| Copper Wire Bonding P Chauhan, A Choubey, Z Zhong, M Pecht Springer US, 2013 | 152 | 2013 |
| Copper wire bonding concerns and best practices P Chauhan, ZW Zhong, M Pecht Journal of Electronic Materials 42, 2415-2434, 2013 | 84 | 2013 |
| Critical review of the Engelmaier model for solder joint creep fatigue reliability P Chauhan, M Osterman, SWR Lee, M Pecht IEEE Transactions on Components and Packaging Technologies 32 (3), 693-700, 2009 | 70 | 2009 |
| Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder—A Micromechanics Approach P Chauhan, S Mukherjee, M Osterman, A Dasgupta, M Pecht Proceedings of International Technical Conference and Exhibition on …, 2013 | 35 | 2013 |
| Mechanistic prediction of the effect of microstructural coarsening on creep response of SnAgCu solder joints S Mukherjee, P Chauhan, M Osterman, A Dasgupta, M Pecht Journal of Electronic Materials 45, 3712-3725, 2016 | 21 | 2016 |
| In Situ Interconnect Failure Prediction Using Canaries P Chauhan, S Mathew, M Osterman, M Pecht IEEE Transactions on Device and Materials Reliability 14 (3), 826-832, 2014 | 20 | 2014 |
| Copper wire bonding MG Pecht, PS Chauhan, Z Zhong Springer, 2014 | 9 | 2014 |
| Canary Approach for Monitoring BGA Interconnect Reliability under Temperature Cycling P Chauhan, M Osterman, M Pecht Society for Mechanical Failures Prevention Technology Prognostics and Health …, 2012 | 8 | 2012 |
| Energy release rate for interlaminar cracks in graded laminates U Jagan, PS Chauhan, V Parameswaran Composites science and technology 68 (6), 1480-1488, 2008 | 7 | 2008 |
| Use of temperature as a health monitoring tool for solder interconnect degradation in electronics P Chauhan, M Osterman, M Pecht, Q Yu Proceedings of the IEEE 2012 Prognostics and System Health Management …, 2012 | 6 | 2012 |
| Effect of Temperature Cycling Parameters on the Durability of Pb-Free Solders M Osterman, P Chauhan Proceedings of 42nd International Symposium on Microelectronics, 2009 | 6 | 2009 |
| Impact of thermal aging on the growth of Cu-Sn intermetallic compounds in Pb-free solder joints in 2512 resistors P Chauhan, M Osterman, M Pecht ASME International Mechanical Engineering Congress and Exposition 43789, 199-210, 2009 | 6 | 2009 |
| Impact of thermal aging on the thermal fatigue durability of Pb-free solder joints P Chauhan, M Mueller, M Osterman, M Pecht 3rd Electronics System Integration Technology Conference ESTC, 1-10, 2010 | 5 | 2010 |
| A Cytocompatible Zinc Oxide Nanocomposite Loaded with an Amphiphilic Arsenal for Alleviation of Staphylococcus Biofilm P Chauhan, P Dey, S Mukherjee, U Manna, G Das, A Ramesh ChemistrySelect 3 (9), 2492-2497, 2018 | 4 | 2018 |
| Fusion prognostics-based qualification of microelectronic devices M Pecht, E George, A Vasan, P Chauhan Proceedings of the 21th International Symposium on the Physical and Failure …, 2014 | 4 | 2014 |
| Microstructural characterization and thermal cycling reliability of solders under isothermal aging and electrical current PS Chauhan University of Maryland, College Park, 2012 | 4 | 2012 |
| Virtual structural testing using fatigue crack growth simulation S Mellings, P Chauhan, R Adey, RG Citarella Proceedings of Royal Aeronautical Society Conference on Virtual Testing, 1-17, 2006 | 3 | 2006 |
| Wire bond pads PS Chauhan, A Choubey, ZW Zhong, MG Pecht, PS Chauhan, ... Copper Wire Bonding, 111-131, 2014 | 2 | 2014 |
| PHM‐Based Qualification of Electronics PS Chauhan Prognostics and Health Management of Electronics: Fundamentals, Machine …, 2018 | 1 | 2018 |
| Bonding Process PS Chauhan, A Choubey, ZW Zhong, MG Pecht, PS Chauhan, ... Copper Wire Bonding, 11-38, 2014 | 1 | 2014 |
Michael G. PechtUniversity of Maryland確認したメール アドレス: umd.edu