| Experimental and computational investigation of vertical downflow condensation H Lee, CR Kharangate, N Mascarenhas, I Park, I Mudawar International Journal of Heat and Mass Transfer 85, 865-879, 2015 | 177 | 2015 |
| Embedded cooling with 3D manifold for vehicle power electronics application: Single-phase thermal-fluid performance KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, ... International Journal of Heat and Mass Transfer 130, 1108-1119, 2019 | 147 | 2019 |
| Extreme two‐phase cooling from laser‐etched diamond and conformal, template‐fabricated microporous copper JW Palko, H Lee, C Zhang, TJ Dusseault, T Maitra, Y Won, DD Agonafer, ... Advanced Functional Materials 27 (45), 1703265, 2017 | 121 | 2017 |
| Micro-channel evaporator for space applications–1. Experimental pressure drop and heat transfer results for different orientations in earth gravity H Lee, I Park, I Mudawar, MM Hasan International Journal of Heat and Mass Transfer 77, 1213-1230, 2014 | 84 | 2014 |
| Computational modeling of turbulent evaporating falling films CR Kharangate, H Lee, I Mudawar International Journal of Heat and Mass Transfer 81, 52-62, 2015 | 82 | 2015 |
| Thermal modeling of extreme heat flux microchannel coolers for GaN-on-SiC semiconductor devices H Lee, DD Agonafer, Y Won, F Houshmand, C Gorle, M Asheghi, ... Journal of Electronic Packaging 138 (1), 010907, 2016 | 81 | 2016 |
| Experimental and theoretical investigation of annular flow condensation in microgravity H Lee, I Mudawar, MM Hasan International Journal of Heat and Mass Transfer 61, 293-309, 2013 | 73 | 2013 |
| A machine learning approach for predicting heat transfer characteristics in micro-pin fin heat sinks K Kim, H Lee, M Kang, G Lee, K Jung, CR Kharangate, M Asheghi, ... International Journal of Heat and Mass Transfer 194, 123087, 2022 | 57 | 2022 |
| Microchannel cooling strategies for high heat flux (1 kW/cm2) power electronic applications KW Jung, CR Kharangate, H Lee, J Palko, F Zhou, M Asheghi, EM Dede, ... 2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2017 | 53 | 2017 |
| Numerical simulation of advanced monolithic microcooler designs for high heat flux microelectronics S Scholl, C Gorle, F Houshmand, T Liu, H Lee, Y Won, M Asheghi, ... International Electronic Packaging Technical Conference and Exhibition 56895 …, 2015 | 52 | 2015 |
| Flow boiling in microgravity: Part 1–Interfacial behavior and experimental heat transfer results C Konishi, H Lee, I Mudawar, MM Hasan, HK Nahra, NR Hall, JD Wagner, ... International Journal of Heat and Mass Transfer 81, 705-720, 2015 | 50 | 2015 |
| Single-phase thermal and hydraulic performance of embedded silicon micro-pin fin heat sinks using R245fa D Kong, KW Jung, S Jung, D Jung, J Schaadt, M Iyengar, C Malone, ... International Journal of Heat and Mass Transfer 141, 145-155, 2019 | 49 | 2019 |
| High heat flux two-phase cooling of electronics with integrated diamond/porous copper heat sinks and microfluidic coolant supply JW Palko, H Lee, DD Agonafer, C Zhang, KW Jung, J Moss, JD Wilbur, ... 2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical …, 2016 | 48 | 2016 |
| Flow condensation in horizontal tubes H Lee, I Mudawar, MM Hasan International Journal of Heat and Mass Transfer 66, 31-45, 2013 | 47 | 2013 |
| Experimental and computational investigation of vertical upflow condensation in a circular tube CR Kharangate, H Lee, I Park, I Mudawar International Journal of Heat and Mass Transfer 95, 249-263, 2016 | 46 | 2016 |
| A holistic approach to thermal-hydraulic design of 3D manifold microchannel heat sinks for energy-efficient cooling D Kong, Y Kim, M Kang, E Song, Y Hong, HS Kim, KJ Rah, HG Choi, ... Case Studies in Thermal Engineering 28, 101583, 2021 | 45 | 2021 |
| Determination of flow regimes and heat transfer coefficient for condensation in horizontal tubes I Park, H Lee, I Mudawar International Journal of Heat and Mass Transfer 80, 698-716, 2015 | 45 | 2015 |
| Hierarchically structured laser-induced graphene for enhanced boiling on flexible substrates D Kong, M Kang, KY Kim, J Jang, J Cho, JB In, H Lee ACS applied materials & interfaces 12 (33), 37784-37792, 2020 | 44 | 2020 |
| An artificial neural network model for predicting frictional pressure drop in micro-pin fin heat sink H Lee, M Kang, KW Jung, CR Kharangate, S Lee, M Iyengar, C Malone, ... Applied Thermal Engineering 194, 117012, 2021 | 42 | 2021 |
| Flow boiling in microgravity: Part 2–Critical heat flux interfacial behavior, experimental data, and model C Konishi, H Lee, I Mudawar, MM Hasan, HK Nahra, NR Hall, JD Wagner, ... International Journal of Heat and Mass Transfer 81, 721-736, 2015 | 39 | 2015 |
Kenneth E. GoodsonStanford Mechanical Engineering, Davies Provostial Professor確認したメール アドレス: stanford.edu