Hong Liang

Hong Liang

Texas A&M University
E-mail confirmado em tamu.edu
Citado por 10816
materials tribology CMP interface bio-nanofabrication
Taesung Kim

Taesung Kim

Sungkyunkwan University
E-mail confirmado em skku.edu
Citado por 6399
Plasma 2D material CMP Aerosol Thermal engineering
Michael Y. Hu

Michael Y. Hu

Argonne national lab.
E-mail confirmado em anl.gov
Citado por 6086
Phonon X-rays CMP
Kenneth M Davis

Kenneth M Davis

Cree
Citado por 5729
Glass LEDs Microelectronics Technology Development & Transfer CMP
Ara Philipossian

Ara Philipossian

professor of chemical engineering
E-mail confirmado em email.arizona.edu
Citado por 4450
cmp
Stan Tsai

Stan Tsai

EMD Electronic
E-mail confirmado em EMDgroup.com
Citado por 3726
CMP Semiconductor processing CMP consumables
Jin-Goo Park

Jin-Goo Park

Professor of Materials Engineering, Hanyang University
E-mail confirmado em hanyang.ac.kr
Citado por 3431
CMP Cleaning Bio-MEMS
Eric Turner

Eric Turner

Fujifilm Electronic Materials
E-mail confirmado em fujifilm.com
Citado por 3256
OLED CMP
Paul B Fischer

Paul B Fischer

Intel Corporation
E-mail confirmado em intel.com
Citado por 2971
Monolithic 3D integration CMP backside power wafer bonding semiconductor processing
Michael Sung

Michael Sung

HKUST
Citado por 2958
wearable computing smart hardware carbon material innovation computer architecture CMP
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