| Coil design and shielding methods for a magnetic resonant wireless power transfer system J Kim, J Kim, S Kong, H Kim, IS Suh, NP Suh, DH Cho, J Kim, S Ahn Proceedings of the IEEE 101 (6), 1332-1342, 2013 | 630 | 2013 |
| High-Frequency Scalable Electrical Model and Analysis of Through Silicon Via (TSV) J Kim, JS Pak, J Cho, E Song, J Cho, H Kim, T Song, J Lee, H Lee, K Park, ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 525 | 2011 |
| Power distribution networks for system-on-package: Status and challenges M Swaminathan, J Kim, I Novak, JP Libous IEEE Transactions on Advanced Packaging 27 (2), 286-300, 2004 | 344 | 2004 |
| Development and evaluation of 3-D SiP with vertically interconnected through silicon vias (TSV) DM Jang, C Ryu, KY Lee, BH Cho, J Kim, TS Oh, WJ Lee, J Yu 2007 proceedings 57th electronic components and technology conference, 847-852, 2007 | 255 | 2007 |
| Coil design and measurements of automotive magnetic resonant wireless charging system for high-efficiency and low magnetic field leakage H Kim, C Song, DH Kim, DH Jung, IM Kim, YI Kim, J Kim, S Ahn, J Kim IEEE Transactions on Microwave Theory and Techniques 64 (2), 383-400, 2016 | 246 | 2016 |
| 3D-MAPS: 3D massively parallel processor with stacked memory SK Lim, SK Lim Design for High Performance, Low Power, and Reliable 3D Integrated Circuits …, 2013 | 225 | 2013 |
| Modeling and Analysis of Through Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring J Cho, E Song, K Yoon, JS Pak, J Kim, W Lee, T Song, K Kim, J Lee, ... Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 199 | 2011 |
| Magnetic field design for high efficient and low EMF wireless power transfer in on-line electric vehicle S Ahn, J Kim Proceedings of the 5th European Conference on Antennas and Propagation …, 2011 | 179 | 2011 |
| Low frequency electromagnetic field reduction techniques for the on-line electric vehicle (OLEV) S Ahn, J Pak, T Song, H Lee, JG Byun, D Kang, CS Choi, E Kim, J Ryu, ... 2010 IEEE International Symposium on Electromagnetic Compatibility, 625-630, 2010 | 165 | 2010 |
| PDN Impedance Modeling and Analysis of a 3D TSV IC by Using a Proposed P/G TSV Array Model based on Separated P/G TSV and Chip-PDN Models JS Pak, J Kim, J Cho, K Kim, T Song, S Ahn, J Lee, H Lee, K Park, J Kim Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 159 | 2011 |
| EMI reduction methods in wireless power transfer system for drone electrical charger using tightly coupled three-phase resonant magnetic field C Song, H Kim, Y Kim, D Kim, S Jeong, Y Cho, S Lee, S Ahn, J Kim IEEE Transactions on Industrial Electronics 65 (9), 6839-6849, 2018 | 143 | 2018 |
| Circuital modeling and measurement of shielding effectiveness against oblique incident plane wave on apertures in multiple sides of rectangular enclosure J Shim, DG Kam, JH Kwon, J Kim IEEE transactions on electromagnetic compatibility 52 (3), 566-577, 2010 | 131 | 2010 |
| Electrical characterization of trough silicon via (TSV) depending on structural and material parameters based on 3D full wave simulation JS Pak, C Ryu, J Kim 2007 International Conference on Electronic Materials and Packaging, 1-6, 2007 | 127 | 2007 |
| Full-chip TSV-to-TSV coupling analysis and optimization in 3D IC C Liu, T Song, J Cho, J Kim, J Kim, SK Lim Proceedings of the 48th Design Automation Conference, 783-788, 2011 | 125 | 2011 |
| Chip-package hierarchical power distribution network modeling and analysis based on a segmentation method J Kim, W Lee, Y Shim, J Shim, K Kim, JS Pak, J Kim IEEE Transactions on advanced packaging 33 (3), 647-659, 2010 | 125 | 2010 |
| High frequency electrical model of through wafer via for 3-D stacked chip packaging C Ryu, J Lee, H Lee, K Lee, T Oh, J Kim 2006 1st Electronic Systemintegration Technology Conference 1, 215-220, 2006 | 111 | 2006 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer K Yoon, G Kim, W Lee, T Song, J Lee, H Lee, K Park, J Kim 2009 11th Electronics Packaging Technology Conference, 702-706, 2009 | 103 | 2009 |
| Smartwatch strap wireless power transfer system with flexible PCB coil and shielding material S Jeong, DH Kim, J Song, H Kim, S Lee, C Song, J Lee, J Song, J Kim IEEE Transactions on Industrial Electronics 66 (5), 4054-4064, 2018 | 90 | 2018 |
| Modeling and measurement of simultaneous switching noise coupling through signal via transition J Park, H Kim, Y Jeong, J Kim, JS Pak, DG Kam, J Kim IEEE Transactions on Advanced Packaging 29 (3), 548-559, 2006 | 90 | 2006 |
| Suppression of leakage magnetic field from a wireless power transfer system using ferrimagnetic material and metallic shielding H Kim, J Cho, S Ahn, J Kim, J Kim 2012 IEEE International Symposium on Electromagnetic Compatibility, 640-645, 2012 | 89 | 2012 |
