| A rapid photopatterning method for selective plating of 2D and 3D microcircuitry on polyetherimide J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ... Advanced Functional Materials 28 (6), 1704451, 2018 | 51 | 2018 |
| A rapid technique for the direct metallization of PDMS substrates for flexible and stretchable electronics applications A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ... Microelectronic Engineering 209, 35-40, 2019 | 34 | 2019 |
| Selective Metallization of 3D Printable Thermoplastic Polyurethanes A Ryspayeva, TDA Jones, SR Khan, MN Esfahani, MP Shuttleworth, ... IEEE Access 7, 104947-104955, 2019 | 29 | 2019 |
| Copper electroplating of PCB interconnects using megasonic acoustic streaming TDA Jones, A Bernassau, D Flynn, D Price, M Beadel, MPY Desmulliez Ultrasonics sonochemistry 42, 434-444, 2018 | 27 | 2018 |
| Selective electroless copper deposition by using photolithographic polymer/Ag nanocomposite A Ryspayeva, TDA Jones, MN Esfahani, MP Shuttleworth, RA Harris, ... IEEE Transactions on Electron Devices 66 (4), 1843-1848, 2019 | 26 | 2019 |
| Direct metallisation of polyetherimide substrates by activation with different metals TDA Jones, A Ryspayeva, MN Esfahani, MP Shuttleworth, RA Harris, ... Surface and Coatings Technology 360, 285-296, 2019 | 25 | 2019 |
| Electroplating for high aspect ratio vias in PCB manufacturing: enhancement capabilities of acoustic streaming N Strusevich, MPY Desmulliez, E Abraham, D Flynn, T Jones, M Patel, ... Advances in Manufacturing 1 (3), 211-217, 2013 | 17 | 2013 |
| PEI/Ag as an optical gas nano-sensor for intelligent food packaging A Rvspayeva, TDA Jones, PA Hughes, MN Esfahani, MP Shuttleworth, ... 2018 IEEE 18th International Conference on Nanotechnology (IEEE-NANO), 1-4, 2018 | 13 | 2018 |
| A highly compact packaging concept for ultrasound transducer arrays embedded in neurosurgical needles G Schiavone, T Jones, D Price, R McPhillips, Y Jiang, Z Qiu, C Meggs, ... Microsystem Technologies 23 (9), 3881-3891, 2017 | 13 | 2017 |
| Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs TDA Jones, A Bernassau, D Flynn, D Price, M Beadel, MPY Desmulliez Ultrasonics, 106111, 2020 | 11 | 2020 |
| Hybrid additive manufacture of conformal antennas MRN Esfahani, MP Shuttleworth, RA Harris, RW Kay, V Doychinov, ... 2018 IEEE MTT-S International Microwave Workshop Series on Advanced …, 2018 | 9 | 2018 |
| Morphology and acoustic artefacts of copper deposits electroplated using megasonic assisted agitation TDA Jones, D Flynn, MPY Desmulliez, D Price, M Beadel, N Strusevich, ... Circuit World, 2016 | 9 | 2016 |
| Spinach-based photo-catalyst for selective plating on polyimide-based substrates for micro-patterning circuitry J Marques-Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ... Chemical Engineering Research and Design 153, 839-848, 2020 | 6 | 2020 |
| Advanced electrical array interconnections for ultrasound probes integrated in surgical needles G Schiavone, T Jones, D Price, R McPhillips, Z Qiu, CEM Demore, ... 2014 IEEE 16th electronics packaging technology conference (EPTC), 88-93, 2014 | 4 | 2014 |
| A new digitally driven process for the fabrication of integrated flex-rigid electronics MP Shuttleworth, MN Esfahani, J Marques-Hueso, TDA Jones, ... Proceedings of the 29th Annual International Solid Freeform Fabrication …, 2018 | 2 | 2018 |
| MACFEST: Benchmarking a new solder-able finish for the PCB industry T Jones Journal of the Institute of Circuit Technology 10 (1), 13-19, 2017 | 2 | 2017 |
| Megasound acoustic surface treatment process in the Printed Circuit Board industry TDA Jones, D Flynn, MPY Desmulliez 2016 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS …, 2016 | 2 | 2016 |
| Flexible Electronics: A Rapid Photopatterning Method for Selective Plating of 2D and 3D Microcircuitry on Polyetherimide (Adv. Funct. Mater. 6/2018) J Marques‐Hueso, TDA Jones, DE Watson, A Ryspayeva, MN Esfahani, ... Advanced Functional Materials 28 (6), 1870041, 2018 | | 2018 |
| 31: Direct metallisation method onto 3-D printed polyetherimide substrates TDA Jones, MA Ryspayeva, MN Esfahani, R Harris, RW Kay, ... | | 2018 |
| Enhanced electrodeposition for the filling of micro-vias TDA Jones Heriot-Watt University, 2017 | | 2017 |