| Reconstituted wafer level stacking B Haba, I Mohammed, V Oganesian, D Ovrutsky, LW Mirkarimi US Patent 7,901,989, 2011 | 269 | 2011 |
| Microelectronic elements with post-assembly planarization V Oganesian, B Haba, C Mitchell, I Mohammed, P Savalia US Patent 8,847,376, 2014 | 258 | 2014 |
| Microelectronic packages and methods therefor B Haba, M Beroz, TG Kang, Y Kubota, S Krishnan, JB Riley III, ... US Patent 7,453,157, 2008 | 247 | 2008 |
| Stacked packages LE Pflughaupt, D Gibson, YG Kim, CS Mitchell, W Zohni, I Mohammed US Patent 6,977,440, 2005 | 240 | 2005 |
| Cohesive zone modeling of crack nucleation at bimaterial corners I Mohammed, KM Liechti Journal of the Mechanics and Physics of Solids 48 (4), 735-764, 2000 | 236 | 2000 |
| Microelectronic packages and methods therefor B Haba, TG Kang, I Mohammed, E Chau US Patent 8,058,101, 2011 | 204 | 2011 |
| Microelectronic elements with rear contacts connected with via first or via middle structures V Oganesian, B Haba, I Mohammed, C Mitchell, P Savalia US Patent 8,796,135, 2014 | 198 | 2014 |
| Microelectronic elements having metallic pads overlying vias V Oganesian, I Mohammed, C Mitchell, B Haba, P Savalia US Patent 8,791,575, 2014 | 196 | 2014 |
| Stacked chip assembly with encapsulant layer I Mohammed US Patent 7,605,479, 2009 | 188 | 2009 |
| Package-on-package assembly with wire bonds to encapsulation surface H Sato, TG Kang, B Haba, PR Osborn, WS Wang, E Chau, I Mohammed, ... US Patent 8,618,659, 2013 | 173 | 2013 |
| Microelectronic packages and methods therefor B Haba, M Beroz, R Green, I Mohammed, SE Wilson, W Zohni, Y Kubota, ... US Patent 7,176,043, 2007 | 170 | 2007 |
| BVA interposer T Caskey, I Mohammed, CE Uzoh, CG Woychik, M Newman, ... US Patent 9,502,390, 2016 | 151 | 2016 |
| Bonded structures with integrated passive component B Haba, I Mohammed, R Katkar, GZ Guevara, JA Delacruz, S Huang, ... US Patent 11,626,363, 2023 | 145 | 2023 |
| Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics G Gao, GG Fountain Jr, LW Mirkarimi, R Katkar, I Mohammed, CE Uzoh US Patent 11,011,494, 2021 | 145 | 2021 |
| Structure for microelectronic packaging with bond elements to encapsulation surface B Haba, I Mohammed, T Caskey, E Chau US Patent 8,878,353, 2014 | 135 | 2014 |
| Direct-bonded lamination for improved image clarity in optical devices B Haba, R Katkar, I Mohammed US Patent 11,256,004, 2022 | 133 | 2022 |
| Active chip on carrier or laminated chip having microelectronic element embedded therein V Oganesian, I Mohammed, C Mitchell, B Haba, P Savalia US Patent 8,598,695, 2013 | 130 | 2013 |
| Microelectronic packages and methods therefor B Haba, TG Kang, I Mohammed, E Chau US Patent 8,093,697, 2012 | 125 | 2012 |
| Bonded structures without intervening adhesive B Haba, R Katkar, I Mohammed, JA Delacruz US Patent 11,476,213, 2022 | 123 | 2022 |
| Seal for microelectronic assembly R Katkar, L Wang, CE Uzoh, S Huang, G Gao, I Mohammed US Patent 10,508,030, 2019 | 122 | 2019 |
