| Characterization of thick film technology for 300 C packaging R Zhang, RW Johnson, V Tilak, T Zhang, D Shaddock Additional Papers and Presentations 2010 (HITEC), 000097-000107, 2010 | 22 | 2010 |
| Failure Mechanism in Thick Film Materials for 300Operation R Zhang, RW Johnson, A Vert, T Zhang, D Shaddock IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 16 | 2012 |
| Tin-bismuth plating for component finishes R Zhang, J Zhang, J Evans, W Johnson, J Vardaman, I Fujimura, A Tseng, ... 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 2060-2066, 2011 | 13 | 2011 |
| Assembly materials and processes for high-temperature geothermal electronic modules R Zhang, RW Johnson, A Vert, T Zhang, D Shaddock IEEE Transactions on Components, Packaging and Manufacturing Technology 2 …, 2012 | 10 | 2012 |
| Characterization of LTCC-thick film technology for 300 C packaging T Zhang, D Shaddock, A Vert, R Zhang, RW Johnson Additional Papers and Presentations 2011 (HITEN), 000046-000051, 2011 | 8 | 2011 |
| Thin film multichip packaging for high temperature digital electronics K Fang, R Zhang, T Isaacs-Smith, RW Johnson, E Andarawis, A Vert Additional Papers and Presentations 2011 (HITEN), 000039-000045, 2011 | 5 | 2011 |
| Reliability Assessment of Passives for 300C using HALT D Shaddock, V Tilak, T Zhang, R Zhang, RW Johnson Additional Papers and Presentations 2010 (HITEC), 000199-000206, 2010 | 5 | 2010 |
| Ti/au die backside metallization for flip chip heat spreader attachment Y Li, RW Johnson, R Zhang, P Henson, P Thompson, T Hooghan, ... IEEE transactions on electronics packaging manufacturing 33 (1), 44-54, 2010 | 4 | 2010 |
| Reliability Assessment of Passives for 300 C and 350 C D Shaddock, A Vert, T Zhang, R Zhang, RW Johnson Additional Papers and Presentations 2011 (HITEN), 000001-000006, 2011 | 3 | 2011 |
| Effect of High Temperature Aging on Microstructural Evolution in AuSn Solder Joints Rui Zhang, R.Wayne Johnson, G.Govindarajan, David Shaddock, Tan Zhang Proceedings of the Materials Science & Technology 2011 Conference and …, 2011 | 2* | 2011 |
| Thick Film Packaging Techniques for 300 deg C Operation R Zhang Auburn University, 2011 | 2 | 2011 |
| Characterization of LTCC-Thick Film Technology for 300°C Packaging Tan Zhang, David Shaddock, Alexey Vert, Rui Zhang, R.Wayne Johnson HiTEN, July 18-20, 2011, Oxford, United Kingdom, 2011 | | 2011 |
| Reliability Assessment of Passive For 300°C Using HALT David Shaddock, Vinayak Tilak, Tan Zhang, Rui Zhang, R Wayne Johnson HiTEC 2010, May 11-13, 2010, Albuquerque, NM., 2010 | | 2010 |
