Valerio Re

Valerio Re

Professor of Electronics, University of Bergamo and INFN, Italy
Preverjeni e-poštni naslov na unibg.it
Navedeno v 174939 virih
Microelectronics low-noise electronics semiconductor detectors 3D integration particle physics
Hong-Bo Sun

Hong-Bo Sun

Tsinghua University
Preverjeni e-poštni naslov na tsinghua.edu.cn
Navedeno v 45272 virih
photonic chips 3D integration laser precision manufacturing
Chris Bower

Chris Bower

X Display Company, X-Celeprint, Semprius, RTI International, Bell Labs, UNC - Chapel Hill
Preverjeni e-poštni naslov na xdisplay.com
Navedeno v 21821 virih
3D Integration Advanced Packaging Assembly Technology Nanomaterials Micro-Transfer-Printing
Ratti Lodovico

Ratti Lodovico

Professor of Electronics, University of Pavia and INFN
Preverjeni e-poštni naslov na unipv.it
Navedeno v 11544 virih
Microelectronics low-noise front-end noise radiation tolerance 3D integration
Katsuyuki Sakuma

Katsuyuki Sakuma

Manager, Principal Research Staff Member, IBM Thomas J. Watson Research Center
Preverjeni e-poštni naslov na us.ibm.com
Navedeno v 3553 virih
3D Integration Biomedical engineering System on Package Flip Chip Bonding
Andreas C Fischer

Andreas C Fischer

Ph.D. from KTH Royal Institute of Technology in Stockholm, Sweden
Preverjeni e-poštni naslov na ee.kth.se
Navedeno v 3200 virih
MEMS 3D integration 3D packaging 2-photon polymerization Additive Manufacturing
Wen-Sheng Zhao (赵文生)

Wen-Sheng Zhao (赵文生)

Hangzhou Dianzi University
Preverjeni e-poštni naslov na hdu.edu.cn
Navedeno v 3046 virih
Device modeling Multiphysics simulation Signal integrity 3D integration
Xiaoyu Sun

Xiaoyu Sun

TSMC
Preverjeni e-poštni naslov na tsmc.com
Navedeno v 3039 virih
AI Hardware Accelerator Computer Architecture 3D Integration Memory Technology
Zhe Cheng

Zhe Cheng

Peking University
Preverjeni e-poštni naslov na pku.edu.cn
Navedeno v 2917 virih
Thermal Management Microelectronics 3D Integration Interfaces
Ana Rusu

Ana Rusu

Professor of Electronic Circuits and Systems, KTH Royal Institute of Technology, EECS …
Preverjeni e-poštni naslov na kth.se
Navedeno v 2860 virih
energy-efficient circuits and systems energy harvesting emerging technologies 3D integration
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