Artigos com autorizações de acesso público - Fang LuoSaiba mais
49 artigos não disponíveis publicamente
A survey of active EMI filters for conducted EMI noise reduction in power electronic converters
B Narayanasamy, F Luo
IEEE Transactions on Electromagnetic Compatibility 61 (6), 2040-2049, 2019
Autorizações: US National Science Foundation
Design and evaluation of laminated busbar for three-level T-type NPC power electronics building block with enhanced dynamic current sharing
Z Yuan, H Peng, A Deshpande, B Narayanasamy, AI Emon, F Luo, ...
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 395-406, 2019
Autorizações: US National Science Foundation
A review of advanced thermal management solutions and the implications for integration in high-voltage packages
AC Iradukunda, DR Huitink, F Luo
IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 256-271, 2019
Autorizações: US Department of Defense
Flexible PCB-based 3-D integrated SiC half-bridge power module with three-sided cooling using ultralow inductive hybrid packaging structure
C Chen, Z Huang, L Chen, Y Tan, Y Kang, F Luo
IEEE Transactions on Power Electronics 34 (6), 5579-5593, 2018
Autorizações: National Natural Science Foundation of China
A review of high-speed GaN power modules: state of the art, challenges, and solutions
AI Emon, AB Mirza, J Kaplun, SS Vala, F Luo
IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (3 …, 2022
Autorizações: US National Science Foundation
On the practical design of a high power density SiC single-phase uninterrupted power supply system
C Chen, Y Chen, Y Tan, J Fang, F Luo, Y Kang
IEEE Transactions on Industrial Informatics 13 (5), 2704-2716, 2017
Autorizações: National Natural Science Foundation of China
Design and evaluation of a 150 kva sic mosfet based three level tnpc phase-leg pebb for aircraft motor driving application
Z Yuan, A Deshpande, B Narayanasamy, H Peng, AI Emon, R Whitt, ...
2019 IEEE Energy Conversion Congress and Exposition (ECCE), 6569-6574, 2019
Autorizações: US National Science Foundation
Thermal and electrical performance in high-voltage power modules with nonmetallic additively manufactured impingement coolers
R Whitt, D Huitink, A Emon, A Deshpande, F Luo
IEEE transactions on power electronics 36 (3), 3192-3199, 2020
Autorizações: US National Science Foundation
A novel low inductive 3D SiC power module based on hybrid packaging and integration method
Z Huang, Y Li, L Chen, Y Tan, C Chen, Y Kang, F Luo
2017 IEEE Energy Conversion Congress and Exposition (ECCE), 3995-4002, 2017
Autorizações: National Natural Science Foundation of China
Overview of wide/ultrawide bandgap power semiconductor devices for distributed energy resources
SK Mazumder, LF Voss, KM Dowling, A Conway, D Hall, RJ Kaplar, ...
IEEE Journal of Emerging and Selected Topics in Power Electronics 11 (4 …, 2023
Autorizações: US Department of Energy
Cognitive insights into metaheuristic digital twin based health monitoring of dc-dc converters
AB Mirza, K Choksi, SS Vala, KM Radha, MS Chinthavali, F Luo
2022 24th European Conference on Power Electronics and Applications (EPE'22 …, 2022
Autorizações: US National Science Foundation, US Department of Energy
Design and optimization of gate driver integrated multichip 3-D GaN power module
AI Emon, H Carlton, J Harris, A Krone, MU Hassan, AB Mirza, M Hossain, ...
IEEE Transactions on Transportation Electrification 8 (4), 4391-4407, 2022
Autorizações: US National Science Foundation
Investigation of power converter's near field EMI containment using passive filters
AI Emon, B Narayansamy, H Peng, Z Yuan, F Luo
2020 IEEE international symposium on electromagnetic compatibility & signal …, 2020
Autorizações: US National Science Foundation
Heat transfer and pressure drop performance of additively manufactured polymer heat spreaders for low-weight directed cooling integration in power electronics
R Whitt, B Nafis, D Huitink, Z Yuan, A Deshpande, B Narayanasamy, ...
2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2019
Autorizações: US National Science Foundation
High power density 1700-V/300-A Si-IGBT and SiC-MOSFET hybrid switch-based half-bridge power module
A Deshpande, A Imran, R Paul, Z Yuan, H Peng, F Luo
2020 IEEE Energy Conversion Congress and Exposition (ECCE), 3979-3986, 2020
Autorizações: US National Science Foundation
Vertically stacked, flip-chip wide bandgap MOSFET co-optimized for reliability and switching performance
M Montazeri, DR Huitink, A Wallace, H Peng, S Seal, F Luo, HA Mantooth
IEEE Journal of Emerging and Selected Topics in Power Electronics 9 (4 …, 2020
Autorizações: US National Science Foundation
Influence of wire-bonding layout on reliability in IGBT module
L Han, L Liang, W Xin, F Luo
2020 22nd European Conference on Power Electronics and Applications (EPE'20 …, 2020
Autorizações: National Natural Science Foundation of China
Hardware design and implementation of a 75 kva 3-d integrated intelligent power stage
AB Mirza, AI Emon, K Choksi, SS Vala, F Luo, RK Moorthy, ...
2023 IEEE Applied Power Electronics Conference and Exposition (APEC), 977-983, 2023
Autorizações: US National Science Foundation, US Department of Energy
Concurrent thermal and electrical property effects of nano-enhanced phase change material for high-voltage electronics applications
AC Iradukunda, J Kasitz, H Carlton, D Huitink, A Deshpande, F Luo
Journal of Electronic Packaging 142 (3), 031109, 2020
Autorizações: US National Science Foundation, US Department of Defense
EMI propagation path modeling of 3-level t-type NPC power module with stacked DBC enabled EMI shielding
AI Emon, MU Hassan, AB Mirza, Z Yuan, F Luo
2021 IEEE Energy Conversion Congress and Exposition (ECCE), 5233-5239, 2021
Autorizações: US National Science Foundation
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