| Signal integrity design for high-speed digital circuits: Progress and directions J Fan, X Ye, J Kim, B Archambeault, A Orlandi IEEE Transactions on Electromagnetic Compatibility 52 (2), 392-400, 2010 | 328 | 2010 |
| Design and analysis of a resonant reactive shield for a wireless power electric vehicle S Kim, HH Park, J Kim, J Kim, S Ahn IEEE Transactions on Microwave theory and techniques 62 (4), 1057-1066, 2014 | 269 | 2014 |
| Analysis and design guide of active EMI filter in a compact package for reduction of common-mode conducted emissions D Shin, S Kim, G Jeong, J Park, J Park, KJ Han, J Kim IEEE Transactions on Electromagnetic Compatibility 57 (4), 660-671, 2015 | 98 | 2015 |
| Electric field coupling technique of wireless power transfer for electric vehicles J Kim, F Bien IEEE 2013 Tencon-Spring, 267-271, 2013 | 92 | 2013 |
| Modeling and measurement of simultaneous switching noise coupling through signal via transition J Park, H Kim, Y Jeong, J Kim, JS Pak, DG Kam, J Kim IEEE Transactions on Advanced Packaging 29 (3), 548-559, 2006 | 90 | 2006 |
| Physics-based inductance extraction for via arrays in parallel planes for power distribution network design J Kim, L Ren, J Fan IEEE Transactions on Microwave Theory and Techniques 58 (9), 2434-2447, 2010 | 84 | 2010 |
| Analysis of noise coupling from a power distribution network to signal traces in high-speed multilayer printed circuit boards J Kim, MD Rotaru, S Baek, J Park, MK Iyer, J Kim IEEE Transactions on Electromagnetic Compatibility 48 (2), 319-330, 2006 | 77 | 2006 |
| Improved target impedance and IC transient current measurement for power distribution network design J Kim, S Wu, H Wang, Y Takita, H Takeuchi, K Araki, G Feng, J Fan 2010 IEEE International Symposium on Electromagnetic Compatibility, 445-450, 2010 | 72 | 2010 |
| Effects on signal integrity and radiated emission by split reference plane on high-speed multilayer printed circuit boards J Kim, H Lee, J Kim IEEE Transactions on Advanced Packaging 28 (4), 724-735, 2005 | 65 | 2005 |
| Quantified design guidelines of a compact transformerless active EMI filter for performance, stability, and high voltage immunity D Shin, S Jeong, J Kim IEEE Transactions on Power Electronics 33 (8), 6723-6737, 2017 | 61 | 2017 |
| A 60nm 6Gb/s/pin GDDR5 graphics DRAM with multifaceted clocking and ISI/SSN-reduction techniques SJ Bae, YS Sohn, KI Park, KH Kim, DH Chung, JG Kim, SH Kim, MS Park, ... 2008 IEEE International Solid-State Circuits Conference-Digest of Technical …, 2008 | 61 | 2008 |
| Equivalent circuit model for power bus design in multi-layer PCBs with via arrays J Kim, K Shringarpure, J Fan, J Kim, JL Drewniak IEEE Microwave and Wireless Components Letters 21 (2), 62-64, 2011 | 58 | 2011 |
| Analytical transfer functions relating power and ground voltage fluctuations to jitter at a single-ended full-swing buffer C Hwang, J Kim, B Achkir, J Fan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (1 …, 2012 | 50 | 2012 |
| Closed-form expressions for the maximum transient noise voltage caused by an IC switching current on a power distribution network J Kim, L Li, S Wu, H Wang, Y Takita, H Takeuchi, K Araki, J Fan, ... IEEE Transactions on Electromagnetic Compatibility 54 (5), 1112-1124, 2012 | 50 | 2012 |
| Formulation and network model reduction for analysis of the power distribution network in a production-level multilayered printed circuit board K Shringarpure, S Pan, J Kim, J Fan, B Achkir, B Archambeault, ... IEEE Transactions on Electromagnetic Compatibility 58 (3), 849-858, 2016 | 45 | 2016 |
| AC-coupling phase interpolator and delay-locked loop using the same JG Kim, KII Park, SJ Bae, SH Kim, DH Chung US Patent 8,004,328, 2011 | 43 | 2011 |
| Improved target impedance for power distribution network design with power traces based on rigorous transient analysis in a handheld device J Kim, Y Takita, K Araki, J Fan IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (9 …, 2013 | 42 | 2013 |
| A transformer-isolated common-mode active EMI filter without additional components on power lines S Jeong, D Shin, J Kim IEEE Transactions on Power Electronics 34 (3), 2244-2257, 2018 | 41 | 2018 |
| Frequency-dependent via inductances for accurate power distribution network modeling L Ren, J Kim, G Feng, B Archambeault, JL Knighten, J Drewniak, J Fan 2009 IEEE International Symposium on Electromagnetic Compatibility, 63-68, 2009 | 39 | 2009 |
| An equivalent three-dipole model for IC radiated emissions based on TEM cell measurements S Pan, J Kim, S Kim, J Park, H Oh, J Fan 2010 IEEE International Symposium on Electromagnetic Compatibility, 652-656, 2010 | 36 | 2010 |