| Superconformal electrodeposition of copper in 500–90 nm features TP Moffat, JE Bonevich, WH Huber, A Stanishevsky, DR Kelly, GR Stafford, ... Journal of The Electrochemical Society 147 (12), 4524, 2000 | 579 | 2000 |
| Superconformal film growth: Mechanism and quantification TP Moffat, D Wheeler, MD Edelstein, D Josell IBM Journal of Research and Development 49 (1), 19-36, 2005 | 470 | 2005 |
| Superconformal electrodeposition of copper TP Moffat, D Wheeler, WH Huber, D Josell Electrochemical and Solid-State Letters 4 (4), C26, 2001 | 440 | 2001 |
| Electrodeposition of copper in the SPS-PEG-Cl additive system: I. kinetic measurements: Influence of SPS TP Moffat, D Wheeler, D Josell Journal of The Electrochemical Society 151 (4), C262, 2004 | 408 | 2004 |
| Size-dependent resistivity in nanoscale interconnects D Josell, SH Brongersma, Z Tőkei Annual Review of Materials Research 39 (1), 231-254, 2009 | 316 | 2009 |
| Extreme bottom-up superfilling of through-silicon-vias by damascene processing: suppressor disruption, positive feedback and turing patterns TP Moffat, D Josell Journal of The Electrochemical Society 159 (4), D208, 2012 | 235 | 2012 |
| Superconformal electrodeposition in submicron features D Josell, D Wheeler, WH Huber, TP Moffat Physical Review Letters 87 (1), 016102, 2001 | 229 | 2001 |
| A simple equation for predicting superconformal electrodeposition in submicrometer trenches D Josell, D Wheeler, WH Huber, JE Bonevich, TP Moffat Journal of the Electrochemical Society 148 (12), C767, 2001 | 194 | 2001 |
| Seedless superfill: Copper electrodeposition in trenches with ruthenium barriers D Josell, D Wheeler, C Witt, TP Moffat Electrochemical and solid-state letters 6 (10), C143, 2003 | 193 | 2003 |
| Curvature enhanced adsorbate coverage mechanism for bottom-up superfilling and bump control in damascene processing TP Moffat, D Wheeler, SK Kim, D Josell Electrochimica Acta 53 (1), 145-154, 2007 | 182 | 2007 |
| Modeling superconformal electrodeposition using the level set method D Wheeler, D Josell, TP Moffat Journal of The Electrochemical Society 150 (5), C302, 2003 | 179 | 2003 |
| Curvature enhanced adsorbate coverage model for electrodeposition TP Moffat, D Wheeler, SK Kim, D Josell Journal of the Electrochemical Society 153 (2), C127, 2006 | 178 | 2006 |
| Electrodeposition of Cu in the PEI-PEG-Cl-SPS additive system: reduction of overfill bump formation during superfilling SK Kim, D Josell, TP Moffat Journal of The Electrochemical Society 153 (9), C616, 2006 | 166 | 2006 |
| Electrodeposition of Cu on Ru barrier layers for damascene processing TP Moffat, M Walker, PJ Chen, JE Bonevich, WF Egelhoff, L Richter, C Witt, ... Journal of the Electrochemical Society 153 (1), C37, 2005 | 165 | 2005 |
| A new method for tensile testing of thin films JA Ruud, D Josell, F Spaepen, AL Greer Journal of Materials Research 8, 112-117, 1993 | 152 | 1993 |
| Modeling extreme bottom-up filling of through silicon vias D Josell, D Wheeler, TP Moffat Journal of the Electrochemical Society 159 (10), D570, 2012 | 119 | 2012 |
| Cationic surfactants for the control of overfill bumps in Cu superfilling SK Kim, D Josell, TP Moffat Journal of The Electrochemical Society 153 (12), C826, 2006 | 119 | 2006 |
| Stability in thin film multilayers and microlaminates: the role of free energy, structure, and orientation at interfaces and grain boundaries AC Lewis, D Josell, TP Weihs Scripta Materialia 48 (8), 1079-1085, 2003 | 118 | 2003 |
| The formation of fcc titanium in titanium-aluminum multilayers D Van Heerden, D Josell, D Shechtman Acta materialia 44 (1), 297-306, 1996 | 99 | 1996 |
| Via filling by electrodeposition: Superconformal silver and copper and conformal nickel D Josell, B Baker, C Witt, D Wheeler, TP Moffat Journal of the Electrochemical Society 149 (12), C637, 2002 | 90 | 2002 |