From Diagnosis to Treatment: Recent Advances in Patient-friendly Biosensors and Implantable Devices P Li†, GH Lee†, SY Kim†, SY Kwon, HR Kim, S Park ACS Nano, 2021 | 255 | 2021 |
Rapid meniscus-guided printing of stable semi-solid-state liquid metal microgranular-particle for soft electronics GH Lee, YR Lee, H Kim, DA Kwon, H Kim, C Yang, SQ Choi, S Park, ... Nature Communications 13 (1), 2643, 2022 | 88 | 2022 |
Hetero-Dimensional 2D Ti3C2TX MXene and 1D Graphene Nanoribbon Hybrids for Machine Learning-Assisted Pressure Sensors HJ Lee, JC Yang, J Choi, J Kim, GS Lee, SP Sasikala, GH Lee, SHK Park, ... ACS Nano, 2021 | 79 | 2021 |
A Personalized Electronic Tattoo for Healthcare Realized by On‐the‐spot Assembly of an Intrinsically Conductive and Durable Liquid‐metal‐composite GH Lee, H Woo, C Yoon, C Yang, JY Bae, W Kim, DH Lee, H Kang, S Han, ... Advanced Materials 34, 2204159, 2022 | 70 | 2022 |
Parallel Signal Processing of a Wireless Pressure‐Sensing Platform Combined with Machine‐learning‐based Cognition, Inspired by the Human Somatosensory System GH Lee, JK Park, J Byun, JC Yang, SY Kwon, C Kim, C Jang, JY Sim, ... Advanced Materials 32 (8), 1906269, 2020 | 62 | 2020 |
Deep-learning-based Deconvolution of Mechanical Stimuli with Ti3C2TX MXene Electromagnetic Shield Architecture via Dual-mode Wireless Signal Variation Mechanism GH Lee, GS Lee, J Byun, JC Yang, C Jang, S Kim, H Kim, JK Park, HJ Lee, ... ACS Nano, 2020 | 29 | 2020 |
Conductance stable and mechanically durable bi-layer EGaIn composite-coated stretchable fiber for 1D bioelectronics GH Lee, DH Lee, W Jeon, J Yoon, K Ahn, KS Nam, M Kim, JK Kim, ... Nature Communications 14 (1), 4173, 2023 | 25 | 2023 |
Large-area photo-patterning of initially conductive EGaIn particle-assembled film for soft electronics GH Lee, H Kim, J Lee, JY Bae, C Yang, H Kim, H Kang, SQ Choi, S Park, ... Materials Today 67, 84-94, 2023 | 12 | 2023 |
A Personalized Electronic Tattoo for Healthcare Realized by On‐the‐Spot Assembly of an Intrinsically Conductive and Durable Liquid‐Metal Composite (Adv. Mater. 32/2022) GH Lee, H Woo, C Yoon, C Yang, JY Bae, W Kim, DH Lee, H Kang, S Han, ... Advanced Materials 34 (32), 2270236, 2022 | 5 | 2022 |
Divide and Conquer: Design of Gallium‐Based Liquid Metal Particles for Soft and Stretchable Electronics G Park†, GH Lee†, W Lee†, J Kang, S Park, S Park Advanced Functional Materials, 2309660, 2023 | 2 | 2023 |
Variable Stiffness Electronics by Chemically Sinterable Phase-Change Metal Ink with Versatile Solution Processes S Lee†, GH Lee†, I Kang, W Jeon, S Kim, Y Ahn, CY Kim, DA Kwon, ... | | 2024 |
Liquid metal precursor solution, method for manufacturing metal film using the same, and electronic device including the same S Park, H Kim, G Lee, J Jeong US Patent App. 17/561,373, 2022 | | 2022 |
Photo-Patternable, Large-Area Particle-Packed-Morphology Liquid Metal Film Coated via Solution Shearing for Soft Electronics GH Lee, JW Jeong, S Park MRS Fall Meeting 2021, 2021 | | 2021 |
Photo-patternable, large-area solid-state liquid metal film coated via solution shearing for soft electronics GH Lee, H Kim, J Lee, C Yang, H Kang, S Park, J Kang, Z Bao, JW Jeong, ... | | 2021 |
Wireless Communication: Parallel Signal Processing of a Wireless Pressure‐Sensing Platform Combined with Machine‐Learning‐Based Cognition, Inspired by the Human Somatosensory … GH Lee, JK Park, J Byun, JC Yang, SY Kwon, C Kim, C Jang, JY Sim, ... Advanced Materials 32 (8), 2070055, 2020 | | 2020 |