Artikler med mandater om offentlig tilgang - Shane OhLes mer
Ikke tilgjengelige noe sted: 3
Multi-Chiplet Implementation of a Replaceable Integrated Chiplet (PINCH) Assembly
MAN Calderon, S Oh, JR Brescia, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024
Mandater: US National Science Foundation, US Department of Defense
Reconstituted-sio2 tier with integrated copper heat spreader
A Victor, M Manley, S Oh, MS Bakir
2023 IEEE 73rd Electronic Components and Technology Conference (ECTC), 1767-1772, 2023
Mandater: US National Science Foundation, US Department of Defense
Electrical Characterization of Shielded TSVs With Airgap Isolation for RF/mmWave Applications
S Oh, T Zheng, MS Bakir
IEEE Transactions on Components, Packaging and Manufacturing Technology 14 …, 2024
Mandater: US National Science Foundation, US Department of Defense
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