Frank Niklaus

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Soavtorji

Göran StemmeProfessor, Micro and Nanosystems, KTH Royal Institute of Technology, SwedenPreverjeni e-poštni naslov na ee.kth.se
Andreas C FischerPh.D. from KTH Royal Institute of Technology in Stockholm, SwedenPreverjeni e-poštni naslov na ee.kth.se
Kristinn B. GylfasonProfessor, Micro and Nanosystems, KTH Royal Institute of TechnologyPreverjeni e-poštni naslov na kth.se
Niclas RoxhedAssistant Professor, KTH Royal Institute of TechnologyPreverjeni e-poštni naslov na ee.kth.se
Fredrik ForsbergKTH Royal Institute of TechnologyPreverjeni e-poštni naslov na ee.kth.se
Max C. LemmeProfessor, RWTH Aachen University, Germany, Director, AMO GmbHPreverjeni e-poštni naslov na eld.rwth-aachen.de
Simon J. BleikerPhD Student in Micro and Nanosystmes, KTH Royal Institute of TechnologyPreverjeni e-poštni naslov na kth.se
Anderson David SmithAssociate Professor, Chalmers University of TechnologyPreverjeni e-poštni naslov na kth.se
Stephan SchröderSenseairPreverjeni e-poštni naslov na senseair.com
Mikael ÖstlingKTH Royal Institute of TechnologyPreverjeni e-poštni naslov na kth.se
Pierre EdingerPostdoctoral researcher, KTH Royal Institute of TechnologyPreverjeni e-poštni naslov na kth.se
Xuge FanKTH Royal Institute of TechnologyPreverjeni e-poštni naslov na kth.se
Wim BogaertsGhent UniversityPreverjeni e-poštni naslov na ugent.be
Peter VerheyenPreverjeni e-poštni naslov na imec.be
Niels QuackThe University of SydneyPreverjeni e-poštni naslov na sydney.edu.au
Alain Yuji TakabayashiEnlightraPreverjeni e-poštni naslov na enlightra.com
Georg S. DuesbergChair of Sensortechnology , Universität der Bundeswehr, MunichPreverjeni e-poštni naslov na unibw.de
Carlos Errando-HerranzTU DelftPreverjeni e-poštni naslov na tudelft.nl
Anna DelinProfessor of Computational Nanomagnetism, KTH, StockholmPreverjeni e-poštni naslov na kth.se
tommy haraldssonCTO Mercene LabsPreverjeni e-poštni naslov na kth.se

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Frank Niklaus

Professor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, Sweden

Preverjeni e-poštni naslov na kth.se - Domača stran

MEMS NEMS Wafer Bonding Wafer-Level Packaging Micro 3D Printing


Naslov Razvrsti po navedbah Razvrsti po letniku Razvrsti po naslovu	Navedeno Navedeno	Leto
Handbook of Silicon Based MEMS Materials and Technologies M Tilli, T Motooka, VM Airaksinen, S Franssila, M Paulasto-Kröckel, ... Handbook of Silicon Based MEMS Materials and Technologies (Second Edition …, 2015	778*	2015
Adhesive wafer bonding F Niklaus, G Stemme, JQ Lu, RJ Gutmann Journal of applied physics 99 (3), 2006	703	2006
MEMS-based uncooled infrared bolometer arrays: a review F Niklaus, C Vieider, H Jakobsen MEMS/MOEMS technologies and applications III 6836, 125-139, 2008	470*	2008
Electromechanical piezoresistive sensing in suspended graphene membranes AD Smith, F Niklaus, A Paussa, S Vaziri, AC Fischer, M Sterner, ... Nano letters 13 (7), 3237-3242, 2013	451	2013
Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015	364	2015
Integrating MEMS and ICs AC Fischer, F Forsberg, M Lapisa, SJ Bleiker, Stemme, Göran, N Roxhed, ... Microsystems & Nanoengineering 1 (1), 15005, 2015	360	2015
Low-temperature full wafer adhesive bonding F Niklaus, P Enoksson, E Kälvesten, G Stemme Journal of Micromechanics and Microengineering 11 (2), 100, 2001	327	2001
Method of joining components E Kälvesten, G Stemme, F Niklaus US Patent 7,067,345, 2006	267	2006
Sealing of adhesive bonded devices on wafer level J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 110 (1-3), 407-412, 2004	202	2004
Handbook of wafer bonding P Ramm, JJQ Lu, MMV Taklo John Wiley & Sons, 2012	190	2012
Wearable all-solid-state potentiometric microneedle patch for intradermal potassium detection M Parrilla, M Cuartero, S Padrell Sánchez, M Rajabi, N Roxhed, F Niklaus, ... Analytical chemistry 91 (2), 1578-1586, 2018	187	2018
Large-area integration of two-dimensional materials and their heterostructures by wafer bonding A Quellmalz, X Wang, S Sawallich, B Uzlu, M Otto, S Wagner, Z Wang, ... Nature communications 12 (1), 917, 2021	176	2021
Wafer-level heterogeneous integration for MOEMS, MEMS, and NEMS M Lapisa, G Stemme, F Niklaus IEEE Journal of Selected Topics in Quantum Electronics 17 (3), 629-644, 2011	168	2011
Hydrophobic valves of plasma deposited octafluorocyclobutane in DRIE channels H Andersson, W van der Wijngaart, P Griss, F Niklaus, G Stemme Sensors and Actuators B: Chemical 75 (1-2), 136-141, 2001	163	2001
Nanoelectromechanical sensors based on suspended 2D materials MC Lemme, S Wagner, K Lee, X Fan, GJ Verbiest, S Wittmann, S Lukas, ... Research, 2020	157	2020
Piezoresistive properties of suspended graphene membranes under uniaxial and biaxial strain in nanoelectromechanical pressure sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016	154	2016
Selective wafer-level adhesive bonding with benzocyclobutene for fabrication of cavities J Oberhammer, F Niklaus, G Stemme Sensors and Actuators A: Physical 105 (3), 297-304, 2003	144	2003
Low temperature full wafer adhesive bonding of structured wafers F Niklaus, H Andersson, P Enoksson, G Stemme Sensors and Actuators A: Physical 92 (1-3), 235-241, 2001	138	2001
Encyclopedia of sensors CA Grimes, EC Dickey, MV Pishko, RA Marcus (No Title), 2006	132	2006
Performance model for uncooled infrared bolometer arrays and performance predictions of bolometers operating at atmospheric pressure F Niklaus, A Decharat, C Jansson, G Stemme Infrared Physics & Technology 51 (3), 168-177, 2008	117	2008

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