Abhijit Dasgupta

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Ed HabtourThe University of WashingtonVerifisert e-postadresse på uw.edu
Subhasis MukherjeeIC Packaging, AppleVerifisert e-postadresse på apple.com
Gayatri CuddalorepattaPostdoctoral AssociateVerifisert e-postadresse på seas.harvard.edu
Jingshi MengUniversity of Maryland, College ParkVerifisert e-postadresse på umd.edu
Joseph VargheseGoogleVerifisert e-postadresse på google.com
Daniel FarleyAnsys Germany GmbHVerifisert e-postadresse på ansys.com
Daniel P. ColeU.S. Army Research OfficeVerifisert e-postadresse på mail.mil
Koustav SinhaMicron Technology, Inc.Verifisert e-postadresse på micron.com
Bongtae HanProfessor of Mechanical Engineering, University of MarylandVerifisert e-postadresse på umd.edu
Bite Zhou, Ph.D.Failure Analysis R&D Engineer, Intel CorporationVerifisert e-postadresse på intel.com
Thomas R. BielerMichigan State UniversityVerifisert e-postadresse på egr.msu.edu
John W. EvansNASAVerifisert e-postadresse på ieee.org
Majed A. MajeedAssociate Professor, Mechanical Engineering Dept., Kuwait UniversityVerifisert e-postadresse på ku.edu.kw
Samuel StantonUS Air Force AcademyVerifisert e-postadresse på afacademy.af.edu
Preeti ChauhanGoogle CorporationVerifisert e-postadresse på intel.com
Craig HillmanDfR SolutionsVerifisert e-postadresse på dfrsolutions.com
Elisabeth SmelaDepartment of Mechanical Engineering, University of MarylandVerifisert e-postadresse på umd.edu
Ricky ValentinUniversity of Puerto RicoVerifisert e-postadresse på upr.edu
Bavani BalakrisnanCorning Research & DevelopmentVerifisert e-postadresse på terpalum.umd.edu
Santiago SolaresThe Catholic University of AmericaVerifisert e-postadresse på cua.edu

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Abhijit Dasgupta

Professor of Mechanical Engineering, University of Maryland

Verifisert e-postadresse på umd.edu

Mechanics of Materials micromechanics nanomechanics reliability of electronic materials accelerated stress testing


Tittel Sorter etter sitater Sorter etter år Sorter etter tittel	Sitert av Sitert av	År
Solder creep-fatigue analysis by an energy-partitioning approach A Dasgupta, C Oyan, D Barker, M Pecht	301	1992
Material failure mechanisms and damage models A Dasgupta, M Pecht IEEE Transactions on Reliability 40 (5), 531-536, 1991	287	1991
Physics-of-failure: an approach to reliable product development M Pecht, A Dasgupta Journal of the IES 38 (5), 30-34, 1995	257	1995
Three-dimensional modeling of woven-fabric composites for effective thermo-mechanical and thermal properties A Dasgupta, RK Agarwal, SM Bhandarkar Composites science and technology 56 (3), 209-223, 1996	252	1996
Orthotropic thermal conductivity of plain-weave fabric composites using a homogenization technique A Dasgupta, RK Agarwal Journal of composite materials 26 (18), 2736-2758, 1992	205	1992
Ultrasound-mediated drug delivery to the brain: principles, progress and prospects A Dasgupta, M Liu, T Ojha, G Storm, F Kiessling, T Lammers Drug Discovery Today: Technologies 20, 41-48, 2016	177	2016
Role of failure-mechanism identification in accelerated testing J Hu, D Barker, A Dasgupta, A Arora Journal of the IES 36 (4), 39-45, 1993	148	1993
Fibrosis imaging: current concepts and future directions M Baues, A Dasgupta, J Ehling, J Prakash, P Boor, F Tacke, F Kiessling, ... Advanced drug delivery reviews 121, 9-26, 2017	146	2017
A fundamental overview of accelerated testing analytical models H Caruso, A Dasgupta Journal of the IEST 41 (1), 16-20, 1998	126	1998
Failure-mechanism models for creep and creep rupture J Li, A Dasgupta IEEE Transactions on Reliability 42 (3), 339-353, 1993	118	1993
Viscoplastic constitutive properties and energy-partitioning model of lead-free Sn3. 9Ag0. 6Cu solder alloy Q Zhang, A Dasgupta, P Haswell 53rd Electronic Components and Technology Conference, 2003. Proceedings …, 2003	115	2003
The reliability physics approach to failure prediction modelling M Pecht, A Dasgupta, D Barker, CT Leonard Quality and Reliability Engineering International 6 (4), 267-273, 1990	108	1990
Quality conformance and qualification of microelectronic packages and interconnects MG Pecht, A Dasgupta, JW Evans, JY Evans John Wiley & Sons, 1994	107	1994
Combined vibrational and thermal solder joint fatigue—A generalized strain versus life approach D Barker, J Vodzak, A Dasgupta, M Pecht	105	1990
PWB solder joint life calculations under thermal and vibrational loading D Barker, A Dasgupta, M Peeht Journal of the IES 35 (1), 17-25, 1992	103	1992
Large-scale model test on square box culvert backfilled with sand A Dasgupta, B Sengupta Journal of Geotechnical Engineering 117 (1), 156-161, 1991	98	1991
Systematic study on thermo-mechanical durability of Pb-free assemblies: Experiments and FE analysis Q Zhang, A Dasgupta, D Nelson, H Pallavicini	88	2005
PBCA-based polymeric microbubbles for molecular imaging and drug delivery P Koczera, L Appold, Y Shi, M Liu, A Dasgupta, V Pathak, T Ojha, ... Journal of controlled release 259, 128-135, 2017	87	2017
Effective thermomechanical behavior of plain-weave fabric-reinforced composites using homogenization theory A Dasgupta, SM Bhandarkar	87	1994
Mechanistic model for the stress-strain response of double-layered PSA H Huang, A Dasgupta 2018 19th International Conference on Thermal, Mechanical and Multi-Physics …, 2018	85	2018

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