| Evaluation and benchmarking of cu pillar micro-bumps with printed polymer core QIU Xing, CC Jeffery, SWR Lee, L Ying-Hong, C Peter 2019 International Conference on Electronics Packaging (ICEP), 24-27, 2019 | 12 | 2019 |
| Wafer level bumping technology for high voltage LED packaging T Wei, X Qiu, JCC Lo, SWR Lee 2015 10th International Microsystems, Packaging, Assembly and Circuits …, 2015 | 11 | 2015 |
| Fabrication and reliability assessment of Cu pillar microbumps with printed polymer cores X Qiu, JCC Lo, Y Cheng, SW Ricky Lee, YJ Tseng, P Chiu Journal of Electronic Packaging 143 (3), 031010, 2021 | 10 | 2021 |
| Packaging of UV LED with a stacked silicon reflector for converged UV emission X Qiu, JCC Lo, SWR Lee 2017 International Conference on Electronics Packaging (ICEP), 259-263, 2017 | 10 | 2017 |
| UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars X Qiu, JCC Lo, Y Cheng, SWR Lee, YJ Tseng, HK Yi, P Chiu Journal of Microelectromechanical Systems, 2020 | 9 | 2020 |
| Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display Y Cheng, JCC Lo, X Qiu, B Shieh, SWR Lee 2020 21st International Conference on Electronic Packaging Technology (ICEPT …, 2020 | 7 | 2020 |
| Investigation of reliability of EMC and SMC on reflectance for UV LED applications X Qiu, JCC Lo, AW Shang, SWR Lee 2016 17th International Conference on Thermal, Mechanical and Multi-Physics …, 2016 | 7 | 2016 |
| An Implantable medical device for transcorneal electrical stimulation: packaging structure, process flow, and toxicology test F Le, JCC Lo, X Qiu, SWR Lee, X Li, CY Tsui, WH Ki IEEE Transactions on Components, Packaging and Manufacturing Technology 6 (8 …, 2016 | 6 | 2016 |
| A bacterial spore model of pulsed electric fields on spore morphology change revealed by simulation and SEM X Qiu, YT Lee, PT Yung 2014 36th Annual International Conference of the IEEE Engineering in …, 2014 | 6 | 2014 |
| A power inductor integration technology using a silicon interposer for DC-DC converter applications Y Ding, X Fang, Y Gao, Y Cai, X Qiu, PKT Mok, SWR Lee, KM Lau, ... 2018 IEEE 30th International Symposium on Power Semiconductor Devices and …, 2018 | 5 | 2018 |
| Implementation and characterisation of a sterilisation module consisting of novel 265 nm UVC LED packages X Qiu, JCC Lo, YJ Cheng, H Xu, QW Xu, RSW Lee HKIE Trans 28, 213-220, 2021 | 4 | 2021 |
| Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays Y Cheng, JCC Lo, X Qiu, SWR Lee 2021 22nd International Conference on Electronic Packaging Technology (ICEPT …, 2021 | 3 | 2021 |
| The simulation study of the influence of surface error on optical properties for optical part TR Liu, X Qiu, H Li, YL Li, C Xu, Y Hu, XQ Zhou Advanced Materials Research 690, 3027-3031, 2013 | 3 | 2013 |
| Quantum dot color conversion film with enhanced color rendering performance Y Cheng, JCC Lo, X Qiu, H Xu, M Tao, SWR Lee 2023 International Conference on Electronics Packaging (ICEP), 135-136, 2023 | 2 | 2023 |
| Solderability and reliability of sintered nano-Ag bond pads of printed re-distribution layer JCC Lo, Q Jiang, X Qiu, N Tu Journal of Electronic Packaging 145 (1), 011103, 2023 | 2 | 2023 |
| A flexible thin-film inductor for high-efficiency wireless power transfer Y Yao, X Qiu, Y Cheng, JCC Lo, SWR Lee, WH Ki, CY Tsui IEEE Electron Device Letters 44 (3), 504-507, 2023 | 2 | 2023 |
| Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL) SWR Lee, JCC Lo, X Qiu, N Tu International Electronic Packaging Technical Conference and Exhibition 85505 …, 2021 | 2 | 2021 |
| Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer Y Cheng, JCC Lo, X Qiu, SWR Lee 2021 International Conference on Electronics Packaging (ICEP), 153-154, 2021 | 2 | 2021 |
| Experimental parametric study on the bumping and coining of gold studs for flip chip bonding R Ren, X Qiu, JCC Lo, SWR Lee 2016 China Semiconductor Technology International Conference (CSTIC), 1-4, 2016 | 2 | 2016 |
| Failures in Soldering Q Zhang, B Kondori, X Qiu, JCC Lo, SWR Lee Analysis and Prevention of Component and Equipment Failures, 326-337, 2021 | 1 | 2021 |
Tiwei WeiAssistant Professor at Purdue University, Postdoc at Stanford University, Ph.D. in IMEC/KU Leuven確認したメール アドレス: stanford.edu