au (111). UHV-EC and EC-STM studies YG Kim, JY Kim, C Thambidurai, JL Stickney Langmuir 23 (5), 2539-2545, 2007 | 28 | 2007 |
Studies of Hg (1-x) Cd x Te Formation by Electrochemical Atomic Layer Deposition and Investigations into Bandgap Engineering V Venkatasamy, N Jayaraju, SM Cox, C Thambidurai, JL Stickney Journal of the Electrochemical Society 154 (8), H720, 2007 | 27 | 2007 |
PtRu nanofilm formation by electrochemical atomic layer deposition (E-ALD) N Jayaraju, D Banga, C Thambidurai, X Liang, YG Kim, JL Stickney Langmuir 30 (11), 3254-3263, 2014 | 22 | 2014 |
Electrochemical deposition processes for semiconductor wafers DK Gebregziabiher, J Klocke, C Sharbono, C Thambidurai, DJ Erickson US Patent App. 13/835,870, 2014 | 2 | 2014 |
Copper Nano Film Formation Using Electrochemical ALD C Thambidurai, N Jayaraju, YG Kim, JL Stickney ECS Transactions 11 (7), 103, 2007 | 2 | 2007 |
Detection of electroplating bath contamination C Thambidurai, RO Miller US Patent App. 13/838,080, 2014 | | 2014 |
Rapid Small Feature Cu Filling: Implications for" Bottom-up" Deposition Models RO Miller, C Schieffer, C Thambidurai, J Klocke ECS Meeting Abstracts, 1381, 2012 | | 2012 |
E-ALD of Cu Nanofilms on Ru C THAMBIDURAI, DK GEBREGZIABIHER, X LIANG, Q ZHANG, ... Journal of the Electrochemical Society 157 (8), 2010 | | 2010 |
Electrochemical ALD for Photovoltaics, Thermoelectrics and Fuel Cells JL Stickney, D Banga, N Jayaraju, C Thambidurai ECS Meeting Abstracts, 2675, 2009 | | 2009 |
Electrochemical ALD for Photovoltaics, Thermoelectrice and Fuel Cells John Stickney, Dhego Banga, Chandru Thambidurai 216th ECS Meeting, 2009 | | 2009 |
Electrodeposition of thin films by electrochemical-atomic layer deposition (ALD) C Thambidurai University of Georgia, 2009 | | 2009 |
Formation of Cu and Ru Nanofilms by Electrochemical ALD C Thambidurai, N Jayaraju, JL Stickney ECS Meeting Abstracts, 988, 2007 | | 2007 |