| Development of high-temperature solders G Zeng, S McDonald, K Nogita Microelectronics Reliability 52 (7), 1306-1322, 2012 | 332 | 2012 |
| A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates G Zeng, S Xue, L Zhang, L Gao, W Dai, J Luo Journal of Materials Science: Materials in Electronics 21, 421-440, 2010 | 202 | 2010 |
| Effect of alloying elements on properties and microstructures of SnAgCu solders L Gao, S Xue, L Zhang, Z Sheng, F Ji, W Dai, S Yu, G Zeng Microelectronic Engineering 87 (11), 2025-2034, 2010 | 184 | 2010 |
| Understanding the Origin of Li2MnO3 Activation in Li‐Rich Cathode Materials for Lithium‐Ion Batteries D Ye, G Zeng, K Nogita, K Ozawa, M Hankel, DJ Searles, L Wang Advanced Functional Materials 25 (48), 7488-7496, 2015 | 174 | 2015 |
| Development of Sn–Zn lead-free solders bearing alloying elements L Zhang, S Xue, L Gao, Z Sheng, H Ye, Z Xiao, G Zeng, Y Chen, S Yu Journal of Materials Science: Materials in Electronics 21, 1-15, 2010 | 163 | 2010 |
| The influence of Ni and Zn additions on microstructure and phase transformations in Sn–0.7 Cu/Cu solder joints G Zeng, SD McDonald, Q Gu, Y Terada, K Uesugi, H Yasuda, K Nogita Acta Materialia 83, 357-371, 2015 | 159 | 2015 |
| Interface reaction between SnAgCu/SnAgCuCe solders and Cu substrate subjected to thermal cycling and isothermal aging L Zhang, SB Xue, G Zeng, LL Gao, H Ye Journal of Alloys and Compounds 510 (1), 38-45, 2012 | 151 | 2012 |
| Effects of rare earths on properties and microstructures of lead-free solder alloys L Zhang, S Xue, L Gao, G Zeng, Z Sheng, Y Chen, S Yu Journal of Materials Science: Materials in Electronics 20, 685-694, 2009 | 121 | 2009 |
| Electrochemical and Structural Study of Layered P2‐Type Na2/3Ni1/3Mn2/3O2 as Cathode Material for Sodium‐Ion Battery Y Wen, B Wang, G Zeng, K Nogita, D Ye, L Wang Chemistry–An Asian Journal 10 (3), 661-666, 2015 | 117 | 2015 |
| Recent advances on Sn–Cu solders with alloying elements G Zeng, S Xue, L Zhang, L Gao Journal of Materials Science: Materials in Electronics 22, 565-578, 2011 | 91 | 2011 |
| Effects of trace rare earth Nd addition on microstructure and properties of SnAgCu solder L Gao, S Xue, L Zhang, Z Sheng, G Zeng, F Ji Journal of Materials Science: Materials in Electronics 21, 643-648, 2010 | 85 | 2010 |
| Anisotropic thermal expansion of Ni3Sn4, Ag3Sn, Cu3Sn, Cu6Sn5 and βSn JW Xian, G Zeng, SA Belyakov, Q Gu, K Nogita, CM Gourlay Intermetallics 91, 50-64, 2017 | 73 | 2017 |
| Nucleation and growth crystallography of Al8Mn5 on B2-Al (Mn,Fe) in AZ91 magnesium alloys G Zeng, JW Xian, CM Gourlay Acta Materialia 153, 364-376, 2018 | 71 | 2018 |
| Effects of trace amount addition of rare earth on properties and microstructure of Sn–Ag–Cu alloys L Zhang, S Xue, L Gao, Y Chen, S Yu, Z Sheng, G Zeng Journal of Materials Science: Materials in Electronics 20, 1193-1199, 2009 | 66 | 2009 |
| Kinetics of the polymorphic phase transformation of Cu6Sn5 G Zeng, SD McDonald, JJ Read, Q Gu, K Nogita Acta Materialia 69, 135-148, 2014 | 58 | 2014 |
| Phase stability and thermal expansion behavior of Cu6Sn5 intermetallics doped with Zn, Au and In G Zeng, SD McDonald, Q Gu, S Suenaga, Y Zhang, J Chen, K Nogita Intermetallics 43, 85-98, 2013 | 58 | 2013 |
| AlSi2Sc2 intermetallic formation in Al-7Si-0.3 Mg-xSc alloys and their effects on as-cast properties P Pandee, CM Gourlay, SA Belyakov, U Patakham, G Zeng, ... Journal of Alloys and Compounds 731, 1159-1170, 2018 | 50 | 2018 |
| Effect of praseodymium on the microstructure and properties of Sn3. 8Ag0. 7Cu solder L Gao, S Xue, L Zhang, Z Xiao, W Dai, F Ji, H Ye, G Zeng Journal of Materials Science: Materials in Electronics 21, 910-916, 2010 | 47 | 2010 |
| Interfacial microstructure and properties of Sn–0.7 Cu–0.05 Ni/Cu solder joint with rare earth Nd addition G Zeng, S Xue, L Gao, L Zhang, Y Hu, Z Lai Journal of Alloys and Compounds 509 (25), 7152-7161, 2011 | 45 | 2011 |
| The influence of ageing on the stabilisation of interfacial (Cu,Ni)6(Sn, Zn)5 and (Cu,Au,Ni)6Sn5 intermetallics in Pb-free Ball Grid Array (BGA) solder joints G Zeng, SD McDonald, D Mu, Y Terada, H Yasuda, Q Gu, MAAM Salleh, ... Journal of Alloys and Compounds 685, 471–482, 2016 | 42 | 2016 |
Kazuhiro NogitaProfessor of Materials Engineering, The University of QueenslandEmail confirmado em uq.edu.au