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Zhenan BaoStanford UniversityEmail confirmado em stanford.edu- Stefan C. B. MannsfeldTechnische Universität DresdenEmail confirmado em tu-dresden.de
- Fengjiao ZhangSchool of Chemical Sciences, University of Chinese Academy of SciencesEmail confirmado em ucas.ac.cn
- Jianguo MeiRichard and Judith Wien Professor of Chemistry, Purdue UniversityEmail confirmado em Purdue.edu
- Ge QuUniversity of Illinois Urbana ChampaignEmail confirmado em illinois.edu
- Bijal PatelAssociate Researcher, National Institute of Standards and Technology (NIST)Email confirmado em nist.gov
- Julia ReinspachStanford UniversityEmail confirmado em stanford.edu
- Erfan MohammadiFlexible Electronics Engineer and Material Scientist at AppleEmail confirmado em apple.com
- Yan ZhouStanford UniversityEmail confirmado em stanford.edu
- Prapti KafleMerck & Co.Email confirmado em merck.com
- T. Alan HattonMassachusetts Institute of TechnologyEmail confirmado em mit.edu
- Allan S MyersonProfessor of the Practice of Chemical Engineering ,Massachusetts Institute of TechnologyEmail confirmado em mit.edu
- Gaurav GiriUniversity of VirginiaEmail confirmado em virginia.edu
- Wen-Ya LeeAssociate Professor, Chemical Engineering & Biotechnology, National Taipei University of TechnologyEmail confirmado em mail.ntut.edu.tw
- Hyunjoong ChungUniversity of Illinois at Urbana ChampaignEmail confirmado em illinois.edu
- Daniel DaviesUniversity of IllinoisEmail confirmado em mediacombb.net
- Kyung Sun ParkPostdoctoral scholar of chemical and biomolecular engineering, University of Illinois at UrbanaEmail confirmado em illinois.edu
- Michael F ToneyUniversity of Colorado BoulderEmail confirmado em colorado.edu
- Yves GeertsUniversité Libre de Bruxelles (ULB)Email confirmado em ulb.ac.be
- Leo ShawStanford UniversityEmail confirmado em stanford.edu
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Ying Diao
Chemical and Biomolecular Engineering, University of Illinois at Urbana-Champaign
Email confirmado em illinois.edu - Página inicial