| A guide to lead-free solders: physical metallurgy and reliability JW Evans Springer Science & Business Media, 2007 | 119 | 2007 |
| Quality conformance and qualification of microelectronic packages and interconnects MG Pecht, A Dasgupta, JW Evans, JY Evans John Wiley & Sons, 1994 | 107 | 1994 |
| Product integrity and reliability in design JW Evans, JY Evans Springer Science & Business Media, 2001 | 71 | 2001 |
| Characterization of particle morphology and rheological behavior in solder paste J Evans, J Beddow IEEE transactions on components, hybrids, and manufacturing technology 10 (2 …, 1987 | 55 | 1987 |
| Packaging factors affecting the fatigue life of power transistor die bonds J Evans, JY Evans IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1998 | 42 | 1998 |
| Facilitating R&M in spaceflight systems with MBSE M Izygon, H Wagner, S Okon, L Wang, M Sargusingh, J Evans 2016 Annual Reliability and Maintainability Symposium (RAMS), 1-6, 2016 | 40 | 2016 |
| A vision for spaceflight reliability: NASA's objectives based strategy FJ Groen, JW Evans, AJ Hall 2015 Annual Reliability and Maintainability Symposium (RAMS), 1-6, 2015 | 37 | 2015 |
| Simulation of fatigue distributions for ball grid arrays by the Monte Carlo method JW Evans, JY Evans, R Ghaffarian, A Mawer, KT Lee, CH Shin Microelectronics Reliability 40 (7), 1147-1155, 2000 | 35 | 2000 |
| Model based mission assurance: NASA's assurance future J Evans, S Cornford, MS Feather 2016 Annual Reliability and Maintainability Symposium (RAMS), 1-7, 2016 | 33 | 2016 |
| A CubeSat-payload radiation-reliability assurance case using goal structuring notation RA Austin, N Mahadevan, BD Sierawski, G Karsai, AF Witulski, J Evans 2017 Annual Reliability and Maintainability Symposium (RAMS), 1-8, 2017 | 24 | 2017 |
| A framework for reliability modeling of electronics J Evans, P Lall, R Bauernschub Annual Reliability and Maintainability Symposium 1995 Proceedings, 144-151, 1995 | 21 | 1995 |
| Accelerated testing and data analysis JW Evans, KT Lee Product Integrity and Reliability in Design, 312-337, 2001 | 20 | 2001 |
| Failures in electronic assemblies and devices M Pecht, P McCluskey, JY Evans Product Integrity and Reliability in Design, 204-232, 2001 | 19 | 2001 |
| Designing and building-in reliability in advanced microelectronic assemblies and structures JW Evans, JY Evans, BK Yu IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997 | 19 | 1997 |
| Evaluation of elastic modulus and yield strength of Al film using an electrostatically actuated test device SH Lee, JW Evans, YE Pak, JU Jeon, D Kwon Thin Solid Films 408 (1-2), 223-229, 2002 | 18 | 2002 |
| Thermomechanical failures in microelectronic interconnects JW Evans, JY Evans, P Lall, SL Cornford Microelectronics Reliability 38 (4), 523-529, 1998 | 18 | 1998 |
| Towards a framework for reliability and safety analysis of complex space missions JW Evans, F Groen, L Wang, S Okon, R Austin, AF Witulski, N Mahadevan, ... International journal of human factors modelling and simulation 6 (2-3), 203-227, 2018 | 17 | 2018 |
| A physics-of-failure (POF) approach to addressing device reliability in accelerated testing of MCMs J Evans, MJ Cushing, P Lall, R Bauernschub Proceedings of 1995 IEEE Multi-Chip Module Conference (MCMC-95), 14-25, 1995 | 16 | 1995 |
| Electronic materials and properties JY Evans, JW Evans Handbook of Electronic Package Design, 727-789, 2018 | 15 | 2018 |
| Applications of fracture mechanics to quantitative accelerated life testing of plastic encapsulated microelectronics JW Evans, K Sinha Microelectronics Reliability 80, 317-327, 2018 | 13 | 2018 |