| Thermal Design and Constraints for Heterogeneous Integrated Chip Stacks and Isolation Technology Using Air Gap and Thermal Bridge Y Zhang, Y Zhang, M Bakir Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014 | 66 | 2014 |
| Embedded cooling technologies for densely integrated electronic systems T Sarvey, Y Zhang, L Zheng, P Thadesar, R Gutala, C Cheungm, ... Custom Integrated Circuits Conference (CICC), 1 - 8, 2015 | 47 | 2015 |
| Monolithic integration of a micropin-fin heat sink in a 28-nm FPGA TE Sarvey, Y Zhang, C Cheung, R Gutala, A Rahman, A Dasu, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 …, 2017 | 38 | 2017 |
| Thermal and electrical effects of staggered micropin-fin dimensions for cooling of 3D microsystems TE Sarvey, Y Zhang, Y Zhang, H Oh, MS Bakir IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in …, 2014 | 34 | 2014 |
| Benchmarking digital die-to-die channels in 2.5-D and 3-D heterogeneous integration platforms Y Zhang, X Zhang, MS Bakir IEEE Transactions on Electron Devices 65 (12), 5460-5467, 2018 | 25 | 2018 |
| Thermal evaluation of 2.5-D integration using bridge-chip technology: Challenges and opportunities Y Zhang, TE Sarvey, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (7 …, 2017 | 25 | 2017 |
| A silicon interposer platform utilizing microfluidic cooling for high-performance computing systems L Zheng, Y Zhang, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 5 …, 2015 | 22 | 2015 |
| Power delivery network modeling and benchmarking for emerging heterogeneous integration technologies Y Zhang, MO Hossen, MS Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 9 (9 …, 2019 | 20 | 2019 |
| Full-Chip Power Supply Noise Time-Domain Numerical Modeling and Analysis for Single and Stacked ICs L Zheng, Y Zhang, MS Bakir Electron Devices, IEEE Transactions on 63 (3), 1225-1231, 2016 | 20 | 2016 |
| Thermal Isolation Using Air Gap and Mechanically Flexible Interconnects for Heterogeneous 3-D ICs Y Zhang, Y Zhang, T Sarvey, C Zhang, M Zia, M Bakir IEEE 6 (1), 31-39, 2016 | 16 | 2016 |
| Silicon interposer with embedded microfluidic cooling for high-performance computing systems L Zheng, Y Zhang, X Zhang, MS Bakir 2015 IEEE Electronic Components and Technology Conference (ECTC), 828 - 832, 2015 | 14 | 2015 |
| Thermal Challenges for Heterogeneous 3D ICs and Opportunities for Air Gap Thermal Isolation Y Zhang, TE Sarvey, MS Bakir 3D Systems Integration Conference, 2014 | 14 | 2014 |
| Integrated Thermal and Power Delivery Network Co-Simulation Framework for Single-Die and Multi-Die Assemblies Y Zhang, M Bakir IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (3 …, 2017 | 13 | 2017 |
| Power Delivery Network Benchmarking for Interposer and Bridge-Chip-Based 2.5-D Integration Y Zhang, MO Hossen, MS Bakir IEEE Electron Device Letters 39 (1), 99-102, 2017 | 11 | 2017 |
| TSVs embedded in a microfluidic heat sink: High-frequency characterization and thermal modeling H Oh, Y Zhang, TE Sarvey, GS May, B Muhannad S. 2016 IEEE 20th Workshop on Signal and Power Integrity (SPI), 2016 | 8 | 2016 |
| A Simulation Tool for Rapid Investigation of Trends in 3-DIC Performance and Power Consumption W Wahby, L Zheng, Y Zhang, MS Bakir Components, Packaging and Manufacturing Technology, IEEE Transactions on 6 …, 2016 | 7 | 2016 |
| Electrical and photonic off-chip interconnection and system integration M Zia, C Wan, Y Zhang, M Bakir Optical Interconnects for Data Centers, 265 - 286, 2016 | 6 | 2016 |
| Thermal-power delivery network co-analysis for multi-die integration MO Hossen, Y Zhang, MS Bakir 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging …, 2018 | 5 | 2018 |
| Heterogeneous multi-die stitching: Technology demonstration and design considerations PK Jo, MO Hossen, X Zhang, Y Zhang, MS Bakir 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 1512-1518, 2018 | 5 | 2018 |
| Design considerations for 2.5-D and 3-D integration accounting for thermal constraints Y Zhang, X Zhang, W Wahby, MS Bakir 3D Systems Integration Conference (3DIC), 2016 IEEE International, 1-5, 2016 | 4 | 2016 |
Thomas SarveyECE Graduate Student, Georgia Institute of TechnolgyZweryfikowany adres z gatech.edu