| The effect of chemical composition and heat treatment conditions on stacking fault energy for Fe-Cr-Ni austenitic stainless steel T Yonezawa, K Suzuki, S Ooki, A Hashimoto Metallurgical and Materials Transactions A 44, 5884-5896, 2013 | 135 | 2013 |
| Intramolecular Cyclization of 2,7- or 2,8-Bis-unsaturated Esters Mediated by (η2-Propene)Ti(O-i-Pr)2. Facile Construction of Mono- and Bicyclic Skeletons with … H Urabe, K Suzuki, F Sato Journal of the American Chemical Society 119 (42), 10014-10027, 1997 | 126 | 1997 |
| Lewis Acid-Enhanced Reactivity of. alpha.,. beta.-Unsaturated Esters and Amides toward Radical Addition H Urabe, K Yamashita, K Suzuki, K Kobayashi, F Sato The Journal of Organic Chemistry 60 (12), 3576-3577, 1995 | 116 | 1995 |
| Early stage SCC initiation analysis of fcc Fe–Cr–Ni ternary alloy at 288 C: A quantum chemical molecular dynamics approach NK Das, K Suzuki, K Ogawa, T Shoji Corrosion Science 51 (4), 908-913, 2009 | 90 | 2009 |
| A Novel Tandem Cyclization of 2,7- or 2,8-Bis-Unsaturated Esters Mediated by (η2-Propene)TiX2 (X = Cl or O-i-Pr). A Facile Construction of Bicyclo[3.3.0]octane … K Suzuki, H Urabe, F Sato Journal of the American Chemical Society 118 (36), 8729-8730, 1996 | 76 | 1996 |
| Molecular dynamics simulation of enhanced oxygen ion diffusion in strained yttria-stabilized zirconia K Suzuki, M Kubo, Y Oumi, R Miura, H Takaba, A Fahmi, A Chatterjee, ... Applied physics letters 73 (11), 1502-1504, 1998 | 72 | 1998 |
| Quantum chemical molecular dynamics study of stress corrosion cracking behavior for fcc Fe and Fe–Cr surfaces NK Das, K Suzuki, Y Takeda, K Ogawa, T Shoji Corrosion Science 50 (6), 1701-1706, 2008 | 64 | 2008 |
| Synthesis of CoMoO4@ RGO nanocomposites as high-performance supercapacitor electrodes L Jinlong, Y Meng, K Suzuki, H Miura Microporous and Mesoporous Materials 242, 264-270, 2017 | 50 | 2017 |
| Performance comparison of NiCo2O4 and NiCo2S4 formed on Ni foam for supercapacitor L Jinlong, L Tongxiang, Y Meng, S Ken, M Hideo Composites Part B: Engineering 123, 28-33, 2017 | 48 | 2017 |
| Materials design of perovskite-based oxygen ion conductor by molecular dynamics method Y Yamamura, C Ihara, S Kawasaki, H Sakai, K Suzuki, S Takami, M Kubo, ... Solid State Ionics 160 (1-2), 93-101, 2003 | 41 | 2003 |
| Computational chemistry study on the dynamics of lubricant molecules under shear conditions D Kamei, H Zhou, K Suzuki, K Konno, S Takami, M Kubo, A Miyamoto Tribology International 36 (4-6), 297-303, 2003 | 41 | 2003 |
| Effect of crystallographic quality of grain boundaries on both mechanical and electrical properties of electroplated copper thin film interconnections N Murata, N Saito, K Tamakawa, K Suzuki, H Miura Journal of Electronic Packaging 137 (3), 031001, 2015 | 39 | 2015 |
| Structural properties of LixMn2O4 as investigated by molecular dynamics and density functional theory K Suzuki, Y Oumi, S Takami, M Kubo, A Miyamoto, M Kikuchi, N Yamazaki, ... Japanese Journal of Applied Physics 39 (7S), 4318, 2000 | 39 | 2000 |
| Electronic properties and strain sensitivity of CVD-grown graphene with acetylene M Yang, S Sasaki, M Ohnishi, K Suzuki, H Miura Japanese Journal of Applied Physics 55 (4S), 04EP05, 2016 | 38 | 2016 |
| Fatigue strength of electroplated copper thin films under uni-axial stress N Murata, K Tamakawa, K Suzuki, H Miura Journal of Solid Mechanics and Materials Engineering 3 (3), 498-506, 2009 | 37 | 2009 |
| Fluctuation mechanism of mechanical properties of electroplated-copper thin films used for three dimensional electronic modules H Miura, K Suzuki, K Tamakawa 2007 International Conference on Thermal, Mechanical and Multi-Physics …, 2007 | 35 | 2007 |
| Fabrication of 3D graphene foam for a highly conducting electrode L Jinlong, Y Meng, K Suzuki, H Miura Materials Letters 196, 369-372, 2017 | 34 | 2017 |
| Microscopic analysis of the initiation of high-temperature damage of Ni-Based heat-resistant alloy T Murakoshi, K Suzuki, I Nonaka, H Miura ASME International Mechanical Engineering Congress and Exposition 50633 …, 2016 | 33 | 2016 |
| Improvement of crystallographic quality of electroplated copper thin-film interconnections for through-silicon vias K Suzuki, N Murata, N Saito, R Furuya, O Asai, H Miura Japanese Journal of Applied Physics 52 (4S), 04CB01, 2013 | 33 | 2013 |
| Effect of the crystallinity on the electromigration resistance of electroplated copper thin-film interconnections T Kato, K Suzuki, H Miura Journal of Electronic Packaging 139 (2), 020911, 2017 | 32 | 2017 |
