| An oversampling method for wafer map defect pattern classification considering small and imbalanced data ES Kim, SH Choi, DH Lee, KJ Kim, YM Bae, YC Oh Computers & Industrial Engineering 162, 107767, 2021 | 20 | 2021 |
| Detecting abnormal behavior of automatic test equipment using autoencoder with event log data YM Bae, YG Kim, JW Seo, HA Kim, CH Shin, JH Son, GH Lee, KJ Kim Computers & Industrial Engineering 183, 109547, 2023 | 9 | 2023 |
| Approach to derive golden paths based on machine sequence patterns in multistage manufacturing process CH Lee, DH Lee, YM Bae, SH Choi, KH Kim, KJ Kim Journal of Intelligent Manufacturing 33, 167-183, 2022 | 9 | 2022 |
| A case study on the establishment of upper control limit to detect vessel's main engine failures using multivariate control chart YM Bae, MJ Kim, KJ Kim, CH Jun, SS Byeon, KM Park Journal of the Society of Naval Architects of Korea 55 (6), 505-513, 2018 | 9 | 2018 |
| Determining golden process routes in semiconductor manufacturing process for yield management CH Lee, DH Lee, YM Bae, KJ Kim 2017 IEEE International Conference on Industrial Engineering and Engineering …, 2017 | 5 | 2017 |
| Development of a spatial dimension-based taxonomy for classifying the defect patterns in a wafer bin map SH Choi, DH Lee, ES Kim, YM Bae, YC Oh, KJ Kim Advanced Engineering Informatics 60, 102540, 2024 | 2 | 2024 |
| BPIC 2017: Business process mining–A Loan process application D Jeong, J Lim, Y Bae Seventh International Business Process Intelligence Challenge (BPIC’17), 2017 | 2 | 2017 |
| Development of a suspiciousness measure with reduced redundancy for screening machine sets in serial-parallel multistage manufacturing processes SH Choi, DH Lee, YM Bae, KJ Kim Expert Systems with Applications 269, 126480, 2025 | | 2025 |
| Using statistical models for optimal packaging in semiconductor manufacturing processes D Kim, H Kim, Y Kim, M Chae, YM Ko, YM Bae, H Sim, YC Oh, KH Noh Journal of the Korean Statistical Society 54 (1), 1-19, 2025 | | 2025 |
| Set Response Surface Methodology and its Application in Solving the Wrinkle and Crack Problem in the Auto Industry Y He, X Ma, Y Tian, Z He, X Zhang, KJ Kim, YM Bae IEEE Transactions on Reliability, 2024 | | 2024 |
| Manufacturing method of semiconductor package YC Oh, HJ Kang, YM Bae US Patent App. 17/979,316, 2023 | | 2023 |
| Development of taxonomy for classifying defect patterns on wafer bin map using Bin2Vec and clustering methods DH Lee, ES Kim, SH Choi, YM Bae, JB Park, YC Oh, KJ Kim Computers in Industry 152, 104005, 2023 | | 2023 |
| 칩 간 공간적 유사성과 검사항목의 상관관계를 고려한 반도체 웨이퍼 테스트 데이터의 결측치 대체 방법 개발 김주영， 배영목， 최승현， 김광재 Journal of the Korean Institute of Industrial Engineers-Vol 49 (3), 276-283, 2023 | | 2023 |
Kwang-Jae KimProfessor of Industrial and Management EngineeringZweryfikowany adres z postech.ac.kr