| Classification of EMG signal for multiple hand gestures based on neural network MA Abu, S Rosleesham, MZ Suboh, MSM Yid, Z Kornain, NF Jamaluddin Indonesian Journal of Electrical Engineering and Computer Science 17 (1 …, 2020 | 34 | 2020 |
| The simulation of indoor service range prediction of wireless radio access point for radio over fiber system Z Kornain, MA Abu, MY Yacob International Journal of Engineering and Technology 5 (1), 136, 2013 | 18 | 2013 |
| Effects of different fillers on microstructure and tensile properties of welded AA6061-T6 AAA Azhar, MFA Ibrahim, A Jalar, J Syarif, S Abdullah, NM Rashdi, ... Key Engineering Materials 462, 1189-1193, 2011 | 12 | 2011 |
| Comparative study of different underfill material on flip chip ceramic ball grid array based on accelerated thermal cycling Z Kornain, A Jalar, N Amin, R Rasid, CS Foong American Journal of Engineering and Applied Sciences 3 (1), 2010 | 11 | 2010 |
| Comparative study of phenolic-based and amine-based underfill materials in flip chip plastic ball grid array package Z Kornain, A Jalar, R Rasid, S Abdullah | 9 | 2010 |
| Automated car braking system: using neural network system via labview environment MA Abu, Z Kornain, IM Iqbal, MH Rosli 2012 IEEE Conference on Open Systems, 1-6, 2012 | 8 | 2012 |
| An optimization of two-steps curing profile to eliminate voids formation in underfill epoxy for Hi-CTE flip chip packaging Z Kornain, A Jalar, R Rashid, S Abdullah Advanced Materials Research 97, 23-27, 2010 | 8 | 2010 |
| The effect of clean and no-clean flux in enhancing the wettability of eutectic solder bump flip chip PBGA N Amin, AY Cheah, Z Kornain, I Ahmad 2008 IEEE International Conference on Semiconductor Electronics, 388-392, 2008 | 7 | 2008 |
| Telemedicine system: Development of wireless healthcare units with GSM and Bluetooth link Z Kornain, MR Abdullah, MA Abu 2012 IEEE Symposium on Industrial Electronics and Applications, 72-77, 2012 | 6 | 2012 |
| Surface topographical characterization of gold aluminide compound for thermosonic ball bonding MF Rosle, S Abdullah, MAA Hamid, AR Daud, A Jalar, Z Kornain | 6 | 2010 |
| Automated car braking system using LabVIEW MA Abu, Z Kornain, MH Rosli, IM Iqbal 2012 IEEE Symposium on Industrial Electronics and Applications, 246-250, 2012 | 5 | 2012 |
| The effect of underfill fillet geometry to die edge stress for flip chip packaging A Jalar, Z Kornain, R Rasid, S Abdullah, NK Othman Advanced Materials Research 148, 1108-1111, 2011 | 5 | 2011 |
| The investigation of die back edge cracking in flip chip ceramic ball grid array package (FC-CBGA) Z Kornain, A Jalar, R Rasid Journal of Science and Technology 2 (1), 2010 | 5 | 2010 |
| Effect of curing profile to eliminate the voids/black dots formation in underfill epoxy for Hi-CTE flip chip packaging Z Kornain, A Jalar, R Rasid, FC Seng International Journal of Electronics and Communication Engineering 3 (11 …, 2009 | 4 | 2009 |
| Study of lifetime prediction of n-mos transistor due to hot carrier effect I Ahmad, Z Kornain, MFM Idros 2006 Conference on Optoelectronic and Microelectronic Materials and Devices …, 2006 | 4 | 2006 |
| Implementation of novel reflow profile of no-clean fluxes to enhance flux stability and oxide layer removal of the high lead solder bump N Amin, AY Cheah, LZ Yi, Z Kornain 2008 33rd IEEE/CPMT International Electronics Manufacturing Technology …, 2008 | 2 | 2008 |
| The Design of Downlink Radio Access Point for Radio over Fiber for LTE Applications AMA Hadi, MA Abu, Z Kornain Journal of Engineering Technology 3 (1), 38-43, 2013 | 1 | 2013 |
| THE DESIGN & DEVELOPMENT OF AUTOMATED ENERGY SAVING SYSTEM USING MICROCONTROLLER HN Haron, MA Abu, DRZ KORNAIN, MAA Ghani Poster Presented at 3rd Asia-Pacific Conference on Engineering and …, 2012 | 1 | 2012 |
| The Development of Air Quality Monitoring System AMM Azhari, WSW Zaki, N Zinal, B Ishak, Z Kornain, MMA Jamil Journal of Engineering Technology 1, 69-73, 2011 | 1 | 2011 |
| Effect of treated silver nanoparticles to electrical conductivity improvement of electrically conductive adhesive (ECA) Z Kornain, N Amin, A Jalar, AY Cheah, I Ahmad 2008 IEEE International Conference on Semiconductor Electronics, 549-553, 2008 | 1 | 2008 |
Azman Jalarinstitute of microengineering and nanoelectronics (IMEN), universiti kebangsaan malaysiaPreverjeni e-poštni naslov na ukm.edu.my
Mohd Azlan AbuSenior Lecturer, PEng, PTech, ACPE, MIEM, MIET, SMIEEE, Universiti Teknologi Malaysia Kuala LumpurPreverjeni e-poštni naslov na utm.my
Rozaidi RasidAssociate ProfessorPreverjeni e-poštni naslov na ukm.edu.myNowshad AminAmerican International University-BangladeshPreverjeni e-poštni naslov na aiub.edu
Syarif JunaidiDept. Mechanical&Nuclear Eng., University of SharjahPreverjeni e-poštni naslov na sharjah.ac.ae
