| Resistive graphene humidity sensors with rapid and direct electrical readout AD Smith, K Elgammal, F Niklaus, A Delin, AC Fischer, S Vaziri, ... Nanoscale 7 (45), 19099-19109, 2015 | 364 | 2015 |
| Piezoresistive Properties of Suspended Graphene Membranes under Uniaxial and Biaxial Strain in Nanoelectromechanical Pressure Sensors AD Smith, F Niklaus, A Paussa, S Schröder, AC Fischer, M Sterner, ... ACS nano 10 (11), 9879-9886, 2016 | 154 | 2016 |
| Graphene ribbons with suspended masses as transducers in ultra-small nanoelectromechanical accelerometers X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, H Rödjegård, ... Nature Electronics 2 (9), 394-404, 2019 | 111 | 2019 |
| Graphene-based CO 2 sensing and its cross-sensitivity with humidity AD Smith, K Elgammal, X Fan, MC Lemme, A Delin, M Råsander, ... RSC advances 7 (36), 22329-22339, 2017 | 98 | 2017 |
| Manufacture and characterization of graphene membranes with suspended silicon proof masses for MEMS and NEMS applications X Fan, AD Smith, F Forsberg, S Wagner, S Schröder, SSA Akbari, ... Microsystems & Nanoengineering 6 (1), 17, 2020 | 75 | 2020 |
| Suspended graphene membranes with attached silicon proof masses as piezoresistive nanoelectromechanical systems accelerometers X Fan, F Forsberg, AD Smith, S Schröder, S Wagner, M Östling, ... Nano letters 19 (10), 6788-6799, 2019 | 62 | 2019 |
| Adhesive wafer bonding with ultra-thin intermediate polymer layers SJ Bleiker, V Dubois, S Schröder, G Stemme, F Niklaus Sensors and Actuators A: Physical 260, 16-23, 2017 | 27 | 2017 |
| Stress-minimized packaging of inertial sensors by double-sided bond wire attachment S Schröder, F Niklaus, A Nafari, ER Westby, AC Fischer, G Stemme, ... Journal of Microelectromechanical systems 24 (4), 781-789, 2015 | 24 | 2015 |
| A 500° C active down-conversion mixer in silicon carbide bipolar technology MW Hussain, H Elahipanah, JE Zumbro, S Schröder, S Rodriguez, ... IEEE Electron Device Letters 39 (6), 855-858, 2018 | 17 | 2018 |
| Wafer-level integration of NiTi shape memory alloy wires for the fabrication of microactuators using standard wire bonding technology AC Fischer, H Gradin, S Braun, S Schröder, G Stemme, F Niklaus 2011 IEEE 24th international conference on micro electro mechanical systems …, 2011 | 17 | 2011 |
| Compact non-dispersive infrared multi-gas sensing platform for large scale deployment with sub-ppm resolution B Wastine, C Hummelgård, M Bryzgalov, H Rödjegård, H Martin, ... Atmosphere 13 (11), 1789, 2022 | 16 | 2022 |
| Biaxial strain in suspended graphene membranes for piezoresistive sensing AD Smith, F Niklaus, S Vaziri, AC Fischer, M Sterner, F Forsberg, ... 2014 IEEE 27th international conference on micro electro mechanical systems …, 2014 | 12 | 2014 |
| Very high aspect ratio through silicon vias (TSVs) using wire bonding S Schröder, AC Fischer, G Stemme, F Niklaus 2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013 | 11 | 2013 |
| Wire-bonder-assisted integration of non-bondable SMA wires into MEMS substrates AC Fischer, H Gradin, S Schröder, S Braun, G Stemme, ... Journal of Micromechanics and Microengineering 22 (5), 055025, 2012 | 11 | 2012 |
| Stress-minimized packaging of inertial sensors using wire bonding S Schröder, A Nafari, K Persson, E Westby, AC Fischer, G Stemme, ... 2013 Transducers & Eurosensors XXVII: The 17th International Conference on …, 2013 | 9 | 2013 |
| An intermediate frequency amplifier for high-temperature applications MW Hussain, H Elahipanah, S Schröder, S Rodriguez, BG Malm, ... IEEE Transactions on Electron Devices 65 (4), 1411-1418, 2018 | 8 | 2018 |
| A large-area single-filament infrared emitter and its application in a spectroscopic ethanol gas sensing system S Schröder, FO Briano, H Rödjegård, M Bryzgalov, J Orelund, ... Microsystems & Nanoengineering 7 (1), 87, 2021 | 7 | 2021 |
| Temporary wafer bonding and debonding for 3D integration using an electrochemically active polymer adhesive HK Gatty, S Schröder, F Niklaus, N Roxhed, G Stemme ECS Journal of Solid State Science and Technology 3 (5), P115, 2014 | 7 | 2014 |
| A single wire large-area filament emitter for spectroscopic ethanol gas sensing fabricated using a wire bonding tool S Schröder, H Rödjegård, G Stemme, F Niklaus 2017 19th International Conference on Solid-State Sensors, Actuators and …, 2017 | 5 | 2017 |
| Fabrication of an infrared emitter using a generic integration platform based on wire bonding S Schröder, H Rödjegård, AC Fischer, G Stemme, F Niklaus Journal of Micromechanics and Microengineering 26 (11), 115010, 2016 | 5 | 2016 |
Frank NiklausProfessor of Micro and Nanosystems at KTH Royal Institute of Technology, Stockholm, SwedenZweryfikowany adres z kth.se