Članki z zahtevami za javni dostop - Hua LuVeč o tem
Ni na voljo nikjer: 11
Electromigration in Sn–Ag solder thin films under high current density
X Zhu, H Kotadia, S Xu, H Lu, SH Mannan, C Bailey, YC Chan
Thin Solid Films 565, 193-201, 2014
Zahteve: Research Grants Council, Hong Kong
A time dependent damage indicator model for Sn3. 5Ag solder layer in power electronic module
P Rajaguru, H Lu, C Bailey
Microelectronics Reliability 55 (11), 2371-2381, 2015
Zahteve: UK Engineering and Physical Sciences Research Council
Impact of uneven solder thickness on IGBT substrate reliability
H Lu, C Bailey, L Mills
2015 IEEE 65th Electronic Components and Technology Conference (ECTC), 1888-1893, 2015
Zahteve: UK Engineering and Physical Sciences Research Council
Reliability prediction for IGBT solder joints using Clech Algorithm
H Lu, C Bailey
2016 17th International Conference on Electronic Packaging Technology (ICEPT …, 2016
Zahteve: UK Engineering and Physical Sciences Research Council
Approximate methods for IGBT solder joint stress and fatigue prediction
H Lu, C Bailey
2016 6th Electronic System-Integration Technology Conference (ESTC), 1-6, 2016
Zahteve: UK Engineering and Physical Sciences Research Council
Impact of wide band gap devices on power electronics packaging designs
C Bailey, P Rajaguru, H Lu
2017 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-6, 2017
Zahteve: UK Engineering and Physical Sciences Research Council
Optimising thermo mechanical behaviour of power electronic module structures
P Rajaguru, C Bailey, H Lu
2016 Pan Pacific Microelectronics Symposium (Pan Pacific), 1-7, 2016
Zahteve: UK Engineering and Physical Sciences Research Council
2D Finite Element analysis of IGBT solder joint
H Lu, C Bailey
2015 16th International Conference on Electronic Packaging Technology (ICEPT …, 2015
Zahteve: UK Engineering and Physical Sciences Research Council
Effective method to disperse and incorporate Carbon nanotubes in electroless Ni-P deposits
S Xu, YC Chan, X Zhu, H Lu, C Bailey
2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 1342-1347, 2014
Zahteve: Research Grants Council, Hong Kong
Comments on electromigration analysis methods
X Zhu, H Kotadia, S Xu, H Lu, SH Mannan, C Bailey, YC Chan
2013 14th International Conference on Electronic Packaging Technology, 529-534, 2013
Zahteve: Research Grants Council, Hong Kong
An investigation of component interaction and analysis of its impact on electro-thermal behaviour in a power dense boost converter topology
M Shahjalal, H Lu, C Bailey
2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017
Zahteve: UK Engineering and Physical Sciences Research Council
Na voljo nekje: 15
Failure and reliability analysis of a SiC power module based on stress comparison to a Si device
B Hu, JO Gonzalez, L Ran, H Ren, Z Zeng, W Lai, B Gao, O Alatise, H Lu, ...
IEEE Transactions on device and materials reliability 17 (4), 727-737, 2017
Zahteve: National Natural Science Foundation of China, UK Engineering and Physical …
Sintered silver finite element modelling and reliability based design optimisation in power electronic module
P Rajaguru, H Lu, C Bailey
Microelectronics Reliability 55 (6), 919-930, 2015
Zahteve: UK Engineering and Physical Sciences Research Council
An analysis of the thermal interaction between components in power converter applications
M Shahjalal, MR Ahmed, H Lu, C Bailey, AJ Forsyth
IEEE Transactions on Power Electronics 35 (9), 9082-9094, 2020
Zahteve: UK Engineering and Physical Sciences Research Council
Electro-thermo-mechanical modelling and analysis of the press pack diode in power electronics
P Rajaguru, H Lu, C Bailey, J Ortiz-Gonzalez, O Alatise
2015 21st International Workshop on Thermal Investigations of ICs and …, 2015
Zahteve: UK Engineering and Physical Sciences Research Council
A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications
P Rajaguru, JA Ortiz-Gonzalez, H Lu, C Bailey, O Alatise
IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (6 …, 2017
Zahteve: UK Engineering and Physical Sciences Research Council
Electro-thermal modelling of multichip power modules for high power converter application
M Shahjalal, H Lu, C Bailey
2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017
Zahteve: UK Engineering and Physical Sciences Research Council
A review of the computer based simulation of electro-thermal design of power electronics devices
M Shahjalal, H Lu, C Bailey
20th International Workshop on Thermal Investigations of ICs and Systems, 1-6, 2014
Zahteve: UK Engineering and Physical Sciences Research Council
Evaluation of the impact of the physical dimensions and material of the semiconductor chip on the reliability of Sn3. 5Ag solder interconnect in power electronic module: a …
P Rajaguru, H Lu, C Bailey, J Ortiz-Gonzalez, O Alatise
Microelectronics Reliability 68, 77-85, 2017
Zahteve: UK Engineering and Physical Sciences Research Council
Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables
P Rajaguru, H Lu, C Bailey, A Castellazzi, V Pathirana, N Udugampola, ...
Microelectronics Reliability 83, 146-156, 2018
Zahteve: UK Engineering and Physical Sciences Research Council
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