| The role of elastic and plastic anisotropy of Sn in recrystallization and damage evolution during thermal cycling in SAC305 solder joints TR Bieler, B Zhou, L Blair, A Zamiri, P Darbandi, F Pourboghrat, TK Lee, ... Journal of Electronic Materials 41, 283-301, 2012 | 133 | 2012 |
| Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy TK Lee, B Zhou, L Blair, KC Liu, TR Bieler Journal of electronic materials, 1-10, 2010 | 87 | 2010 |
| Crack Development in a Low-Stress PBGA Package due to Continuous Recrystallization Leading to Formation of Orientations with [001] Parallel to the Interface B Zhou, TR Bieler, T Lee, KC Liu Journal of electronic materials, 1-11, 2010 | 72 | 2010 |
| Methodology for Analyzing Slip Behavior in Ball Grid Array Lead-Free Solder Joints After Simple Shear B Zhou, TR Bieler, TK Lee, KC Liu Journal of electronic materials 38 (12), 2702-2711, 2009 | 67 | 2009 |
| Multiscale modeling of the anisotropic transient creep response of heterogeneous single crystal SnAgCu solder S Mukherjee, B Zhou, A Dasgupta, TR Bieler international Journal of Plasticity 78, 1-25, 2016 | 59 | 2016 |
| Slip, crystal orientation, and damage evolution during thermal cycling in high-strain wafer-level chip-scale packages B Zhou, Q Zhou, TR Bieler, T Lee Journal of Electronic Materials 44, 895-908, 2015 | 46 | 2015 |
| J. Electron. Mater. TK Lee, B Zhou, T Bieler, KC Liu J. Electron. Mater 34 (1), 1-11, 2005 | 42 | 2005 |
| Characterization of recrystallization and microstructure evolution in lead-free solder joints using EBSD and 3D-XRD B Zhou, TR Bieler, TK Lee, W Liu Journal of electronic materials 42, 319-331, 2013 | 38 | 2013 |
| Microstructural evolution of SAC305 solder joints in wafer level chip-scale packaging (WLCSP) with continuous and interrupted accelerated thermal cycling Q Zhou, B Zhou, TK Lee, T Bieler Journal of electronic materials 45, 3013-3024, 2016 | 29 | 2016 |
| Impact of isothermal aging and Sn grain orientation on the long-term reliability of wafer-level chip-scale package Sn–Ag–Cu solder interconnects TK Lee, B Zhou, TR Bieler IEEE Transactions on Components, Packaging and Manufacturing Technology 2 (3 …, 2012 | 28 | 2012 |
| Impact of Microstructure Evolution and Isothermal Aging on Sn-Ag-Cu Solder Interconnect Board-Level High-G Mechanical Shock Performance and Crack Propagation TK Lee, B Zhou, T Bieler, KC Liu Journal of Electronic Materials, 1-10, 2011 | 27 | 2011 |
| Microstructure and Sn crystal orientation evolution in Sn-3.5 Ag lead-free solders in high-temperature packaging applications B Zhou, G Muralidharan, K Kurumadalli, CM Parish, S Leslie, TR Bieler Journal of electronic materials 43, 57-68, 2014 | 25 | 2014 |
| Correlation Between Sn Grain Orientation and Corrosion in Sn-Ag-Cu Solder Interconnects TK Lee, B Liu, B Zhou, T Bieler, KC Liu Journal of Electronic Materials, 1-8, 2011 | 22 | 2011 |
| Impact of isothermal aging on long-term reliability of fine-pitch ball grid array packages with Sn-Ag-Cu solder interconnects: die size effects TK Lee, W Xie, B Zhou, T Bieler, KC Liu Journal of electronic materials 40, 1967-1976, 2011 | 20 | 2011 |
| The role of Pd in Sn-Ag-Cu solder interconnect mechanical shock performance TK Lee, B Zhou, TR Bieler, CF Tseng, JG Duh Journal of electronic materials 42, 215-223, 2013 | 17 | 2013 |
| The role of elastic and plastic anisotropy of Sn on microstructure and damage evolution in lead-free solder joints TR Bieler, B Zhou, L Blair, A Zamiri, P Darbandi, F Pourboghrat, TK Lee, ... 2011 International Reliability Physics Symposium, 5F. 1.1-5F. 1.9, 2011 | 16 | 2011 |
| Multiscale modeling of the effect of micro-alloying Mn and Sb on the viscoplastic response of SAC105 solder S Mukherjee, A Dasgupta, B Zhou, TR Bieler Journal of electronic materials 43, 1119-1130, 2014 | 14 | 2014 |
| Mechanistic modeling of the anisotropic steady state creep response of SnAgCu single crystal S Mukherjee, B Zhou, A Dasgupta, TR Bieler International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 12 | 2015 |
| In Situ Synchrotron Characterization of Melting, Dissolution, and Resolidification in Lead-Free Solders B Zhou, TR Bieler, G Wu, S Zaefferer, TK Lee, KC Liu Journal of Electronic Materials, 1-11, 0 | 11 | |
| Solder joint height impact on temperature cycle reliability of BGA components with thermal enabling load Y Ge, J Cook, M Pei, M Vujosevic, B Zhou, S Nad 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 684-689, 2014 | 3 | 2014 |
