| Sn-3.0 Ag-0.5 Cu/Sn-58Bi composite solder joint assembled using a low-temperature reflow process for PoP technology YA Shen, S Zhou, J Li, C Yang, S Huang, S Lin, H Nishikawa Materials & design 183, 108144, 2019 | 84 | 2019 |
| Improvement in the mechanical properties of eutectic Sn58Bi alloy by 0.5 and 1 wt% Zn addition before and after thermal aging S Zhou, O Mokhtari, MG Rafique, VC Shunmugasamy, B Mansoor, ... Journal of Alloys and Compounds 765, 1243-1252, 2018 | 82 | 2018 |
| Effects of Ti addition on the microstructure, mechanical properties and electrical resistivity of eutectic Sn58Bi alloy S Zhou, C Yang, S Lin, AN AlHazaa, O Mokhtari, X Liu, H Nishikawa Materials Science and Engineering: A 744, 560-569, 2019 | 57 | 2019 |
| Thermomigration induced microstructure and property changes in Sn-58Bi solders YA Shen, S Zhou, J Li, KN Tu, H Nishikawa Materials & Design 166, 107619, 2019 | 48 | 2019 |
| The newly developed Sn–Bi–Zn alloy with a low melting point, improved ductility, and high ultimate tensile strength S Zhou, C Yang, YA Shen, S Lin, H Nishikawa Materialia 6, 100300, 2019 | 43 | 2019 |
| The self-healing of Kirkendall voids on the interface between Sn and (1 1 1) oriented nanotwinned Cu under thermal aging S Zhou, YB Zhang, LY Gao, Z Li, ZQ Liu Applied Surface Science 588, 152900, 2022 | 26 | 2022 |
| Improved mechanical properties induced by In and In & Zn double additions to eutectic Sn58Bi alloy S Zhou, YA Shen, T Uresti, VC Shunmugasamy, B Mansoor, H Nishikawa Journal of Materials Science: Materials in Electronics 30, 7423-7434, 2019 | 24 | 2019 |
| Novel polarity effect on intermetallic compound thickness changes during electromigration in Cu/Sn-3.0 Ag-0.5 Cu/Cu solder joints Z Jin, YA Shen, S He, S Zhou, YC Chan, H Nishikawa Journal of Applied Physics 126 (18), 2019 | 21 | 2019 |
| A computational thermodynamics-assisted development of Sn-Bi-In-Ga quaternary alloys as low-temperature Pb-free solders C Yang, S Zhou, S Lin, H Nishikawa Materials 12 (4), 631, 2019 | 21 | 2019 |
| Effect of Zn addition on interfacial reactions between Sn-Bi solder and Cu substrate O Mokhtari, S Zhou, C YC, H Nishikawa Materials Transactions 57 (8), 1272-1276, 2016 | 18 | 2016 |
| Preferred orientation of Bi and effect of Sn-Bi microstructure on mechanical and thermomechanical properties in eutectic Sn-Bi alloy YA Shen, S Zhou, H Nishikawa Materialia 6, 100309, 2019 | 17 | 2019 |
| Thermal stability of low-temperature sintered joint using Sn-coated Cu particles during isothermal aging at 250° C X Liu, S Zhou, H Nishikawa Journal of Materials Science: Materials in Electronics 28, 12606-12616, 2017 | 11 | 2017 |
| Effect of Zn addition on interfacial reactions and mechanical properties between eutectic Sn58Bi solder and ENIG substrate S Zhou, S He, H Nishikawa Journal of Nanoscience and Nanotechnology 20 (1), 106-112, 2020 | 10 | 2020 |
| Microstructure and property changes in Cu/Sn-58Bi/Cu solder joints during thermomigration YA Shen, S Zhou, J Li, KN Tu, H Nishikawa 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 2003-2008, 2019 | 5 | 2019 |
| Development of Sn-Bi-In-Ga quaternary low-temperature solders C Yang, S Zhou, S Lin, H Nishikawa 2019 International Conference on Electronics Packaging (ICEP), 367-369, 2019 | 5 | 2019 |
| Microstructure coarsening of high-temperature Sn-Pb solder joint in IGBT modules of high-speed trains SM Xue, S Zhou, X Wang, XH Zeng, ZQ Liu 2022 23rd International Conference on Electronic Packaging Technology (ICEPT …, 2022 | 4 | 2022 |
| Effects of in and Zn double addition on eutectic Sn-58Bi alloy S Zhou, YA Shen, T Uresti, V Shunmugasamy, B Mansoor, H Nishikawa 2019 IEEE 69th Electronic Components and Technology Conference (ECTC), 1081-1086, 2019 | 4 | 2019 |
| The evaluation of mechanical properties of Sn58BiXTi solder by tensile test S Zhou, X Liu, O Mokhtari, H Nishikawa 2017 18th International Conference on Electronic Packaging Technology (ICEPT …, 2017 | 3 | 2017 |
| Excellent Oxidation Resistance and Solder Wettability of (111)-Oriented Nanotwinned Cu Z XU, S ZHOU, X LI, Z LIU Acta Metall Sin 60 (7), 957-967, 2024 | 1 | 2024 |
| Sintering of hollow Ag particle paste on bare Cu substrate for die attachment under a nitrogen atmosphere R Guo, S Zhou, Y Gao, ZQ Liu, R Sun 2022 23rd International Conference on Electronic Packaging Technology (ICEPT …, 2022 | 1 | 2022 |
Yu-An ShenFeng Chia UniversityVerifisert e-postadresse på fcu.edu.tw
