| Stretchable optical waveguides J Missinne, S Kalathimekkad, B Van Hoe, E Bosman, J Vanfleteren, ... Optics Express 22 (4), 4168-4179, 2014 | 118 | 2014 |
| UTCP: A novel polyimide-based ultra-thin chip packaging technology W Christiaens, E Bosman, J Vanfleteren IEEE transactions on components and packaging technologies 33 (4), 754-760, 2010 | 93 | 2010 |
| Laser ablation of parallel optical interconnect waveguides G Van Steenberge, N Hendrickx, E Bosman, J Van Erps, H Thienpont, ... IEEE Photonics Technology Letters 18 (9), 1106-1108, 2006 | 84 | 2006 |
| Highly reliable flexible active optical links E Bosman, G Van Steenberge, B Van Hoe, J Missinne, J Vanfleteren, ... IEEE Photonics Technology Letters 22 (5), 287-289, 2010 | 60 | 2010 |
| Flexible shear sensor based on embedded optoelectronic components J Missinne, E Bosman, B Van Hoe, G Van Steenberge, S Kalathimekkad, ... IEEE Photonics Technology Letters 23 (12), 771-773, 2011 | 59 | 2011 |
| Comparison of epoxy-and siloxane-based single-mode optical waveguides defined by direct-write lithography A Elmogi, E Bosman, J Missinne, G Van Steenberge Optical Materials 52, 26-31, 2016 | 55 | 2016 |
| Ultrathin optoelectronic device packaging in flexible carriers E Bosman, J Missinne, B Van Hoe, G Van Steenberge, S Kalathimekkad, ... IEEE Journal of selected topics in quantum electronics 17 (3), 617-628, 2011 | 53 | 2011 |
| Optical tactile sensors G Van Steenberge, E Bosman, H Thienpont US Patent 8,567,257, 2013 | 49 | 2013 |
| Fabrication processes for embedding thin chips in flat flexible substrates J Govaerts, W Christiaens, E Bosman, J Vanfleteren IEEE transactions on Advanced Packaging 32 (1), 77-83, 2009 | 49 | 2009 |
| Ultra small integrated optical fiber sensing system B Van Hoe, G Lee, E Bosman, J Missinne, S Kalathimekkad, O Maskery, ... Sensors 12 (9), 12052-12069, 2012 | 43 | 2012 |
| Embedded flexible optical shear sensor J Missinne, E Bosman, B Van Hoe, G Van Steenberge, P Van Daele, ... SENSORS, 2010 IEEE, 987-990, 2010 | 42 | 2010 |
| Embedded micromirror inserts for optical printed circuit boards N Hendrickx, J Van Erps, E Bosman, C Debaes, H Thienpont, ... IEEE Photonics Technology Letters 20 (20), 1727-1729, 2008 | 39 | 2008 |
| Two axis optoelectronic tactile shear stress sensor J Missinne, E Bosman, B Van Hoe, R Verplancke, G Van Steenberge, ... Sensors and Actuators A: Physical 186, 63-68, 2012 | 26 | 2012 |
| Ultra-thin chip technology and applications A Dietzel, J van den Brand, J Vanfleteren, W Christiaens, E Bosman, ... edited by JN Burghartz (Springer Verlag, New York, 2011), 141-157, 2011 | 21 | 2011 |
| Fine-pitch capabilities of the flat ultra-thin chip packaging (UTCP) technology J Govaerts, E Bosman, W Christiaens, J Vanfleteren IEEE transactions on Advanced Packaging 33 (1), 72-78, 2009 | 19 | 2009 |
| UTCP: 60 µm thick bendable package W Christiaens, B Vandevelde, E Bosman, J Vanfleteren 3rd International Wafer-Level Packaging Conference (IWLPC 2006), 114-119, 2006 | 16 | 2006 |
| Ultra thin optical tactile shear sensor J Missinne, E Bosman, B Van Hoe, R Verplancke, G Van Steenberge, ... Procedia Engineering 25, 1393-1396, 2011 | 15 | 2011 |
| System-in-foil technology A Dietzel, J van den Brand, J Vanfleteren, W Christiaens, E Bosman, ... Ultra-thin chip technology and applications, 141-157, 2010 | 13 | 2010 |
| Optical shear sensor and method of producing such an optical shear sensor G Van Steenberge, J Missinne, E Bosman, B Van Hoe US Patent 8,780,335, 2014 | 11 | 2014 |
| Fully flexible optoelectronic foil E Bosman, G Van Steenberge, I Milenkov, K Panajotov, H Thienpont, ... IEEE Journal of selected topics in quantum electronics 16 (5), 1355-1362, 2010 | 11 | 2010 |
